DE69707791T2 - Zinn-Silber Basis-Legierung zum Weichlöten - Google Patents

Zinn-Silber Basis-Legierung zum Weichlöten

Info

Publication number
DE69707791T2
DE69707791T2 DE69707791T DE69707791T DE69707791T2 DE 69707791 T2 DE69707791 T2 DE 69707791T2 DE 69707791 T DE69707791 T DE 69707791T DE 69707791 T DE69707791 T DE 69707791T DE 69707791 T2 DE69707791 T2 DE 69707791T2
Authority
DE
Germany
Prior art keywords
tin
base alloy
soft soldering
silver base
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69707791T
Other languages
English (en)
Other versions
DE69707791D1 (de
Inventor
Junichi Matsunaga
Ryuji Ninomiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of DE69707791D1 publication Critical patent/DE69707791D1/de
Publication of DE69707791T2 publication Critical patent/DE69707791T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69707791T 1996-08-29 1997-08-21 Zinn-Silber Basis-Legierung zum Weichlöten Expired - Fee Related DE69707791T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8247197A JPH1071488A (ja) 1996-08-29 1996-08-29 錫−銀系半田合金

Publications (2)

Publication Number Publication Date
DE69707791D1 DE69707791D1 (de) 2001-12-06
DE69707791T2 true DE69707791T2 (de) 2002-05-23

Family

ID=17159900

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69707791T Expired - Fee Related DE69707791T2 (de) 1996-08-29 1997-08-21 Zinn-Silber Basis-Legierung zum Weichlöten

Country Status (6)

Country Link
US (1) US5958333A (de)
EP (1) EP0826458B1 (de)
JP (1) JPH1071488A (de)
KR (1) KR19980019075A (de)
DE (1) DE69707791T2 (de)
TW (1) TW404872B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
WO2000018536A1 (fr) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Materiau de brasage et dispositif electrique/electronique utilisant celui-ci
JP2001071174A (ja) * 1999-09-07 2001-03-21 Mitsui Mining & Smelting Co Ltd 錫−銀系ハンダ合金
US6429388B1 (en) 2000-05-03 2002-08-06 International Business Machines Corporation High density column grid array connections and method thereof
US6837947B2 (en) 2002-01-15 2005-01-04 National Cheng-Kung University Lead-free solder
US20050085062A1 (en) * 2003-10-15 2005-04-21 Semitool, Inc. Processes and tools for forming lead-free alloy solder precursors
GB2406101C (en) * 2004-10-27 2007-09-11 Quantum Chem Tech Singapore Improvements in ro relating to solders
US8197612B2 (en) * 2008-04-29 2012-06-12 International Business Machines Corporation Optimization of metallurgical properties of a solder joint
US20140112710A1 (en) * 2011-02-25 2014-04-24 Senju Metal Industry Co., Ltd. Solder Alloy for Power Devices and Solder Joint Having a High Current Density

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JP2805595B2 (ja) * 1994-11-02 1998-09-30 三井金属鉱業株式会社 鉛無含有半田合金

Also Published As

Publication number Publication date
EP0826458B1 (de) 2001-10-31
DE69707791D1 (de) 2001-12-06
US5958333A (en) 1999-09-28
EP0826458A1 (de) 1998-03-04
JPH1071488A (ja) 1998-03-17
KR19980019075A (ko) 1998-06-05
TW404872B (en) 2000-09-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PFENNING MEINIG & PARTNER GBR, 80339 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: MAIWALD PATENTANWALTSGESELLSCHAFT MBH, 80335 MUENC

8339 Ceased/non-payment of the annual fee