DE69839136D1 - Verfahren zum Polieren unterschiedlicher leitender Schichten in einer halbleitende Anordnung - Google Patents
Verfahren zum Polieren unterschiedlicher leitender Schichten in einer halbleitende AnordnungInfo
- Publication number
- DE69839136D1 DE69839136D1 DE69839136T DE69839136T DE69839136D1 DE 69839136 D1 DE69839136 D1 DE 69839136D1 DE 69839136 T DE69839136 T DE 69839136T DE 69839136 T DE69839136 T DE 69839136T DE 69839136 D1 DE69839136 D1 DE 69839136D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconducting
- arrangement
- conductive layers
- different conductive
- polishing different
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US822025 | 1997-03-24 | ||
US08/822,025 US6204169B1 (en) | 1997-03-24 | 1997-03-24 | Processing for polishing dissimilar conductive layers in a semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69839136D1 true DE69839136D1 (de) | 2008-04-03 |
DE69839136T2 DE69839136T2 (de) | 2009-02-12 |
Family
ID=25234911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69839136T Expired - Lifetime DE69839136T2 (de) | 1997-03-24 | 1998-03-18 | Verfahren zum Polieren unterschiedlicher leitender Schichten in einer halbleitende Anordnung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6204169B1 (de) |
EP (1) | EP0871214B1 (de) |
JP (1) | JPH10270399A (de) |
KR (1) | KR100476484B1 (de) |
CN (1) | CN1144268C (de) |
DE (1) | DE69839136T2 (de) |
SG (1) | SG79962A1 (de) |
TW (1) | TW379377B (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6609954B1 (en) * | 1998-10-29 | 2003-08-26 | United Microelectronics Corp. | Method of planarization |
US20030087590A1 (en) * | 1998-10-29 | 2003-05-08 | Ming-Sheng Yang | Method of planarization |
JP2000208454A (ja) * | 1999-01-18 | 2000-07-28 | Tokyo Seimitsu Co Ltd | ウエハ研磨装置への研磨剤の供給方法 |
JP3033574B1 (ja) * | 1999-02-15 | 2000-04-17 | 日本電気株式会社 | 研磨方法 |
US6387188B1 (en) * | 1999-03-03 | 2002-05-14 | Speedfam-Ipec Corporation | Pad conditioning for copper-based semiconductor wafers |
US6419554B2 (en) * | 1999-06-24 | 2002-07-16 | Micron Technology, Inc. | Fixed abrasive chemical-mechanical planarization of titanium nitride |
KR100596768B1 (ko) * | 1999-10-22 | 2006-07-04 | 주식회사 하이닉스반도체 | 반도체장치의 화학기계적연마 방법 |
US6592433B2 (en) * | 1999-12-31 | 2003-07-15 | Intel Corporation | Method for defect reduction |
US6653243B2 (en) * | 2000-05-25 | 2003-11-25 | Micron Technology, Inc. | Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates |
JP2002324772A (ja) * | 2001-04-25 | 2002-11-08 | Hitachi Ltd | 半導体装置の製造方法及び製造装置 |
US7008554B2 (en) | 2001-07-13 | 2006-03-07 | Applied Materials, Inc. | Dual reduced agents for barrier removal in chemical mechanical polishing |
JP3639229B2 (ja) * | 2001-07-17 | 2005-04-20 | 松下電器産業株式会社 | 堆積膜の平坦化方法 |
US6638145B2 (en) * | 2001-08-31 | 2003-10-28 | Koninklijke Philips Electronics N.V. | Constant pH polish and scrub |
US6585567B1 (en) | 2001-08-31 | 2003-07-01 | Koninklijke Philips Electronics N.V. | Short CMP polish method |
US6589882B2 (en) * | 2001-10-24 | 2003-07-08 | Micron Technology, Inc. | Copper post-etch cleaning process |
JP2005026538A (ja) * | 2003-07-04 | 2005-01-27 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP2005051076A (ja) * | 2003-07-29 | 2005-02-24 | Trecenti Technologies Inc | 半導体装置の製造方法 |
