DE69715108D1 - Dünnschichtkondensator mit Element zur Widerstandsmessung - Google Patents

Dünnschichtkondensator mit Element zur Widerstandsmessung

Info

Publication number
DE69715108D1
DE69715108D1 DE69715108T DE69715108T DE69715108D1 DE 69715108 D1 DE69715108 D1 DE 69715108D1 DE 69715108 T DE69715108 T DE 69715108T DE 69715108 T DE69715108 T DE 69715108T DE 69715108 D1 DE69715108 D1 DE 69715108D1
Authority
DE
Germany
Prior art keywords
thin film
film capacitor
resistance measurement
measurement
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69715108T
Other languages
English (en)
Other versions
DE69715108T2 (de
Inventor
Yamamichi Shintaro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69715108D1 publication Critical patent/DE69715108D1/de
Application granted granted Critical
Publication of DE69715108T2 publication Critical patent/DE69715108T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
    • H01L27/0676—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type comprising combinations of diodes, or capacitors or resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
DE69715108T 1996-06-26 1997-06-25 Dünnschichtkondensator mit Element zur Widerstandsmessung Expired - Fee Related DE69715108T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8166050A JP2830845B2 (ja) 1996-06-26 1996-06-26 半導体記憶装置

Publications (2)

Publication Number Publication Date
DE69715108D1 true DE69715108D1 (de) 2002-10-10
DE69715108T2 DE69715108T2 (de) 2003-01-02

Family

ID=15824040

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69715108T Expired - Fee Related DE69715108T2 (de) 1996-06-26 1997-06-25 Dünnschichtkondensator mit Element zur Widerstandsmessung

Country Status (5)

Country Link
US (1) US5847423A (de)
EP (1) EP0817259B1 (de)
JP (1) JP2830845B2 (de)
KR (1) KR100260986B1 (de)
DE (1) DE69715108T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022476A (ja) * 1996-07-02 1998-01-23 Sony Corp 容量素子
US6906370B1 (en) * 1998-04-09 2005-06-14 Infineon Technologies Ag Semiconductor component having a material reinforced contact area
JP2000058786A (ja) * 1998-08-11 2000-02-25 Mitsubishi Electric Corp 半導体装置と半導体装置の製造方法およびそれに用いるレジストパターン形成方法
US6720604B1 (en) * 1999-01-13 2004-04-13 Agere Systems Inc. Capacitor for an integrated circuit
US6114865A (en) * 1999-04-21 2000-09-05 Semiconductor Diagnostics, Inc. Device for electrically contacting a floating semiconductor wafer having an insulating film
US6407004B1 (en) * 1999-05-12 2002-06-18 Matsushita Electric Industrial Co., Ltd. Thin film device and method for manufacturing thin film device
US6498362B1 (en) 1999-08-26 2002-12-24 Micron Technology, Inc. Weak ferroelectric transistor
TW501270B (en) * 1999-11-30 2002-09-01 Hitachi Ltd Semiconductor device and its manufacturing method
US6261967B1 (en) * 2000-02-09 2001-07-17 Infineon Technologies North America Corp. Easy to remove hard mask layer for semiconductor device fabrication
US7023021B2 (en) * 2000-02-22 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
JP2001235493A (ja) * 2000-02-22 2001-08-31 Japan Organo Co Ltd 電気伝導度測定装置
SG99939A1 (en) * 2000-08-11 2003-11-27 Casio Computer Co Ltd Semiconductor device
US6586792B2 (en) 2001-03-15 2003-07-01 Micron Technology, Inc. Structures, methods, and systems for ferroelectric memory transistors
US6503765B1 (en) * 2001-07-31 2003-01-07 Xilinx, Inc. Testing vias and contacts in integrated circuit fabrication
KR100632645B1 (ko) * 2005-08-03 2006-10-11 주식회사 하이닉스반도체 바저항 측정패턴을 갖는 플래쉬 메모리 소자 및 그의형성방법
JP4920335B2 (ja) * 2006-08-07 2012-04-18 新光電気工業株式会社 キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置
JP4783692B2 (ja) * 2006-08-10 2011-09-28 新光電気工業株式会社 キャパシタ内蔵基板及びその製造方法と電子部品装置
US7511939B2 (en) * 2006-08-24 2009-03-31 Analog Devices, Inc. Layered capacitor architecture and fabrication method
JP2009212299A (ja) * 2008-03-04 2009-09-17 Fujitsu Ltd 半導体装置及びその製造方法
CN101894776B (zh) * 2009-05-21 2012-01-04 中芯国际集成电路制造(上海)有限公司 测量电阻变化检测氮掺杂浓度的方法
CN113969424B (zh) * 2020-07-24 2022-10-14 中国科学院福建物质结构研究所 NaZnCO3(OH)化合物及其晶体的制备方法和应用
CN112979311B (zh) * 2021-04-30 2022-10-14 昆明理工大学 一种超低温烧结制备纳米晶a4b2o9型钽酸盐陶瓷及其方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04324951A (ja) * 1991-04-25 1992-11-13 Nec Corp 半導体装置
JPH04324952A (ja) * 1991-04-25 1992-11-13 Sanyo Electric Co Ltd 半導体装置の評価方法
JPH06318680A (ja) * 1993-05-10 1994-11-15 Nec Corp 半導体記憶装置およびその製造方法
JPH07161832A (ja) * 1993-12-08 1995-06-23 Oki Electric Ind Co Ltd 半導体記憶装置およびその製造方法
EP0737364B1 (de) * 1994-10-04 1999-03-31 Koninklijke Philips Electronics N.V. Halbleiteranordnung mit einem ferroelektrischen speicherbaustein, dessen bodenelenelektrode eine sauerstoff-barriere enthält

Also Published As

Publication number Publication date
JP2830845B2 (ja) 1998-12-02
EP0817259A2 (de) 1998-01-07
EP0817259A3 (de) 1999-12-22
US5847423A (en) 1998-12-08
KR100260986B1 (ko) 2000-07-01
DE69715108T2 (de) 2003-01-02
KR980005987A (ko) 1998-03-30
JPH1012843A (ja) 1998-01-16
EP0817259B1 (de) 2002-09-04

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee