DE69812830T2 - Vorrichtung zur Erzeugung eines ausgedehnten Induktionsplasmas für Plasmabehandlungen - Google Patents

Vorrichtung zur Erzeugung eines ausgedehnten Induktionsplasmas für Plasmabehandlungen

Info

Publication number
DE69812830T2
DE69812830T2 DE69812830T DE69812830T DE69812830T2 DE 69812830 T2 DE69812830 T2 DE 69812830T2 DE 69812830 T DE69812830 T DE 69812830T DE 69812830 T DE69812830 T DE 69812830T DE 69812830 T2 DE69812830 T2 DE 69812830T2
Authority
DE
Germany
Prior art keywords
plasma
process chamber
generating
internal
electromagnetic energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69812830T
Other languages
English (en)
Other versions
DE69812830D1 (de
Inventor
Pascal Colpo
Francois Rossi
Jean Daviet
Roland Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROPEAN UNION, BRUSSELS, BE
Original Assignee
European Community EC Luxemburg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by European Community EC Luxemburg filed Critical European Community EC Luxemburg
Publication of DE69812830D1 publication Critical patent/DE69812830D1/de
Application granted granted Critical
Publication of DE69812830T2 publication Critical patent/DE69812830T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32504—Means for preventing sputtering of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means

Landscapes

  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Magnetic Treatment Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Arc Welding In General (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE69812830T 1997-10-10 1998-05-19 Vorrichtung zur Erzeugung eines ausgedehnten Induktionsplasmas für Plasmabehandlungen Expired - Lifetime DE69812830T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97402395A EP0908921A1 (de) 1997-10-10 1997-10-10 Bearbeitungskammer zur Plasma gesteigerte chemischen Dampfphasenabscheidung und diese Bearbeitungskammer benutzende Vorrichtung
EP98400888A EP0908922B1 (de) 1997-10-10 1998-04-10 Bearbeitungskammer zur Plasma Behandlung und diese Bearbeitungskammer benutzende Vorrichtung

Publications (2)

Publication Number Publication Date
DE69812830D1 DE69812830D1 (de) 2003-05-08
DE69812830T2 true DE69812830T2 (de) 2003-11-06

Family

ID=8229877

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69817721T Expired - Lifetime DE69817721T2 (de) 1997-10-10 1998-04-10 Bearbeitungskammer zur Plasma Behandlung und diese Bearbeitungskammer benutzende Vorrichtung
DE69812830T Expired - Lifetime DE69812830T2 (de) 1997-10-10 1998-05-19 Vorrichtung zur Erzeugung eines ausgedehnten Induktionsplasmas für Plasmabehandlungen
DE69838823T Expired - Lifetime DE69838823T2 (de) 1997-10-10 1998-05-19 Induktiv-Typ Plasmabehandlungskammer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69817721T Expired - Lifetime DE69817721T2 (de) 1997-10-10 1998-04-10 Bearbeitungskammer zur Plasma Behandlung und diese Bearbeitungskammer benutzende Vorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69838823T Expired - Lifetime DE69838823T2 (de) 1997-10-10 1998-05-19 Induktiv-Typ Plasmabehandlungskammer

Country Status (6)

Country Link
EP (2) EP0908921A1 (de)
AT (2) ATE249098T1 (de)
DE (3) DE69817721T2 (de)
DK (2) DK0908922T3 (de)
ES (2) ES2205398T3 (de)
PT (2) PT908922E (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358505A1 (de) * 2003-12-13 2005-07-14 Roth & Rau Ag Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565717B1 (en) 1997-09-15 2003-05-20 Applied Materials, Inc. Apparatus for sputtering ionized material in a medium to high density plasma
US6080287A (en) * 1998-05-06 2000-06-27 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6287435B1 (en) 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6390019B1 (en) 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
GB9812852D0 (en) * 1998-06-16 1998-08-12 Surface Tech Sys Ltd Plasma processing apparatus
DE19923018C2 (de) * 1999-05-19 2001-09-27 Univ Dresden Tech Vorrichtung zur Bearbeitung bandförmiger Werkstücke mit Hilfe resonanter Hochfrequenzplasmen
WO2001088221A1 (fr) 2000-05-17 2001-11-22 Ishikawajima-Harima Heavy Industries Co., Ltd. Appareil de depot chimique en phase vapeur (cvd) au plasma et procede associe
US6831742B1 (en) 2000-10-23 2004-12-14 Applied Materials, Inc Monitoring substrate processing using reflected radiation
JP4770029B2 (ja) 2001-01-22 2011-09-07 株式会社Ｉｈｉ プラズマｃｖｄ装置及び太陽電池の製造方法
US6673199B1 (en) 2001-03-07 2004-01-06 Applied Materials, Inc. Shaping a plasma with a magnetic field to control etch rate uniformity
US20040129221A1 (en) * 2003-01-08 2004-07-08 Jozef Brcka Cooled deposition baffle in high density plasma semiconductor processing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879597A (en) * 1974-08-16 1975-04-22 Int Plasma Corp Plasma etching device and process
AT369927B (de) * 1980-04-15 1983-02-10 Vmei Lenin Nis Baugruppe zum schutz elektrischer isolatoren vor einer glimmentladung
US4795879A (en) * 1987-04-13 1989-01-03 The United States Of America As Represented By The United States Department Of Energy Method of processing materials using an inductively coupled plasma
US4990229A (en) * 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
JPH04350156A (ja) * 1991-05-27 1992-12-04 Ishikawajima Harima Heavy Ind Co Ltd 薄膜形成装置
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
US5556521A (en) * 1995-03-24 1996-09-17 Sony Corporation Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source
US5763851A (en) * 1995-11-27 1998-06-09 Applied Materials, Inc. Slotted RF coil shield for plasma deposition system
TW327236B (en) * 1996-03-12 1998-02-21 Varian Associates Inductively coupled plasma reactor with faraday-sputter shield
KR100489917B1 (ko) * 1996-05-09 2005-08-05 어플라이드 머티어리얼스, 인코포레이티드 플라즈마생성용코일을지지하는스탠드오프및코일지지방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358505A1 (de) * 2003-12-13 2005-07-14 Roth & Rau Ag Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas
DE10358505B4 (de) * 2003-12-13 2007-10-11 Roth & Rau Ag Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas

Also Published As

Publication number Publication date
DK0908923T3 (da) 2003-07-21
ATE249098T1 (de) 2003-09-15
DE69817721D1 (de) 2003-10-09
EP0908921A1 (de) 1999-04-14
EP0908922A1 (de) 1999-04-14
DK0908922T3 (da) 2004-01-19
DE69812830D1 (de) 2003-05-08
DE69838823D1 (de) 2008-01-17
EP0908922B1 (de) 2003-09-03
ES2192750T3 (es) 2003-10-16
ES2205398T3 (es) 2004-05-01
DE69838823T2 (de) 2008-11-13
PT908923E (pt) 2003-08-29
PT908922E (pt) 2004-01-30
ATE236453T1 (de) 2003-04-15
DE69817721T2 (de) 2004-07-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: EUROPEAN COMMUNITY, BRUSSELS, BE

8327 Change in the person/name/address of the patent owner

Owner name: EUROPEAN UNION, BRUSSELS, BE