US20060021974A1 (en) * | 2004-01-29 | 2006-02-02 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US7390744B2 (en) * | 2004-01-29 | 2008-06-24 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US20060169674A1 (en) * | 2005-01-28 | 2006-08-03 | Daxin Mao | Method and composition for polishing a substrate |
US20060196778A1 (en) * | 2005-01-28 | 2006-09-07 | Renhe Jia | Tungsten electroprocessing |
JP2006261261A (ja) * | 2005-03-16 | 2006-09-28 | Renesas Technology Corp | 化学機械研磨装置および化学機械研磨方法 |
US7367343B2 (en) * | 2006-01-23 | 2008-05-06 | Micron Technology, Inc. | Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution |
FR2900587B1 (fr) * | 2006-05-02 | 2008-12-26 | Kemesys | Procede de polissage mecano-chimique (cmp) en continu d'un materiau multicouche |
CN114525512B (zh) * | 2022-01-25 | 2024-06-25 | 深圳市拍档科技有限公司 | 一种可循环使用的钛合金镜面抛光液及其制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3237235C2 (de) | 1982-10-07 | 1986-07-10 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum Polieren von III-V-Halbleiteroberflächen |
NL8701407A (nl) * | 1987-06-17 | 1989-01-16 | Vunderink Ate | Een oppervlakte techniek die het massaal slijpen en polijsten van metalen artikelen in rotofinish apparatuur sneller doet verlopen. |
JPH01133218A (ja) | 1987-11-18 | 1989-05-25 | Showa Alum Corp | 磁気ディスク用アルミニウム基板の製造方法 |
US5352277A (en) | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
JPH02285518A (ja) | 1989-04-27 | 1990-11-22 | Yamaha Corp | 磁気記録ディスク基板の製法 |
US5209816A (en) | 1992-06-04 | 1993-05-11 | Micron Technology, Inc. | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing |
US5340370A (en) * | 1993-11-03 | 1994-08-23 | Intel Corporation | Slurries for chemical mechanical polishing |
US5662769A (en) * | 1995-02-21 | 1997-09-02 | Advanced Micro Devices, Inc. | Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning |
US5676587A (en) * | 1995-12-06 | 1997-10-14 | International Business Machines Corporation | Selective polish process for titanium, titanium nitride, tantalum and tantalum nitride |
US5700383A (en) | 1995-12-21 | 1997-12-23 | Intel Corporation | Slurries and methods for chemical mechanical polish of aluminum and titanium aluminide |
US5858813A (en) * | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
US5756398A (en) * | 1997-03-17 | 1998-05-26 | Rodel, Inc. | Composition and method for polishing a composite comprising titanium |
-
1997
- 1997-03-24 US US08/822,025 patent/US6204169B1/en not_active Expired - Fee Related
- 1997-12-18 TW TW086119211A patent/TW379377B/zh not_active IP Right Cessation
- 1997-12-30 KR KR1019970078538A patent/KR100476484B1/ko not_active IP Right Cessation
-
1998
- 1998-03-06 SG SG9800501A patent/SG79962A1/en unknown
- 1998-03-18 DE DE69839136T patent/DE69839136T2/de not_active Expired - Lifetime
- 1998-03-18 CN CNB981056725A patent/CN1144268C/zh not_active Expired - Fee Related
- 1998-03-18 EP EP98104878A patent/EP0871214B1/de not_active Expired - Lifetime
- 1998-03-23 JP JP10093962A patent/JPH10270399A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH10270399A (ja) | 1998-10-09 |
EP0871214B1 (de) | 2008-02-20 |
KR19980079562A (ko) | 1998-11-25 |
DE69839136T2 (de) | 2009-02-12 |
EP0871214A2 (de) | 1998-10-14 |
EP0871214A3 (de) | 1999-02-17 |
SG79962A1 (en) | 2001-04-17 |
CN1144268C (zh) | 2004-03-31 |
KR100476484B1 (ko) | 2005-07-18 |
CN1194453A (zh) | 1998-09-30 |
US6204169B1 (en) | 2001-03-20 |
TW379377B (en) | 2000-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |