DE69706507D1 - Bleifreie Weichlotzusammensetzung - Google Patents

Bleifreie Weichlotzusammensetzung

Info

Publication number
DE69706507D1
DE69706507D1 DE69706507T DE69706507T DE69706507D1 DE 69706507 D1 DE69706507 D1 DE 69706507D1 DE 69706507 T DE69706507 T DE 69706507T DE 69706507 T DE69706507 T DE 69706507T DE 69706507 D1 DE69706507 D1 DE 69706507D1
Authority
DE
Germany
Prior art keywords
lead
solder composition
soft solder
free soft
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69706507T
Other languages
English (en)
Other versions
DE69706507T2 (de
Inventor
Achyuta Achari
Mohan R Paruchuri
Dongkai Shangguan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Application granted granted Critical
Publication of DE69706507D1 publication Critical patent/DE69706507D1/de
Publication of DE69706507T2 publication Critical patent/DE69706507T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69706507T 1996-12-16 1997-12-09 Bleifreie Weichlotzusammensetzung Expired - Fee Related DE69706507T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/771,351 US5863493A (en) 1996-12-16 1996-12-16 Lead-free solder compositions

Publications (2)

Publication Number Publication Date
DE69706507D1 true DE69706507D1 (de) 2001-10-11
DE69706507T2 DE69706507T2 (de) 2002-05-08

Family

ID=25091534

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69706507T Expired - Fee Related DE69706507T2 (de) 1996-12-16 1997-12-09 Bleifreie Weichlotzusammensetzung

Country Status (4)

Country Link
US (1) US5863493A (de)
EP (1) EP0847829B1 (de)
JP (1) JPH10193172A (de)
DE (1) DE69706507T2 (de)

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US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
JPH09326554A (ja) * 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd 電子部品接合用電極のはんだ合金及びはんだ付け方法
WO1998014617A1 (en) * 1996-10-04 1998-04-09 Chronix Biomedical Diagnostic detection of nucleic acids
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3688429B2 (ja) * 1997-04-25 2005-08-31 株式会社東芝 電子部品実装用基板および電子部品実装基板
JP3296289B2 (ja) * 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
ES2224609T3 (es) * 1998-03-26 2005-03-01 Nihon Superior Sha Co., Ltd Aleacion de soldadura exenta de plomo.
JP2000197988A (ja) 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
GB9823349D0 (en) * 1998-10-27 1998-12-23 Glacier Vandervell Ltd Bearing material
US6139979A (en) * 1999-01-28 2000-10-31 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3036636B1 (ja) * 1999-02-08 2000-04-24 日本アルミット株式会社 無鉛半田合金
WO2001070448A1 (fr) * 1999-02-08 2001-09-27 Tokyo First Trading Company Alliage de soudure sans plomb
JP3544904B2 (ja) * 1999-09-29 2004-07-21 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
JP3221670B2 (ja) * 2000-02-24 2001-10-22 株式会社日本スペリア社 ディップはんだ槽の銅濃度制御方法
TW453930B (en) * 2000-04-17 2001-09-11 Fujitsu Ltd Solder bonding
US6429388B1 (en) 2000-05-03 2002-08-06 International Business Machines Corporation High density column grid array connections and method thereof
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
JP2002096191A (ja) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器
US20040241039A1 (en) * 2000-10-27 2004-12-02 H-Technologies Group High temperature lead-free solder compositions
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
DE60217199T2 (de) 2001-02-09 2007-10-04 Taiho Kogyo Co., Ltd., Toyota Bleifreies Weichlot und Weichlotverbindung
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US6840434B2 (en) 2002-04-09 2005-01-11 Ford Motor Company Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
US7029542B2 (en) * 2002-07-09 2006-04-18 Senju Metal Industry Co., Ltd. Lead-free solder alloy
US6892925B2 (en) * 2002-09-18 2005-05-17 International Business Machines Corporation Solder hierarchy for lead free solder joint
US6854636B2 (en) * 2002-12-06 2005-02-15 International Business Machines Corporation Structure and method for lead free solder electronic package interconnections
JP2004253736A (ja) * 2003-02-21 2004-09-09 Ngk Insulators Ltd ヒートスプレッダモジュール
US6917113B2 (en) 2003-04-24 2005-07-12 International Business Machines Corporatiion Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly
DE10319888A1 (de) * 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
US20040258556A1 (en) * 2003-06-19 2004-12-23 Nokia Corporation Lead-free solder alloys and methods of making same
US20050069725A1 (en) * 2003-07-03 2005-03-31 Boaz Premakaran T. Lead-free solder composition for substrates
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
WO2005090622A1 (en) * 2004-03-24 2005-09-29 Agency For Science, Technology And Research Lead free solder alloy
US20060068218A1 (en) * 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
DE102004050441A1 (de) 2004-10-16 2006-04-20 Stannol Gmbh Lotmaterial
KR20050030237A (ko) * 2004-11-13 2005-03-29 삼성전자주식회사 무연 솔더 합금
KR100582764B1 (ko) 2005-01-27 2006-05-22 청솔화학환경(주) 무연 땜납 조성물
WO2006122240A2 (en) * 2005-05-11 2006-11-16 American Iron & Metal Company, Inc. Tin alloy solder compositions
CN1313631C (zh) * 2005-08-02 2007-05-02 马莒生 一种锡银铜镍铝系无铅焊料合金
US7754343B2 (en) * 2005-08-17 2010-07-13 Oracle America, Inc. Ternary alloy column grid array
US20070059548A1 (en) * 2005-08-17 2007-03-15 Sun Microsystems, Inc. Grid array package using tin/silver columns
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
JP4569423B2 (ja) * 2005-08-31 2010-10-27 株式会社日立製作所 半導体装置の製造方法
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
EP2183076A1 (de) * 2007-07-23 2010-05-12 Henkel Limited Lötflussmittel
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
US8197612B2 (en) * 2008-04-29 2012-06-12 International Business Machines Corporation Optimization of metallurgical properties of a solder joint
US20100059576A1 (en) * 2008-09-05 2010-03-11 American Iron & Metal Company, Inc. Tin alloy solder composition
US8493746B2 (en) * 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
JP2011041970A (ja) * 2009-08-24 2011-03-03 Nihon Superior Co Ltd 鉛フリーはんだ接合材料
CA2797618C (en) * 2010-04-27 2016-04-12 Baker Hugues Incorporated Methods of forming polycrystalline compacts
US8268716B2 (en) 2010-09-30 2012-09-18 International Business Machines Corporation Creation of lead-free solder joint with intermetallics
TWI461252B (zh) * 2010-12-24 2014-11-21 Murata Manufacturing Co A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
EP2670560B1 (de) 2011-02-04 2016-01-13 Antaya Technologies Corp. Bleifreie lötzusammensetzung
TWI436710B (zh) * 2011-02-09 2014-05-01 Murata Manufacturing Co Connection structure
WO2012150452A1 (en) * 2011-05-03 2012-11-08 Pilkington Group Limited Glazing with a soldered connector
CN102248318B (zh) * 2011-06-30 2012-12-05 杭州华光焊接新材料股份有限公司 一种低银抗氧化Sn-Ag系无铅钎料
JP5594324B2 (ja) * 2012-06-22 2014-09-24 株式会社村田製作所 電子部品モジュールの製造方法
GB201312388D0 (en) * 2013-07-10 2013-08-21 Cambridge Entpr Ltd Materials and methods for soldering and soldered products
CN105290637A (zh) * 2015-11-30 2016-02-03 苏州龙腾万里化工科技有限公司 一种加银焊锡条
CN111112870A (zh) * 2019-12-20 2020-05-08 深圳市镱豪金属有限公司 一种环保锡条
JPWO2021256172A1 (de) * 2020-06-16 2021-12-23
CN113070606A (zh) * 2021-04-15 2021-07-06 云南锡业锡材有限公司 一种Sn-Ag-Cu高性能无铅焊料及其制备方法

Family Cites Families (16)

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US1565115A (en) * 1924-01-11 1925-12-08 Western Electric Co Solder
GB937712A (en) * 1961-04-07 1963-09-25 Ericsson Telephones Ltd Electrical connections to electroluminescent panels
US3503721A (en) * 1967-02-16 1970-03-31 Nytronics Inc Electronic components joined by tinsilver eutectic solder
US3607253A (en) * 1969-12-24 1971-09-21 Ibm Tin base solder alloy
CH598354A5 (de) * 1974-06-12 1978-04-28 Castolin Sa
JPS51108624A (en) * 1975-03-20 1976-09-27 Tokyo Shibaura Electric Co Biisnnin keigokin
US4643875A (en) * 1985-07-24 1987-02-17 Gte Products Corporation Tin based ductile brazing alloys
ATE65444T1 (de) * 1986-02-19 1991-08-15 Degussa Verwendung einer weichlotlegierung zum verbinden von keramikteilen.
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony
DE3830694A1 (de) * 1988-09-09 1990-03-15 Bosch Gmbh Robert Hochschmelzendes lot
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
CA2131256A1 (en) * 1993-09-07 1995-03-08 Dongkai Shangguan Lead-free solder alloy
US5455004A (en) * 1993-10-25 1995-10-03 The Indium Corporation Of America Lead-free alloy containing tin, zinc, indium and bismuth
JP3205466B2 (ja) * 1994-06-13 2001-09-04 福田金属箔粉工業株式会社 Ｓｎ基低融点ろう材

Also Published As

Publication number Publication date
JPH10193172A (ja) 1998-07-28
DE69706507T2 (de) 2002-05-08
EP0847829A1 (de) 1998-06-17
EP0847829B1 (de) 2001-09-05
US5863493A (en) 1999-01-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee