DE69739113D1 - Abdeckvorrichtung - Google Patents

Abdeckvorrichtung

Info

Publication number
DE69739113D1
DE69739113D1 DE69739113T DE69739113T DE69739113D1 DE 69739113 D1 DE69739113 D1 DE 69739113D1 DE 69739113 T DE69739113 T DE 69739113T DE 69739113 T DE69739113 T DE 69739113T DE 69739113 D1 DE69739113 D1 DE 69739113D1
Authority
DE
Germany
Prior art keywords
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69739113T
Other languages
English (en)
Inventor
Rikiya Yamashita
Hiroshi Matsuzaki
Takuya Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Application granted granted Critical
Publication of DE69739113D1 publication Critical patent/DE69739113D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067Devices for protecting against damage from electrostatic discharge
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31573Next to addition polymer of ethylenically unsaturated monomer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31681Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31692Next to addition polymer from unsaturated monomers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31786Of polyester [e.g., alkyd, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31786Of polyester [e.g., alkyd, etc.]
    • Y10T428/31797Next to addition polymer from unsaturated monomers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Packaging Frangible Articles (AREA)
DE69739113T 1996-02-09 1997-02-10 Abdeckvorrichtung Expired - Fee Related DE69739113D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP04690796A JP3563863B2 (ja) 1996-02-09 1996-02-09 カバーテープ
PCT/JP1997/000349 WO1997028963A1 (fr) 1996-02-09 1997-02-10 Corps stratifie, couvercle et corps de sac

Publications (1)

Publication Number Publication Date
DE69739113D1 true DE69739113D1 (de) 2009-01-02

Family

ID=12760439

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69739113T Expired - Fee Related DE69739113D1 (de) 1996-02-09 1997-02-10 Abdeckvorrichtung
DE69738424T Expired - Fee Related DE69738424T2 (de) 1996-02-09 1997-02-10 Laminierte Struktur

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69738424T Expired - Fee Related DE69738424T2 (de) 1996-02-09 1997-02-10 Laminierte Struktur

Country Status (6)

Country Link
US (1) US6218017B1 (de)
EP (2) EP1658971B1 (de)
JP (1) JP3563863B2 (de)
KR (1) KR100467242B1 (de)
DE (2) DE69739113D1 (de)
WO (1) WO1997028963A1 (de)

