DE69841449D1 - Sperrschicht-feldeffekttransistor aus silicumcarbid - Google Patents

Sperrschicht-feldeffekttransistor aus silicumcarbid

Info

Publication number
DE69841449D1
DE69841449D1 DE69841449T DE69841449T DE69841449D1 DE 69841449 D1 DE69841449 D1 DE 69841449D1 DE 69841449 T DE69841449 T DE 69841449T DE 69841449 T DE69841449 T DE 69841449T DE 69841449 D1 DE69841449 D1 DE 69841449D1
Authority
DE
Germany
Prior art keywords
silicum
carbide
field effect
effect transistor
barrier field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69841449T
Other languages
English (en)
Inventor
Toshiyuki Oono
Takayuki Iwasaki
Tsutomu Yatsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69841449D1 publication Critical patent/DE69841449D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66053Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
    • H01L29/66068Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395Vertical transistors, e.g. vertical IGBT

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
DE69841449T 1998-03-19 1998-03-19 Sperrschicht-feldeffekttransistor aus silicumcarbid Expired - Lifetime DE69841449D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/001185 WO1999048153A1 (fr) 1998-03-19 1998-03-19 Dispositif de commutation a semi-conducteur au carbure de silicium

Publications (1)

Publication Number Publication Date
DE69841449D1 true DE69841449D1 (de) 2010-03-04

Family

ID=14207836

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69841449T Expired - Lifetime DE69841449D1 (de) 1998-03-19 1998-03-19 Sperrschicht-feldeffekttransistor aus silicumcarbid

Country Status (6)

Country Link
US (1) US6384428B1 (de)
EP (1) EP1065726B1 (de)
KR (1) KR100342798B1 (de)
CN (1) CN1286805A (de)
DE (1) DE69841449D1 (de)
WO (1) WO1999048153A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4360085B2 (ja) * 2002-12-25 2009-11-11 株式会社デンソー 炭化珪素半導体装置
US6747291B1 (en) 2003-01-10 2004-06-08 The United States Of America As Represented By The Secretary Of The Air Force Ohmic contacts on p-type silicon carbide using carbon films
CN1802752A (zh) 2003-11-25 2006-07-12 松下电器产业株式会社 半导体元件
WO2006090432A1 (ja) * 2005-02-22 2006-08-31 Neomax Co., Ltd. SiC単結晶基板の製造方法
JP4775102B2 (ja) 2005-05-09 2011-09-21 住友電気工業株式会社 半導体装置の製造方法
JP4784178B2 (ja) * 2005-07-01 2011-10-05 株式会社日立製作所 半導体装置
JP5068009B2 (ja) * 2005-09-14 2012-11-07 三菱電機株式会社 炭化ケイ素半導体装置
CN101132030B (zh) * 2007-08-24 2011-08-03 中国科学院上海硅酸盐研究所 一种高耐压碳化硅光导开关
WO2011092808A1 (ja) * 2010-01-27 2011-08-04 住友電気工業株式会社 炭化ケイ素半導体装置およびその製造方法
CA2777675A1 (en) 2010-01-19 2011-07-28 Sumitomo Electric Industries, Ltd. Silicon carbide semiconductor device and method of manufacturing thereof
CN102157597A (zh) * 2010-02-11 2011-08-17 中国科学院上海硅酸盐研究所 一种光控碳化硅光电导开关
EP3780114A1 (de) * 2010-12-27 2021-02-17 Sumitomo Electric Industries, Ltd. Siliciumcarbidsubstrat, halbleiterbauelement, verfahren zur herstellung eines siliciumkarbidsubstrats und verfahren zur herstellung eines halbleiterbauelements
JP6278549B2 (ja) * 2012-03-30 2018-02-14 富士電機株式会社 半導体装置
JP2016004955A (ja) * 2014-06-19 2016-01-12 三菱電機株式会社 炭化珪素半導体装置及びその製造方法
CN104737912B (zh) * 2015-03-31 2017-09-15 临沂大学 一种非洲菊组培快繁培养基及其培育方法
JP6745458B2 (ja) * 2015-04-15 2020-08-26 パナソニックIpマネジメント株式会社 半導体素子
US9773924B2 (en) 2015-04-22 2017-09-26 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device having barrier region and edge termination region enclosing barrier region

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289960A (ja) * 1987-05-22 1988-11-28 Fujitsu Ltd 電界効果型半導体装置
JP3267983B2 (ja) * 1991-02-14 2002-03-25 株式会社東芝 半導体発光素子及びその製造方法
JP3146694B2 (ja) 1992-11-12 2001-03-19 富士電機株式会社 炭化けい素mosfetおよび炭化けい素mosfetの製造方法
JP2910573B2 (ja) * 1993-09-10 1999-06-23 株式会社日立製作所 電界効果トランジスタ及びその製造方法
EP0676814B1 (de) * 1994-04-06 2006-03-22 Denso Corporation Herstellungsverfahren für Halbleiterbauelement mit Graben
WO1995034915A1 (en) * 1994-06-13 1995-12-21 Abb Research Ltd. Semiconductor device in silicon carbide
US5736753A (en) * 1994-09-12 1998-04-07 Hitachi, Ltd. Semiconductor device for improved power conversion having a hexagonal-system single-crystal silicon carbide
JP3158973B2 (ja) * 1995-07-20 2001-04-23 富士電機株式会社 炭化けい素縦型fet
FR2738394B1 (fr) * 1995-09-06 1998-06-26 Nippon Denso Co Dispositif a semi-conducteur en carbure de silicium, et son procede de fabrication
JP3471509B2 (ja) * 1996-01-23 2003-12-02 株式会社デンソー 炭化珪素半導体装置
JPH10107263A (ja) * 1996-09-27 1998-04-24 Fuji Electric Co Ltd 絶縁ゲート型炭化ケイ素半導体装置
JPH10125904A (ja) * 1996-10-17 1998-05-15 Denso Corp 炭化珪素半導体装置

Also Published As

Publication number Publication date
KR100342798B1 (ko) 2002-07-03
EP1065726A1 (de) 2001-01-03
KR20010041965A (ko) 2001-05-25
CN1286805A (zh) 2001-03-07
EP1065726B1 (de) 2010-01-13
EP1065726A4 (de) 2006-08-23
WO1999048153A1 (fr) 1999-09-23
US6384428B1 (en) 2002-05-07

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