DE19882124T1 - Direkte Abscheidung von Gold - Google Patents

Direkte Abscheidung von Gold

Info

Publication number
DE19882124T1
DE19882124T1 DE19882124T DE19882124T DE19882124T1 DE 19882124 T1 DE19882124 T1 DE 19882124T1 DE 19882124 T DE19882124 T DE 19882124T DE 19882124 T DE19882124 T DE 19882124T DE 19882124 T1 DE19882124 T1 DE 19882124T1
Authority
DE
Germany
Prior art keywords
gold deposition
direct gold
direct
deposition
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19882124T
Other languages
English (en)
Inventor
Sunity Kumar Sharma
Kuldip Kumar Bhasin
Subhash C Narang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of DE19882124T1 publication Critical patent/DE19882124T1/de
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19882124T 1997-02-28 1998-02-24 Direkte Abscheidung von Gold Ceased DE19882124T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/808,376 US5846615A (en) 1997-02-28 1997-02-28 Direct deposition of a gold layer
PCT/US1998/003551 WO1998038350A1 (en) 1997-02-28 1998-02-24 Direct deposition of gold

Publications (1)

Publication Number Publication Date
DE19882124T1 true DE19882124T1 (de) 2000-03-16

Family

ID=25198598

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882124T Ceased DE19882124T1 (de) 1997-02-28 1998-02-24 Direkte Abscheidung von Gold

Country Status (5)

Country Link
US (1) US5846615A (de)
JP (1) JP2001513847A (de)
AU (1) AU6665698A (de)
DE (1) DE19882124T1 (de)
WO (1) WO1998038350A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
WO2000010736A1 (en) * 1998-08-21 2000-03-02 Sri International Printing of electronic circuits and components
US6630062B1 (en) 2000-08-04 2003-10-07 Delphi Technologies, Inc. Poison resistant sensor
US6555159B2 (en) 2000-12-18 2003-04-29 Delphi Technologies, Inc. Coating for gas sensors
US6706234B2 (en) 2001-08-08 2004-03-16 Nanotek Instruments, Inc. Direct write method for polarized materials
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20060001726A1 (en) * 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
KR20040077655A (ko) 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US8071168B2 (en) * 2002-08-26 2011-12-06 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US20040151978A1 (en) * 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
KR100796894B1 (ko) * 2004-01-29 2008-01-22 닛코킨조쿠 가부시키가이샤 무전해 도금 전처리제, 그것을 이용하는 무전해 도금방법,및 무전해 도금물
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US20060189113A1 (en) 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7625637B2 (en) * 2006-05-31 2009-12-01 Cabot Corporation Production of metal nanoparticles from precursors having low reduction potentials
US8110254B1 (en) 2006-09-12 2012-02-07 Sri International Flexible circuit chemistry
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US7946690B2 (en) * 2007-02-20 2011-05-24 Mvm Technologies, Inc. Printhead fabricated on flexible substrate
US8628818B1 (en) 2007-06-21 2014-01-14 Sri International Conductive pattern formation
US7989029B1 (en) 2007-06-21 2011-08-02 Sri International Reduced porosity copper deposition
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
CA2780291A1 (en) * 2009-11-09 2011-05-12 Carnegie Mellon University Metal ink compositions, conductive patterns, methods, and devices

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4176085A (en) * 1970-07-09 1979-11-27 Atlantic Richfield Company Palladium-containing catalyst
US4046569A (en) * 1975-04-14 1977-09-06 Eastman Kodak Company Physical development of pd(ii) photosensitive complexes with a leucophthalocyanine dye and a reducing agent therefor
US4042392A (en) * 1975-04-14 1977-08-16 Eastman Kodak Company Formazan images by physical development of catalytic metal nuclei image
CA1081949A (en) * 1976-07-08 1980-07-22 Mark Lelental Tellurium complex and heat-developable imaging materials and process
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US4933204A (en) * 1988-09-23 1990-06-12 Rockwell International Corporation Method of producing a gold film
DE3922233A1 (de) * 1989-07-06 1991-01-17 Guenter Link Verfahren zur abscheidung von metallen aus metallorganischen verbindungen mittels photonenstrahlung
US5021398A (en) * 1989-10-26 1991-06-04 Amp Incorporated Method of forming patterned oxide superconducting films
US5179060A (en) * 1990-11-28 1993-01-12 Ford Motor Company Dispersion enhanced pt group metal catalysts and method of making the catalysts
US5281447A (en) * 1991-10-25 1994-01-25 International Business Machines Corporation Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes
JPH06200376A (ja) * 1992-05-25 1994-07-19 Fujitsu Ltd 金薄膜気相成長方法
JPH07224385A (ja) * 1994-02-09 1995-08-22 Fujitsu Ltd 金属薄膜選択気相成長方法
JPH08306645A (ja) * 1995-05-08 1996-11-22 Canon Inc 金薄膜の形成方法

Also Published As

Publication number Publication date
US5846615A (en) 1998-12-08
JP2001513847A (ja) 2001-09-04
WO1998038350A1 (en) 1998-09-03
AU6665698A (en) 1998-09-18

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Legal Events

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8131 Rejection