DE69834692D1 - Verfahren zur Herstellung oberflächenmontierte elektronische Bauteile und dessen Produkt - Google Patents

Verfahren zur Herstellung oberflächenmontierte elektronische Bauteile und dessen Produkt

Info

Publication number
DE69834692D1
DE69834692D1 DE69834692T DE69834692T DE69834692D1 DE 69834692 D1 DE69834692 D1 DE 69834692D1 DE 69834692 T DE69834692 T DE 69834692T DE 69834692 T DE69834692 T DE 69834692T DE 69834692 D1 DE69834692 D1 DE 69834692D1
Authority
DE
Germany
Prior art keywords
product
electronic components
making surface
surface mounted
mounted electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69834692T
Other languages
English (en)
Other versions
DE69834692T2 (de
Inventor
Masashi Gotoh
Jitsuo Kanazawa
Syuichiro Yamamoto
Kenji Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE69834692D1 publication Critical patent/DE69834692D1/de
Publication of DE69834692T2 publication Critical patent/DE69834692T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49792—Dividing through modified portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Dicing (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Multi-Conductor Connections (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE69834692T 1997-06-24 1998-06-24 Verfahren zur Herstellung oberflächenmontierte elektronische Bauteile und dessen Produkt Expired - Lifetime DE69834692T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18181797A JP3627164B2 (ja) 1997-06-24 1997-06-24 表面実装用電子部品
JP18181797 1997-06-24

Publications (2)

Publication Number Publication Date
DE69834692D1 true DE69834692D1 (de) 2006-07-06
DE69834692T2 DE69834692T2 (de) 2006-09-21

Family

ID=16107353

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69834692T Expired - Lifetime DE69834692T2 (de) 1997-06-24 1998-06-24 Verfahren zur Herstellung oberflächenmontierte elektronische Bauteile und dessen Produkt

Country Status (4)

Country Link
US (1) US6263565B1 (de)
EP (1) EP0888038B1 (de)
JP (1) JP3627164B2 (de)
DE (1) DE69834692T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6105246A (en) * 1999-05-20 2000-08-22 International Business Machines Corporation Method of making a circuit board having burr free castellated plated through holes
JP3636030B2 (ja) * 2000-04-26 2005-04-06 株式会社村田製作所 モジュール基板の製造方法
TWI221755B (en) * 2003-10-07 2004-10-01 Lite On Technology Corp Printed circuit board for avoiding producing burr
JP4848219B2 (ja) * 2006-07-27 2011-12-28 日本メクトロン株式会社 プリント配線板およびその製造方法
US8319114B2 (en) * 2008-04-02 2012-11-27 Densel Lambda K.K. Surface mount power module dual footprint
JP5610156B2 (ja) * 2011-01-31 2014-10-22 日立金属株式会社 光電変換モジュール及び光電変換モジュールの製造方法
US11244881B2 (en) * 2019-09-30 2022-02-08 Texas Instruments Incorporated Package terminal cavities
CN114823131A (zh) * 2022-06-08 2022-07-29 李成连 一种耐热型电容器及工作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286846A (ja) * 1985-10-14 1987-04-21 Matsushita Electric Works Ltd チツプキヤリアの製造法
JPH023999A (ja) * 1988-06-20 1990-01-09 Satosen Co Ltd デバイスパッケージに端子を作製する方法
JPH02213196A (ja) * 1989-02-13 1990-08-24 Sharp Corp 端面スルーホールプリント基板の製造方法
GB2248345B (en) * 1990-09-27 1994-06-22 Stc Plc Edge soldering of electronic components
JP2734284B2 (ja) 1992-03-25 1998-03-30 日本電気株式会社 リードレスチップキャリア基板
JPH05327156A (ja) 1992-05-25 1993-12-10 Matsushita Electric Works Ltd プリント回路基板
JPH0653775A (ja) 1992-07-28 1994-02-25 Tdk Corp 弾性表面波装置
JP2931731B2 (ja) * 1992-12-25 1999-08-09 田中貴金属工業株式会社 プリント配線板半割りスルホールの加工方法
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
JPH10126034A (ja) 1996-10-15 1998-05-15 Murata Mfg Co Ltd スルーホール基板の切断方法

Also Published As

Publication number Publication date
DE69834692T2 (de) 2006-09-21
EP0888038A1 (de) 1998-12-30
US6263565B1 (en) 2001-07-24
JPH1116771A (ja) 1999-01-22
EP0888038B1 (de) 2006-05-31
JP3627164B2 (ja) 2005-03-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition