DE69715289D1 - Elektrode für Plasmaätzen; Vorrichtung und Verfahren mit dieser Elektrode - Google Patents

Elektrode für Plasmaätzen; Vorrichtung und Verfahren mit dieser Elektrode

Info

Publication number
DE69715289D1
DE69715289D1 DE69715289T DE69715289T DE69715289D1 DE 69715289 D1 DE69715289 D1 DE 69715289D1 DE 69715289 T DE69715289 T DE 69715289T DE 69715289 T DE69715289 T DE 69715289T DE 69715289 D1 DE69715289 D1 DE 69715289D1
Authority
DE
Germany
Prior art keywords
electrode
plasma etching
etching
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69715289T
Other languages
English (en)
Other versions
DE69715289T2 (de
Inventor
Kazuo Saito
Yasushi Mochizuki
Akira Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nisshinbo Holdings Inc
Original Assignee
Nisshinbo Industries Inc
Nisshin Spinning Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nisshinbo Industries Inc, Nisshin Spinning Co Ltd filed Critical Nisshinbo Industries Inc
Application granted granted Critical
Publication of DE69715289D1 publication Critical patent/DE69715289D1/de
Publication of DE69715289T2 publication Critical patent/DE69715289T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32559Protection means, e.g. coatings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/914Differential etching apparatus including particular materials of construction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
DE69715289T 1996-04-22 1997-04-22 Elektrode für Plasmaätzen; Vorrichtung und Verfahren mit dieser Elektrode Expired - Fee Related DE69715289T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12407496A JP3454333B2 (ja) 1996-04-22 1996-04-22 プラズマエッチング電極

Publications (2)

Publication Number Publication Date
DE69715289D1 true DE69715289D1 (de) 2002-10-17
DE69715289T2 DE69715289T2 (de) 2003-05-08

Family

ID=14876298

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69715289T Expired - Fee Related DE69715289T2 (de) 1996-04-22 1997-04-22 Elektrode für Plasmaätzen; Vorrichtung und Verfahren mit dieser Elektrode

Country Status (6)

Country Link
US (1) US5951814A (de)
EP (1) EP0803897B1 (de)
JP (1) JP3454333B2 (de)
KR (1) KR100417926B1 (de)
DE (1) DE69715289T2 (de)
TW (1) TW379257B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6399499B1 (en) * 1999-09-14 2002-06-04 Jeong Gey Lee Method for fabricating an electrode of a plasma chamber
TW531820B (en) 2000-05-12 2003-05-11 Tokyo Electron Ltd Method of adjusting the thickness of an electrode in a plasma processing system
JP2002093777A (ja) * 2000-07-11 2002-03-29 Nisshinbo Ind Inc ドライエッチング装置
JP3876167B2 (ja) * 2002-02-13 2007-01-31 川崎マイクロエレクトロニクス株式会社 洗浄方法および半導体装置の製造方法
US6846726B2 (en) * 2002-04-17 2005-01-25 Lam Research Corporation Silicon parts having reduced metallic impurity concentration for plasma reaction chambers
JP3868341B2 (ja) * 2002-04-22 2007-01-17 日清紡績株式会社 耐熱性に優れたプラズマエッチング電極及びそれを装着したドライエッチング装置
US20040033361A1 (en) * 2002-08-06 2004-02-19 Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.) Component of glass-like carbon for CVD apparatus and process for production thereof
US7172531B2 (en) * 2003-06-06 2007-02-06 Rodgers Jr Robert E Variable stride exercise apparatus
JP4403919B2 (ja) * 2004-04-01 2010-01-27 株式会社Sumco 耐久性に優れたプラズマエッチング用シリコン電極板
US7247579B2 (en) 2004-12-23 2007-07-24 Lam Research Corporation Cleaning methods for silicon electrode assembly surface contamination removal
JP4849236B2 (ja) * 2006-09-27 2012-01-11 三菱マテリアル株式会社 パーティクル発生の少ないプラズマエッチング装置用シリコン電極板
WO2009078923A2 (en) * 2007-12-19 2009-06-25 Lam Research Corporation Film adhesive for semiconductor vacuum processing apparatus
SG187386A1 (en) * 2007-12-19 2013-02-28 Lam Res Corp A composite showerhead electrode assembly for a plasma processing apparatus
GB2465174A (en) * 2008-11-06 2010-05-12 Nviro Cleantech Ltd Roughened electrode for decontamination processes
GB201102337D0 (en) * 2011-02-09 2011-03-23 Univ Ulster A plasma based surface augmentation method
US9314854B2 (en) 2013-01-30 2016-04-19 Lam Research Corporation Ductile mode drilling methods for brittle components of plasma processing apparatuses
US8893702B2 (en) 2013-02-20 2014-11-25 Lam Research Corporation Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
US20140356985A1 (en) 2013-06-03 2014-12-04 Lam Research Corporation Temperature controlled substrate support assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61224423A (ja) * 1985-03-29 1986-10-06 Toshiba Corp 反応性イオンエツチング装置
JP2553389B2 (ja) * 1988-12-26 1996-11-13 東芝セラミックス株式会社 Cvd装置用カーボン治具
JPH07114198B2 (ja) * 1989-10-02 1995-12-06 東海カーボン株式会社 プラズマエッチング用電極板
JPH0826464B2 (ja) * 1989-10-20 1996-03-13 イビデン株式会社 プラズマエツチング用電極板
JPH0463606A (ja) * 1990-07-03 1992-02-28 Nippon Steel Corp 表面に非晶質炭素層を持つダイヤモンド工具
JP3252330B2 (ja) * 1991-09-20 2002-02-04 東芝セラミックス株式会社 プラズマエッチング用電極板
JP2527666B2 (ja) * 1992-02-18 1996-08-28 イビデン株式会社 ガラス状炭素被覆物品
US5472565A (en) * 1993-11-17 1995-12-05 Lam Research Corporation Topology induced plasma enhancement for etched uniformity improvement
JP3372647B2 (ja) * 1994-04-18 2003-02-04 キヤノン株式会社 プラズマ処理装置

Also Published As

Publication number Publication date
DE69715289T2 (de) 2003-05-08
US5951814A (en) 1999-09-14
EP0803897B1 (de) 2002-09-11
JP3454333B2 (ja) 2003-10-06
KR100417926B1 (ko) 2004-06-11
TW379257B (en) 2000-01-11
EP0803897A3 (de) 1998-04-01
EP0803897A2 (de) 1997-10-29
KR970070241A (ko) 1997-11-07
JPH09289197A (ja) 1997-11-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee