DE69838054D1 - Ultrafeines Nickelpulver - Google Patents

Ultrafeines Nickelpulver

Info

Publication number
DE69838054D1
DE69838054D1 DE69838054T DE69838054T DE69838054D1 DE 69838054 D1 DE69838054 D1 DE 69838054D1 DE 69838054 T DE69838054 T DE 69838054T DE 69838054 T DE69838054 T DE 69838054T DE 69838054 D1 DE69838054 D1 DE 69838054D1
Authority
DE
Germany
Prior art keywords
nickel powder
ultrafine nickel
ultrafine
powder
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69838054T
Other languages
English (en)
Other versions
DE69838054T2 (de
Inventor
Hideshi Katayama
Kan Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Mineral Co Ltd
Original Assignee
Kawatetsu Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawatetsu Mining Co Ltd filed Critical Kawatetsu Mining Co Ltd
Application granted granted Critical
Publication of DE69838054D1 publication Critical patent/DE69838054D1/de
Publication of DE69838054T2 publication Critical patent/DE69838054T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/28—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from gaseous metal compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H01M4/80—Porous plates, e.g. sintered carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
    • H01M4/8605—Porous electrodes
    • H01M4/8621—Porous electrodes containing only metallic or ceramic material, e.g. made by sintering or sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Ceramic Capacitors (AREA)
  • Powder Metallurgy (AREA)
  • Inert Electrodes (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE69838054T 1997-12-25 1998-12-18 Ultrafeines Nickelpulver Expired - Lifetime DE69838054T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9357763A JPH11189801A (ja) 1997-12-25 1997-12-25 ニッケル超微粉
JP35776397 1997-12-25

Publications (2)

Publication Number Publication Date
DE69838054D1 true DE69838054D1 (de) 2007-08-23
DE69838054T2 DE69838054T2 (de) 2008-06-19

Family

ID=18455808

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838054T Expired - Lifetime DE69838054T2 (de) 1997-12-25 1998-12-18 Ultrafeines Nickelpulver

Country Status (7)

Country Link
US (1) US6312496B1 (de)
EP (1) EP0925861B1 (de)
JP (1) JPH11189801A (de)
KR (1) KR100411765B1 (de)
CA (1) CA2256982C (de)
DE (1) DE69838054T2 (de)
TW (1) TW436344B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3640511B2 (ja) * 1997-09-05 2005-04-20 Ｊｆｅミネラル株式会社 ニッケル超微粉
IL126807A (en) * 1998-10-29 2001-08-26 Univ Ramot Nanostructure alloy anodes, process for their preparation and lithium batteries comprising said anodes
KR100422719B1 (ko) 1999-08-31 2004-03-12 도호 티타늄 가부시키가이샤 적층 세라믹 콘덴서용 니켈 분말
KR100480866B1 (ko) 1999-11-10 2005-04-07 미츠이 긴조쿠 고교 가부시키가이샤 니켈 분말, 그 제조 방법 및 도전 페이스트
EP1151814A4 (de) 1999-11-12 2006-11-02 Mitsui Mining & Smelting Co Nickelpulver und leitende paste
JP4702972B2 (ja) * 2000-01-31 2011-06-15 京セラ株式会社 積層型電子部品およびその製法
JP3841607B2 (ja) * 2000-02-03 2006-11-01 三井金属鉱業株式会社 ニッケル粉及び導電ペースト
TW477724B (en) 2000-02-28 2002-03-01 Mitsui Mining & Smelting Co Nickel powder and conductive paste
JP4081987B2 (ja) * 2000-05-30 2008-04-30 株式会社村田製作所 金属粉末の製造方法，金属粉末，これを用いた導電性ペーストならびにこれを用いた積層セラミック電子部品
DE60214243D1 (de) 2001-06-14 2006-10-05 Toho Titanium Co Ltd Verfahren zur herstellung von metallpulver
KR100449894B1 (ko) * 2002-01-31 2004-09-22 한국과학기술원 상이한 분말크기분포를 이용한 고 유전상수 및 저오차특성을 가지는 내장형 캐패시터 필름조성물 및 그제조방법
JP4409989B2 (ja) * 2003-03-12 2010-02-03 Ｊｆｅミネラル株式会社 ニッケル基超微粉及びその製造方法
TWI310570B (en) * 2004-07-30 2009-06-01 Jfe Mineral Co Ltd Ultrafine metal powder slurry
US20060107792A1 (en) * 2004-11-19 2006-05-25 Michael Collins Method for producing fine, low bulk density, metallic nickel powder
JP6986360B2 (ja) * 2017-04-05 2021-12-22 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP6986361B2 (ja) 2017-04-05 2021-12-22 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
CN112355318B (zh) * 2020-10-21 2023-05-19 荆楚理工学院 一种大粒径多孔球形镍粉及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062638A (en) * 1961-05-03 1962-11-06 Union Carbide Corp Ultrafine metal powders
JPS597765B2 (ja) 1980-09-13 1984-02-21 昭宣 吉澤 微粉末金属の製造方法
JPS6480007A (en) 1987-09-19 1989-03-24 Taiyo Yuden Kk Electrode paste for ceramic capacitor
JPH01136910A (ja) 1987-11-20 1989-05-30 Nisshin Steel Co Ltd 粒状微細金属粉末の製造方法
US5853451A (en) * 1990-06-12 1998-12-29 Kawasaki Steel Corporation Ultrafine spherical nickel powder for use as an electrode of laminated ceramic capacitors
JPH0445207A (ja) 1990-06-12 1992-02-14 Kawasaki Steel Corp 球状ニッケル微粒の製造方法
DE4214723C2 (de) 1992-05-04 1994-08-25 Starck H C Gmbh Co Kg Feinteilige Metallpulver
JP3197454B2 (ja) 1995-03-10 2001-08-13 川崎製鉄株式会社 積層セラミックコンデンサー用ニッケル超微粉
DE69735130T2 (de) * 1996-12-02 2006-08-31 Toho Titanium Co., Ltd., Chigasaki Verfahren und vorrichtung zur herstellung von metallpulvern

Also Published As

Publication number Publication date
EP0925861B1 (de) 2007-07-11
EP0925861A3 (de) 1999-12-08
KR19990063410A (ko) 1999-07-26
EP0925861A2 (de) 1999-06-30
KR100411765B1 (ko) 2004-06-04
CA2256982C (en) 2006-08-15
DE69838054T2 (de) 2008-06-19
CA2256982A1 (en) 1999-06-25
JPH11189801A (ja) 1999-07-13
US6312496B1 (en) 2001-11-06
TW436344B (en) 2001-05-28

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition