DE69732256D1 - Wärmeableitungssystem und verfahren zur kühlung von wärmerzeugenden bauteilen - Google Patents

Wärmeableitungssystem und verfahren zur kühlung von wärmerzeugenden bauteilen

Info

Publication number
DE69732256D1
DE69732256D1 DE69732256T DE69732256T DE69732256D1 DE 69732256 D1 DE69732256 D1 DE 69732256D1 DE 69732256 T DE69732256 T DE 69732256T DE 69732256 T DE69732256 T DE 69732256T DE 69732256 D1 DE69732256 D1 DE 69732256D1
Authority
DE
Germany
Prior art keywords
heat
cooling
housing
disposal system
producing components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69732256T
Other languages
English (en)
Other versions
DE69732256T2 (de
Inventor
L Havey
Robert Hitch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
L3Harris Technologies Integrated Systems LP
Original Assignee
L3 Communications Integrated Systems LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/848,998 external-priority patent/US5943211A/en
Application filed by L3 Communications Integrated Systems LP filed Critical L3 Communications Integrated Systems LP
Publication of DE69732256D1 publication Critical patent/DE69732256D1/de
Application granted granted Critical
Publication of DE69732256T2 publication Critical patent/DE69732256T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Processing Of Solid Wastes (AREA)
  • Gasification And Melting Of Waste (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69732256T 1996-05-16 1997-05-15 Wärmeableitungssystem und verfahren zur kühlung von wärmerzeugenden bauteilen Expired - Fee Related DE69732256T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US64854896A 1996-05-16 1996-05-16
US648548 1996-05-16
US848998 1997-05-02
US08/848,998 US5943211A (en) 1997-04-18 1997-05-02 Heat spreader system for cooling heat generating components
PCT/US1997/008492 WO1997043887A1 (en) 1996-05-16 1997-05-15 Heat spreader system and method for cooling heat generating components

Publications (2)

Publication Number Publication Date
DE69732256D1 true DE69732256D1 (de) 2005-02-17
DE69732256T2 DE69732256T2 (de) 2005-12-22

Family

ID=27095411

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69732256T Expired - Fee Related DE69732256T2 (de) 1996-05-16 1997-05-15 Wärmeableitungssystem und verfahren zur kühlung von wärmerzeugenden bauteilen

Country Status (9)

Country Link
EP (1) EP0990378B1 (de)
JP (1) JP3554758B2 (de)
CN (1) CN1118224C (de)
AT (1) ATE287201T1 (de)
AU (1) AU715477B2 (de)
CA (1) CA2255060A1 (de)
DE (1) DE69732256T2 (de)
TR (1) TR199802410T2 (de)
WO (1) WO1997043887A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US6205799B1 (en) * 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system
US20070144199A1 (en) * 2005-12-28 2007-06-28 Scott Brian A Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure
WO2010130993A2 (en) * 2009-05-12 2010-11-18 Iceotope Limited Cooled electronic system
US8014150B2 (en) * 2009-06-25 2011-09-06 International Business Machines Corporation Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
TWI386607B (zh) * 2010-06-21 2013-02-21 Univ Nat Kaohsiung Applied Sci Microfine space cooling system
US10576589B2 (en) 2014-09-30 2020-03-03 The Boeing Company Cooling system for use with a power electronics assembly and method of manufacturing thereof
EP3229103A4 (de) * 2014-12-05 2018-07-11 Exascaler Inc. Kühlvorrichtung für elektronische einrichtung
CN105658037B (zh) * 2016-03-18 2018-04-20 苏州大景能源科技有限公司 一种整体式液冷散热机箱
WO2017215161A1 (zh) * 2016-06-16 2017-12-21 广东合一新材料研究院有限公司 一种用于计算机及数据中心散热的工质接触式冷却系统
GB201619987D0 (en) 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
CN106886267B (zh) * 2017-01-20 2023-10-31 广东西江数据科技有限公司 一种低压油路进油供给结构
JP7180130B2 (ja) 2018-06-07 2022-11-30 富士通株式会社 液浸槽
DE102018211666A1 (de) * 2018-07-12 2020-01-16 Mahle International Gmbh Kühlanordnung
SG10201809662QA (en) * 2018-10-31 2020-05-28 Kong Chye Gregory Ong Enclosure for providing liquid film cooling
FR3091791B1 (fr) * 2018-11-16 2022-06-10 Valeo Systemes Thermiques Dispositif de traitement thermique d’un element electrique susceptible de chauffer et procede mettant en œuvre le dispositif de traitement thermique
DE102018009310B4 (de) * 2018-11-27 2022-03-10 Diehl Defence Gmbh & Co. Kg Verfahren zum Kühlen eines Geräts mit einem elektronischen System
CN115804252A (zh) * 2020-03-23 2023-03-14 株式会社Kmw 电子元件的散热装置
KR102543845B1 (ko) * 2020-03-23 2023-06-21 주식회사 케이엠더블유 전장소자의 방열장치
US11825635B2 (en) * 2021-08-16 2023-11-21 Quanta Computer Inc. Immersion liquid cooling system
JP2024009658A (ja) * 2022-07-11 2024-01-23 三菱重工業株式会社 冷却装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3417814A (en) * 1967-06-26 1968-12-24 Ibm Air cooled multiliquid heat transfer unit
US4129845A (en) * 1977-07-15 1978-12-12 Electric Power Research Institute, Inc. Vaporization cooled electrical apparatus
US4149134A (en) * 1977-08-01 1979-04-10 Elect Power Research Institute, Inc. Vaporization-cooled electrical apparatus
US4276530A (en) * 1979-09-17 1981-06-30 Electric Power Research Institute, Inc. Vapor-cooled electrical apparatus
US4407136A (en) * 1982-03-29 1983-10-04 Halliburton Company Downhole tool cooling system
JPS63120449A (ja) * 1986-11-10 1988-05-24 Fujitsu Ltd 集積回路素子の蒸発冷却装置
US5220804A (en) * 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
US5311931A (en) * 1991-12-27 1994-05-17 The Research Foundation Of State University Of New York Mist supercooling of a heated surface
JPH07235790A (ja) * 1994-02-21 1995-09-05 Fuji Electric Co Ltd 電子機器冷却装置

Also Published As

Publication number Publication date
WO1997043887A1 (en) 1997-11-20
AU3207797A (en) 1997-12-05
EP0990378A1 (de) 2000-04-05
AU715477B2 (en) 2000-02-03
EP0990378A4 (de) 2000-04-05
TR199802410T2 (xx) 2001-12-21
DE69732256T2 (de) 2005-12-22
JP3554758B2 (ja) 2004-08-18
ATE287201T1 (de) 2005-01-15
EP0990378B1 (de) 2005-01-12
CN1225232A (zh) 1999-08-04
JP2002505033A (ja) 2002-02-12
CN1118224C (zh) 2003-08-13
CA2255060A1 (en) 1997-11-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee