DE69802726T2 - Abscheidung von Titannitridfilme - Google Patents
Abscheidung von TitannitridfilmeInfo
- Publication number
- DE69802726T2 DE69802726T2 DE69802726T DE69802726T DE69802726T2 DE 69802726 T2 DE69802726 T2 DE 69802726T2 DE 69802726 T DE69802726 T DE 69802726T DE 69802726 T DE69802726 T DE 69802726T DE 69802726 T2 DE69802726 T2 DE 69802726T2
- Authority
- DE
- Germany
- Prior art keywords
- deposition
- titanium nitride
- nitride films
- films
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical group [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/806,966 US6071811A (en) | 1997-02-26 | 1997-02-26 | Deposition of titanium nitride films having improved uniformity |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69802726D1 DE69802726D1 (de) | 2002-01-17 |
DE69802726T2 true DE69802726T2 (de) | 2002-08-08 |
Family
ID=25195246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69802726T Expired - Fee Related DE69802726T2 (de) | 1997-02-26 | 1998-02-26 | Abscheidung von Titannitridfilme |
Country Status (7)
Country | Link |
---|---|
US (1) | US6071811A (de) |
EP (1) | EP0861921B1 (de) |
JP (1) | JPH10298747A (de) |
KR (1) | KR19980071719A (de) |
DE (1) | DE69802726T2 (de) |
SG (1) | SG65737A1 (de) |
TW (1) | TW370570B (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6706541B1 (en) * | 1999-10-20 | 2004-03-16 | Advanced Micro Devices, Inc. | Method and apparatus for controlling wafer uniformity using spatially resolved sensors |
US6342448B1 (en) * | 2000-05-31 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company | Method of fabricating barrier adhesion to low-k dielectric layers in a copper damascene process |
US6699372B2 (en) | 2001-04-16 | 2004-03-02 | Agere Systems Guardian Corporation | Method of coil preparation for ionized metal plasma process and method of manufacturing integrated circuits |
US7659209B2 (en) | 2001-11-14 | 2010-02-09 | Canon Anelva Corporation | Barrier metal film production method |
US20030091739A1 (en) * | 2001-11-14 | 2003-05-15 | Hitoshi Sakamoto | Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus |
KR20030039649A (ko) * | 2001-11-14 | 2003-05-22 | 조치형 | 볼펜 볼의 코팅장치 및 방법 |
KR20030089756A (ko) * | 2002-05-18 | 2003-11-28 | 주식회사 하이닉스반도체 | 삼원계 확산배리어막의 형성 방법 및 그를 이용한구리배선의 형성 방법 |
US7378744B2 (en) * | 2004-05-10 | 2008-05-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance |
US7067409B2 (en) * | 2004-05-10 | 2006-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance |
KR100731993B1 (ko) | 2006-02-16 | 2007-06-27 | 주식회사 뉴파워 프라즈마 | 내부 방전 브리지를 갖는 플라즈마 소오스 |
US9115425B2 (en) | 2010-10-18 | 2015-08-25 | Electronics And Telecommunications Research Institute | Thin film depositing apparatus |
KR101382997B1 (ko) * | 2012-02-08 | 2014-04-08 | 현대자동차주식회사 | 코팅층 표면 처리 방법 |
KR101509639B1 (ko) * | 2013-10-18 | 2015-04-07 | 주식회사 포스코 | 방향성 전기강판의 세라믹 분말 코팅용 저압 형성 및 유지 장치 |
US11739418B2 (en) | 2019-03-22 | 2023-08-29 | Applied Materials, Inc. | Method and apparatus for deposition of metal nitrides |
JP2022525617A (ja) | 2019-03-22 | 2022-05-18 | アプライド マテリアルズ インコーポレイテッド | 超電導膜を有する多層デバイスの堆積のための方法及び装置 |
CN110965023A (zh) * | 2019-12-25 | 2020-04-07 | 北京北方华创微电子装备有限公司 | 氮化钛薄膜沉积方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1954366C2 (de) * | 1969-10-29 | 1972-02-03 | Heraeus Gmbh W C | Verfahren und Vorrichtung zur Herstellung von harten UEberzuegen aus Titan- und/oder Tantalverbindungen |
GB2085482B (en) * | 1980-10-06 | 1985-03-06 | Optical Coating Laboratory Inc | Forming thin film oxide layers using reactive evaporation techniques |
US5618388A (en) * | 1988-02-08 | 1997-04-08 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
FR2699934B1 (fr) * | 1992-12-30 | 1995-03-17 | Lorraine Inst Nat Polytech | Procédé de contrôle de la concentration en métalloïde d'un dépôt réalisés par voie physique en phase vapeur réactive à l'aide d'un plasma froid de pulvérisation. |
JPH06268083A (ja) * | 1993-03-11 | 1994-09-22 | Sony Corp | 半導体装置の配線 |
JP2754176B2 (ja) * | 1995-03-13 | 1998-05-20 | エルジイ・セミコン・カンパニイ・リミテッド | 緻密なチタン窒化膜及び緻密なチタン窒化膜/薄膜のチタンシリサイドの形成方法及びこれを用いた半導体素子の製造方法 |
US5604140A (en) * | 1995-05-22 | 1997-02-18 | Lg Semicon, Co. Ltd. | Method for forming fine titanium nitride film and method for fabricating semiconductor element using the same |
US5591672A (en) * | 1995-10-27 | 1997-01-07 | Vanguard International Semiconductor Corporation | Annealing of titanium - titanium nitride in contact hole |
US5801098A (en) * | 1996-09-03 | 1998-09-01 | Motorola, Inc. | Method of decreasing resistivity in an electrically conductive layer |
-
1997
- 1997-02-26 US US08/806,966 patent/US6071811A/en not_active Expired - Lifetime
-
1998
- 1998-02-25 SG SG1998000418A patent/SG65737A1/en unknown
- 1998-02-26 KR KR1019980006055A patent/KR19980071719A/ko not_active Application Discontinuation
- 1998-02-26 DE DE69802726T patent/DE69802726T2/de not_active Expired - Fee Related
- 1998-02-26 EP EP98301421A patent/EP0861921B1/de not_active Expired - Lifetime
- 1998-02-26 JP JP10089166A patent/JPH10298747A/ja not_active Withdrawn
- 1998-06-22 TW TW087102666A patent/TW370570B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW370570B (en) | 1999-09-21 |
DE69802726D1 (de) | 2002-01-17 |
JPH10298747A (ja) | 1998-11-10 |
SG65737A1 (en) | 1999-06-22 |
US6071811A (en) | 2000-06-06 |
EP0861921B1 (de) | 2001-12-05 |
KR19980071719A (ko) | 1998-10-26 |
EP0861921A1 (de) | 1998-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |