DE69715056D1 - Verfahren und Gerät zur Erzeugung feiner Muster auf Leiterplatten - Google Patents

Verfahren und Gerät zur Erzeugung feiner Muster auf Leiterplatten

Info

Publication number
DE69715056D1
DE69715056D1 DE69715056T DE69715056T DE69715056D1 DE 69715056 D1 DE69715056 D1 DE 69715056D1 DE 69715056 T DE69715056 T DE 69715056T DE 69715056 T DE69715056 T DE 69715056T DE 69715056 D1 DE69715056 D1 DE 69715056D1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
fine patterns
producing fine
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69715056T
Other languages
English (en)
Other versions
DE69715056T2 (de
Inventor
Alan E Ferry
Maureen Yee Lau
Joon Han Byung
Scruton, Sr
King Lien Tai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of DE69715056D1 publication Critical patent/DE69715056D1/de
Application granted granted Critical
Publication of DE69715056T2 publication Critical patent/DE69715056T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70241Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE69715056T 1996-01-16 1997-01-14 Verfahren und Gerät zur Erzeugung feiner Muster auf Leiterplatten Expired - Lifetime DE69715056T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/586,347 US5834160A (en) 1996-01-16 1996-01-16 Method and apparatus for forming fine patterns on printed circuit board

Publications (2)

Publication Number Publication Date
DE69715056D1 true DE69715056D1 (de) 2002-10-10
DE69715056T2 DE69715056T2 (de) 2003-05-22

Family

ID=24345372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69715056T Expired - Lifetime DE69715056T2 (de) 1996-01-16 1997-01-14 Verfahren und Gerät zur Erzeugung feiner Muster auf Leiterplatten

Country Status (4)

Country Link
US (1) US5834160A (de)
EP (1) EP0785471B1 (de)
JP (1) JP3280259B2 (de)
DE (1) DE69715056T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19757074A1 (de) * 1997-12-20 1999-06-24 Zeiss Carl Fa Projektionsbelichtungsanlage und Belichtungsverfahren
US6383720B1 (en) * 1998-08-18 2002-05-07 Matsushita Electric Industrial Co., Ltd. Method of manufacturing fine pattern and printed circuit board manufactured with this method
US6373565B1 (en) 1999-05-27 2002-04-16 Spectra Physics Lasers, Inc. Method and apparatus to detect a flaw in a surface of an article
US6246706B1 (en) 1999-05-27 2001-06-12 Spectra Physics Lasers, Inc. Laser writing method and apparatus
US6734387B2 (en) 1999-05-27 2004-05-11 Spectra Physics Lasers, Inc. Method and apparatus for micro-machining of articles that include polymeric materials
US6421573B1 (en) 1999-05-27 2002-07-16 Spectra Physics Lasers, Inc. Quasi-continuous wave lithography apparatus and method
US6822978B2 (en) * 1999-05-27 2004-11-23 Spectra Physics, Inc. Remote UV laser system and methods of use
WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7695644B2 (en) 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US7446030B2 (en) 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US6414884B1 (en) 2000-02-04 2002-07-02 Lucent Technologies Inc. Method and apparatus for securing electronic circuits
US6518516B2 (en) 2000-04-25 2003-02-11 International Business Machines Corporation Multilayered laminate
US6407341B1 (en) 2000-04-25 2002-06-18 International Business Machines Corporation Conductive substructures of a multilayered laminate
WO2001098838A2 (en) * 2000-06-22 2001-12-27 Koninklijke Philips Electronics N.V. Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method
SG103303A1 (en) * 2000-07-07 2004-04-29 Nikon Corp Exposure apparatus, surface position adjustment unit, mask, and device manufacturing method
WO2007062122A2 (en) 2005-11-22 2007-05-31 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US7968014B2 (en) 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
MY145875A (en) 2006-09-24 2012-05-15 Shocking Technologies Inc Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US9208930B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
WO2010110909A1 (en) 2009-03-26 2010-09-30 Shocking Technologies, Inc. Components having voltage switchable dielectric materials
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US8885357B2 (en) * 2012-01-06 2014-11-11 Cray Inc. Printed circuit board with reduced cross-talk

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387970A (en) * 1980-03-24 1983-06-14 Xerox Corporation Projection lens assembly
US4346987A (en) * 1980-07-18 1982-08-31 Xerox Corporation Printed circuit board projection imaging system
US4702994A (en) * 1984-10-01 1987-10-27 W. R. Grace & Co. Projection imaged relief printing plates
JPH0821531B2 (ja) * 1986-08-29 1996-03-04 株式会社ニコン 投影光学装置
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member

Also Published As

Publication number Publication date
JP3280259B2 (ja) 2002-04-30
EP0785471A3 (de) 1999-03-31
EP0785471A2 (de) 1997-07-23
EP0785471B1 (de) 2002-09-04
JPH09197678A (ja) 1997-07-31
DE69715056T2 (de) 2003-05-22
US5834160A (en) 1998-11-10

Similar Documents

Publication Publication Date Title
DE69715056T2 (de) Verfahren und Gerät zur Erzeugung feiner Muster auf Leiterplatten
DE69419219D1 (de) Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten
DE69734947D1 (de) Verfahren zur Herstellung von mehrschichtigen Leiterplatten
DE69632516D1 (de) Verfahren und Vorrichtung zum Bestücken einer Leiterplatte mit elektronischen Bauteilen
DE69737375D1 (de) Verfahren zur Befestigung eines elektronischen Bauteils auf einer Leiterplatte und System zum Ausführen des Verfahrens
DE69410737T3 (de) Vorrichtung und Verfahren zum Löten von elektronischen Baugruppen auf Leiterplatten
EP0467149A3 (en) Method of and device for inspecting pattern of printed circuit board
DE69419300D1 (de) Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes
DE59509934D1 (de) Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern
DE69528234T2 (de) Schaltung und Verfahren zur Erzeugung eines Taktsignals
DE69331511D1 (de) Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung
DE69939913D1 (de) Gedruckte Schaltungsplatte und Verfahren zur Herstellung
DE60109262D1 (de) Anschlussleiter und Verfahren zur Montierung eines Anschlussleiters auf einer Leiterplatte
DE69032459D1 (de) Verfahren und Gerät zur Untersuchung eines leitenden Musters auf einer Leiterplatte
DE69809313T2 (de) Verfahren und Vorrichtung zum Prüfen von Leiterplatten
DE69810389D1 (de) Verfahren und Vorrichtung zur Befestigung von elektronischen Bauelementen auf einer Leiterplatte
DE69627971D1 (de) Kupferfolie für Leiterplatte, Verfahren und Gegenstand zur Herstellung
DE69012648D1 (de) Leiterplatte zur Verminderung der elektromagnetischen Störungen und Verfahren dafür.
DE69634284D1 (de) Verfahren zur Herstellung von mehrschichtigen Leiterplatten
DE59708222D1 (de) Leiterplatte und Verfahren zum lagegegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
EP0466013A3 (en) Method of and device for inspecting pattern of printed circuit board
DE59712869D1 (de) Vorrichtung und Verfahren zum Prüfen von Leiterplatten
DE69810681D1 (de) Verfahren und Vorrichtung zum Prüfen von Leiterplatten
DE60044736D1 (de) Mehrschichtige gedruckte Leiterplatte hoher Dichte mit hochzuverlässigen Durchgangslöchern und Verfahren zur Herstellung dieser Leiterplatte
GB2288229B (en) Method and apparatus for perforating printed circuit board

Legal Events

Date Code Title Description
8364 No opposition during term of opposition