DK0908922T3 - Proceskammer til plasmabehandling og apparat, der anvender proceskammeret - Google Patents
Proceskammer til plasmabehandling og apparat, der anvender proceskammeretInfo
- Publication number
- DK0908922T3 DK0908922T3 DK98400888T DK98400888T DK0908922T3 DK 0908922 T3 DK0908922 T3 DK 0908922T3 DK 98400888 T DK98400888 T DK 98400888T DK 98400888 T DK98400888 T DK 98400888T DK 0908922 T3 DK0908922 T3 DK 0908922T3
- Authority
- DK
- Denmark
- Prior art keywords
- process chamber
- internal
- plasma
- electromagnetic energy
- plasma treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
- H01J37/32504—Means for preventing sputtering of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Magnetic Treatment Devices (AREA)
- Drying Of Semiconductors (AREA)
- Treatment Of Fiber Materials (AREA)
- Arc Welding In General (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97402395A EP0908921A1 (de) | 1997-10-10 | 1997-10-10 | Bearbeitungskammer zur Plasma gesteigerte chemischen Dampfphasenabscheidung und diese Bearbeitungskammer benutzende Vorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0908922T3 true DK0908922T3 (da) | 2004-01-19 |
Family
ID=8229877
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK98400888T DK0908922T3 (da) | 1997-10-10 | 1998-04-10 | Proceskammer til plasmabehandling og apparat, der anvender proceskammeret |
DK98401199T DK0908923T3 (da) | 1997-10-10 | 1998-05-19 | Apparatur til tilvejebringelse af en udbredt induktiv plasma til plasmabearbejdning |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK98401199T DK0908923T3 (da) | 1997-10-10 | 1998-05-19 | Apparatur til tilvejebringelse af en udbredt induktiv plasma til plasmabearbejdning |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP0908921A1 (de) |
AT (2) | ATE249098T1 (de) |
DE (3) | DE69817721T2 (de) |
DK (2) | DK0908922T3 (de) |
ES (2) | ES2205398T3 (de) |
PT (2) | PT908922E (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6565717B1 (en) | 1997-09-15 | 2003-05-20 | Applied Materials, Inc. | Apparatus for sputtering ionized material in a medium to high density plasma |
US6080287A (en) * | 1998-05-06 | 2000-06-27 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
US6287435B1 (en) | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
US6390019B1 (en) | 1998-06-11 | 2002-05-21 | Applied Materials, Inc. | Chamber having improved process monitoring window |
GB9812852D0 (en) * | 1998-06-16 | 1998-08-12 | Surface Tech Sys Ltd | Plasma processing apparatus |
DE19923018C2 (de) * | 1999-05-19 | 2001-09-27 | Univ Dresden Tech | Vorrichtung zur Bearbeitung bandförmiger Werkstücke mit Hilfe resonanter Hochfrequenzplasmen |
ATE452219T1 (de) | 2000-05-17 | 2010-01-15 | Ihi Corp | Plasma-cvd-vorrichtung und verfahren |
US6831742B1 (en) | 2000-10-23 | 2004-12-14 | Applied Materials, Inc | Monitoring substrate processing using reflected radiation |
JP4770029B2 (ja) | 2001-01-22 | 2011-09-07 | 株式会社Ihi | プラズマcvd装置及び太陽電池の製造方法 |
US6673199B1 (en) | 2001-03-07 | 2004-01-06 | Applied Materials, Inc. | Shaping a plasma with a magnetic field to control etch rate uniformity |
US20040129221A1 (en) * | 2003-01-08 | 2004-07-08 | Jozef Brcka | Cooled deposition baffle in high density plasma semiconductor processing |
DE10358505B4 (de) * | 2003-12-13 | 2007-10-11 | Roth & Rau Ag | Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3879597A (en) * | 1974-08-16 | 1975-04-22 | Int Plasma Corp | Plasma etching device and process |
AT369927B (de) * | 1980-04-15 | 1983-02-10 | Vmei Lenin Nis | Baugruppe zum schutz elektrischer isolatoren vor einer glimmentladung |
US4795879A (en) * | 1987-04-13 | 1989-01-03 | The United States Of America As Represented By The United States Department Of Energy | Method of processing materials using an inductively coupled plasma |
US4990229A (en) * | 1989-06-13 | 1991-02-05 | Plasma & Materials Technologies, Inc. | High density plasma deposition and etching apparatus |
JPH04350156A (ja) * | 1991-05-27 | 1992-12-04 | Ishikawajima Harima Heavy Ind Co Ltd | 薄膜形成装置 |
US5641375A (en) * | 1994-08-15 | 1997-06-24 | Applied Materials, Inc. | Plasma etching reactor with surface protection means against erosion of walls |
US5556521A (en) * | 1995-03-24 | 1996-09-17 | Sony Corporation | Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source |
US5763851A (en) * | 1995-11-27 | 1998-06-09 | Applied Materials, Inc. | Slotted RF coil shield for plasma deposition system |
TW327236B (en) * | 1996-03-12 | 1998-02-21 | Varian Associates | Inductively coupled plasma reactor with faraday-sputter shield |
TW324831B (en) * | 1996-05-09 | 1998-01-11 | Applied Materials Inc | Plasma generating device |
-
1997
- 1997-10-10 EP EP97402395A patent/EP0908921A1/de not_active Withdrawn
-
1998
- 1998-04-10 ES ES98400888T patent/ES2205398T3/es not_active Expired - Lifetime
- 1998-04-10 AT AT98400888T patent/ATE249098T1/de active
- 1998-04-10 DK DK98400888T patent/DK0908922T3/da active
- 1998-04-10 DE DE69817721T patent/DE69817721T2/de not_active Expired - Lifetime
- 1998-04-10 EP EP98400888A patent/EP0908922B1/de not_active Expired - Lifetime
- 1998-04-10 PT PT98400888T patent/PT908922E/pt unknown
- 1998-05-19 DE DE69812830T patent/DE69812830T2/de not_active Expired - Lifetime
- 1998-05-19 AT AT98401199T patent/ATE236453T1/de active
- 1998-05-19 PT PT98401199T patent/PT908923E/pt unknown
- 1998-05-19 DK DK98401199T patent/DK0908923T3/da active
- 1998-05-19 ES ES98401199T patent/ES2192750T3/es not_active Expired - Lifetime
- 1998-05-19 DE DE69838823T patent/DE69838823T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE236453T1 (de) | 2003-04-15 |
EP0908921A1 (de) | 1999-04-14 |
DE69817721T2 (de) | 2004-07-22 |
DE69838823T2 (de) | 2008-11-13 |
DK0908923T3 (da) | 2003-07-21 |
DE69812830T2 (de) | 2003-11-06 |
PT908923E (pt) | 2003-08-29 |
ES2192750T3 (es) | 2003-10-16 |
DE69838823D1 (de) | 2008-01-17 |
ATE249098T1 (de) | 2003-09-15 |
EP0908922B1 (de) | 2003-09-03 |
DE69817721D1 (de) | 2003-10-09 |
EP0908922A1 (de) | 1999-04-14 |
DE69812830D1 (de) | 2003-05-08 |
ES2205398T3 (es) | 2004-05-01 |
PT908922E (pt) | 2004-01-30 |
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