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DE19813269A1 (de) 1998-03-25 1999-09-30 Hoechst Diafoil Gmbh Siegelfähige Polyesterfolie mit hoher Sauerstoffbarriere, Verfahren zu ihrer Herstellung und ihre Verwendung
US6449836B1 (en) * 1999-07-30 2002-09-17 Denso Corporation Method for interconnecting printed circuit boards and interconnection structure
FR2797622B1 (fr) * 1999-08-17 2001-11-02 Danisco Flexible France Feuille d'emballage stratifiee permettant la refermeture et emballage la comportant
JP3763710B2 (ja) * 1999-09-29 2006-04-05 信越化学工業株式会社 防塵用カバーフィルム付きウエハ支持台及びその製造方法
JP4748624B2 (ja) * 2000-01-26 2011-08-17 株式会社パイロットコーポレーション 磁性体反転表示パネル
US6469372B2 (en) * 2000-05-16 2002-10-22 Texas Instruments Incorporated Matched thermal expansion carrier tape assemblage for semiconductor devices
EP1167464A3 (de) * 2000-06-23 2003-04-09 Sonoco Development, Inc. Antistatischer Membrandeckel für Behälter
JP2002012288A (ja) * 2000-06-28 2002-01-15 Nitto Denko Corp 電子部品搬送用カバーテープ及び電子部品搬送体
ATE525203T1 (de) * 2000-07-05 2011-10-15 Yupo Corp Leicht abziehbare laminatfolie
US6916526B1 (en) * 2000-07-19 2005-07-12 Toray Plastics (America), Inc. Biaxially oriented polypropylene metallized film for packaging
JP2002326335A (ja) * 2001-04-27 2002-11-12 Nihon Tokkyo Kanri Co Ltd グラビア印刷積層包装材の製造方法及びこの製造方法により製造された積層包装材
DE60237501D1 (de) * 2001-06-20 2010-10-14 Dainippon Printing Co Ltd Batterieverpackungsmaterial
JP4213375B2 (ja) * 2001-10-17 2009-01-21 住友ベークライト株式会社 電子部品包装用カバーテープ
US6780916B2 (en) * 2001-07-26 2004-08-24 M & G Usa Corporation Oxygen-scavenging resin compositions having low haze
US7740926B2 (en) 2001-07-26 2010-06-22 M&G Usa Corporation Oxygen-scavenging containers
US7687124B2 (en) * 2001-07-26 2010-03-30 M&G Usa Corporation Oxygen-scavenging containers having low haze
US6663235B2 (en) * 2001-10-31 2003-12-16 Hewlett-Packard Development Company, L.P. Coverlayer based on functional polymers
JP4001774B2 (ja) * 2002-05-29 2007-10-31 日東電工株式会社 電子部品搬送用キャリア基体および電子部品搬送体
US20040089675A1 (en) * 2002-09-10 2004-05-13 Swope James E. Dispensing apparatus
DE602004017702D1 (de) * 2003-03-13 2008-12-24 Shell Int Research
US7278617B2 (en) * 2003-03-17 2007-10-09 Southern Imperial, Inc. Display hook and assembly having reduced drag
DE10325437A1 (de) * 2003-06-05 2004-12-23 Bayer Materialscience Ag Polycarbonat-Formkörper mit geringer Staubanziehung
US6995213B2 (en) * 2003-09-29 2006-02-07 Fina Technology, Inc. Oriented films prepared using impact copolymer polypropylene
JP4315038B2 (ja) * 2004-03-29 2009-08-19 パナソニック株式会社 固体電解コンデンサ
DE202004016420U1 (de) * 2004-05-17 2005-03-24 Huhtamaki Ronsberg, Zweigniederlassung Der Huhtamaki Deutschland Gmbh & Co. Kg Standbeutel mit optimiertem Aufreißverhalten
DE102004063410A1 (de) * 2004-12-23 2006-07-06 Wipak Walsrode Gmbh & Co.Kg Wiederverschließbare Verpackung
US8043704B2 (en) * 2005-04-08 2011-10-25 The Boeing Company Layered, transparent thermoplastic for flammability resistance
US20100165466A1 (en) * 2005-12-01 2010-07-01 Fujifilm Corporation Optical sheet for display, and manufacturing method and apparatus therefor
JP4777104B2 (ja) * 2006-03-16 2011-09-21 富士通セミコンダクター株式会社 半導体装置包装用カバーテープ及び半導体装置用包装体
US20080067099A1 (en) * 2006-09-14 2008-03-20 Patrick Henry Young Child resistant blister package
JP4575940B2 (ja) * 2007-08-21 2010-11-04 トヨタ自動車株式会社 シーラーおよびシール方法
US8216529B2 (en) * 2008-09-15 2012-07-10 Abbott Point Of Care Inc. Fluid-containing pouches with reduced gas exchange and methods for making same
JP2010241967A (ja) * 2009-04-07 2010-10-28 Nitto Denko Corp 再剥離性粘着シート及びこれを用いた被着体の加工方法
US9728304B2 (en) * 2009-07-16 2017-08-08 Pct International, Inc. Shielding tape with multiple foil layers
US9144464B2 (en) * 2009-08-14 2015-09-29 Ufp Technologies, Inc. Composite for packaging a medical device and method of forming the same
JP2012214252A (ja) 2010-09-30 2012-11-08 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
CN103764513A (zh) * 2011-09-01 2014-04-30 3M创新有限公司 用于包装电子元件的热密封包覆膜
WO2013061932A1 (ja) * 2011-10-25 2013-05-02 大日本印刷株式会社 電気化学セル用包装材料
US20130260122A1 (en) * 2012-03-30 2013-10-03 Toray Plastics (America), Inc. Low seal initiation lid for rigid substrates
JP5986786B2 (ja) * 2012-04-12 2016-09-06 東洋製罐株式会社 二重構造エアゾール缶に収納される内装パウチ
JP2013231113A (ja) * 2012-04-27 2013-11-14 Henkel Japan Ltd 接着シート
US10888150B2 (en) * 2012-08-08 2021-01-12 Firstspear Technology Group, Llc Light weight modular pouch attachment system and method
US20140127499A1 (en) * 2012-11-02 2014-05-08 Ashland Licensing And Intellectual Property Llc Two Part Primer Composition
JP6329256B2 (ja) * 2013-06-19 2018-05-23 エルジー・ケム・リミテッド 封止材フィルム
CN105916952B (zh) * 2014-03-13 2019-11-12 Dic株式会社 粘合片及电子设备
ES2557390B1 (es) * 2014-07-24 2016-11-07 Recubrimientos Plásticos, S.A. Multi-panel metálico y magnetorreológico
US20160167948A1 (en) * 2014-12-15 2016-06-16 W. L. Gore & Associates, Inc. Vent Attachment System For Micro-Electromechanical Systems
TWI580578B (zh) * 2016-07-06 2017-05-01 俊馳材料科技股份有限公司 覆蓋帶與其製程方法
US10147772B2 (en) 2016-08-23 2018-12-04 3M Innovative Properties Company Foldable OLED device with compatible flexural stiffness of layers
US20200047960A1 (en) * 2017-03-31 2020-02-13 Dai Nippon Printing Co., Ltd. Gas barrier laminate, and gas barrier packaging material and pillow packaging bag formed of the laminate
JP7126841B2 (ja) * 2017-09-29 2022-08-29 大日本印刷株式会社 透明両面導電性カバーテープと帯電防止層用樹脂組成物
US20210188516A1 (en) * 2018-11-20 2021-06-24 Bae Systems Information And Electronic Systems Integration Inc. Waffle pack for device containment
TW202204552A (zh) * 2020-07-23 2022-02-01 位元奈米科技股份有限公司 抗電磁干擾薄膜及其製作方法
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JPH08112880A (ja) * 1994-08-22 1996-05-07 Dainippon Printing Co Ltd 積層体とこれを用いた蓋材および袋体

Also Published As

Publication number Publication date
EP0836936A4 (de) 2002-09-04
KR100467242B1 (ko) 2005-07-05
WO1997028963A1 (fr) 1997-08-14
JPH09216317A (ja) 1997-08-19
US6218017B1 (en) 2001-04-17
DE69738424D1 (de) 2008-02-07
EP0836936A1 (de) 1998-04-22
EP1658971A1 (de) 2006-05-24
JP3563863B2 (ja) 2004-09-08
EP1658971B1 (de) 2007-12-26
KR19980703724A (ko) 1998-12-05
EP0836936B1 (de) 2008-11-19
DE69738424T2 (de) 2009-01-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee