DE69703052D1 - Verfahren zur Herstellung einer Halbleiteranordnung und Verwendung eines Spülmittels zur Halbleiter-Reinigung - Google Patents

Verfahren zur Herstellung einer Halbleiteranordnung und Verwendung eines Spülmittels zur Halbleiter-Reinigung

Info

Publication number
DE69703052D1
DE69703052D1 DE69703052T DE69703052T DE69703052D1 DE 69703052 D1 DE69703052 D1 DE 69703052D1 DE 69703052 T DE69703052 T DE 69703052T DE 69703052 T DE69703052 T DE 69703052T DE 69703052 D1 DE69703052 D1 DE 69703052D1
Authority
DE
Germany
Prior art keywords
detergent
semiconductor
manufacturing
semiconductor device
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69703052T
Other languages
English (en)
Other versions
DE69703052T2 (de
Inventor
Mayumi Hada
Ryuji Hasemi
Hidetoshi Ikeda
Tetsuo Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1896596A external-priority patent/JPH09213704A/ja
Priority claimed from JP1896496A external-priority patent/JPH09213612A/ja
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of DE69703052D1 publication Critical patent/DE69703052D1/de
Application granted granted Critical
Publication of DE69703052T2 publication Critical patent/DE69703052T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
DE69703052T 1996-02-05 1997-01-21 Verfahren zur Herstellung einer Halbleiteranordnung und Verwendung eines Spülmittels zur Halbleiter-Reinigung Expired - Fee Related DE69703052T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1896596A JPH09213704A (ja) 1996-02-05 1996-02-05 半導体装置の製造方法
JP1896496A JPH09213612A (ja) 1996-02-05 1996-02-05 半導体装置の製造方法およびリンス液

Publications (2)

Publication Number Publication Date
DE69703052D1 true DE69703052D1 (de) 2000-10-19
DE69703052T2 DE69703052T2 (de) 2001-02-15

Family

ID=26355739

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703052T Expired - Fee Related DE69703052T2 (de) 1996-02-05 1997-01-21 Verfahren zur Herstellung einer Halbleiteranordnung und Verwendung eines Spülmittels zur Halbleiter-Reinigung

Country Status (6)

Country Link
US (1) US5911836A (de)
EP (1) EP0788143B1 (de)
KR (1) KR100446590B1 (de)
DE (1) DE69703052T2 (de)
SG (1) SG60039A1 (de)
TW (1) TW324832B (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2836562B2 (ja) * 1996-02-08 1998-12-14 日本電気株式会社 半導体ウェハのウェット処理方法
US6082373A (en) * 1996-07-05 2000-07-04 Kabushiki Kaisha Toshiba Cleaning method
US7378355B2 (en) * 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US20050034745A1 (en) * 1997-05-09 2005-02-17 Semitool, Inc. Processing a workpiece with ozone and a halogenated additive
US7416611B2 (en) * 1997-05-09 2008-08-26 Semitool, Inc. Process and apparatus for treating a workpiece with gases
US6701941B1 (en) * 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
US7163588B2 (en) * 1997-05-09 2007-01-16 Semitool, Inc. Processing a workpiece using water, a base, and ozone
US20020157686A1 (en) * 1997-05-09 2002-10-31 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
EP0907203A3 (de) * 1997-09-03 2000-07-12 Siemens Aktiengesellschaft Strukturierungsverfahren
US6043005A (en) * 1998-06-03 2000-03-28 Haq; Noor Polymer remover/photoresist stripper
US6319884B2 (en) * 1998-06-16 2001-11-20 International Business Machines Corporation Method for removal of cured polyimide and other polymers
US6021791A (en) 1998-06-29 2000-02-08 Speedfam-Ipec Corporation Method and apparatus for immersion cleaning of semiconductor devices
US6146468A (en) * 1998-06-29 2000-11-14 Speedfam-Ipec Corporation Semiconductor wafer treatment
US6440326B1 (en) 1998-08-13 2002-08-27 Mitsubishi Gas Chemical Company, Inc. Photoresist removing composition
DE69916728T2 (de) * 1998-08-28 2005-04-28 Mitsubishi Materials Corp. Verfahren zur Reinigung eines Halbleitersubstrats
TW467953B (en) * 1998-11-12 2001-12-11 Mitsubishi Gas Chemical Co New detergent and cleaning method of using it
DE19901002B4 (de) * 1999-01-13 2005-09-22 Infineon Technologies Ag Verfahren zum Strukturieren einer Schicht
US6123088A (en) * 1999-12-20 2000-09-26 Chartered Semiconducotor Manufacturing Ltd. Method and cleaner composition for stripping copper containing residue layers
US6841470B2 (en) * 1999-12-31 2005-01-11 Intel Corporation Removal of residue from a substrate
JP2002016034A (ja) * 2000-06-30 2002-01-18 Mitsubishi Electric Corp 半導体装置の製造方法、及び半導体装置
EP1211563B1 (de) * 2000-11-30 2011-12-21 Tosoh Corporation Fotolackentfernerzusammensetzung
US20030148624A1 (en) * 2002-01-31 2003-08-07 Kazuto Ikemoto Method for removing resists
JP4304154B2 (ja) * 2002-06-07 2009-07-29 マリンクロッド・ベイカー・インコーポレイテッド 酸化剤および有機溶媒を含有するマイクロエレクトロニクス洗浄組成物
JP4282054B2 (ja) * 2002-09-09 2009-06-17 東京応化工業株式会社 デュアルダマシン構造形成プロセスに用いられる洗浄液および基板の処理方法
KR100569515B1 (ko) 2003-04-08 2006-04-07 주식회사 하이닉스반도체 반도체 소자의 제조방법
US7399365B2 (en) * 2003-04-18 2008-07-15 Ekc Technology, Inc. Aqueous fluoride compositions for cleaning semiconductor devices
US20090288688A1 (en) * 2005-03-11 2009-11-26 Ron Rulkens Non-corrosive chemical rinse system
US8124320B2 (en) * 2005-12-13 2012-02-28 Micron Technology, Inc. Method and apparatus for surface tension control in advanced photolithography
KR100720528B1 (ko) 2005-12-29 2007-05-22 동부일렉트로닉스 주식회사 반도체 소자의 세정 방법
KR20180112113A (ko) * 2007-04-13 2018-10-11 솔베이(소시에떼아노님) 반도체 웨이퍼 처리를 위한 산화제의 용도, 조성물의 용도 및 그 조성물
CN102569023B (zh) * 2010-12-30 2016-09-14 安集微电子（上海）有限公司 一种减少金属腐蚀的清洗方法
US9460934B2 (en) * 2013-03-15 2016-10-04 Globalfoundries Inc. Wet strip process for an antireflective coating layer
CN108624106B (zh) * 2017-03-16 2020-07-21 苏州诺菲纳米科技有限公司 具有蚀刻功能的可剥胶及蚀刻方法
US11959004B2 (en) * 2020-12-07 2024-04-16 Texas Instruments Incorporated Wet anisotropic etching of silicon

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4744834A (en) * 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
JP2631849B2 (ja) 1987-09-30 1997-07-16 ナガセ電子化学 株式会社 剥離剤組成物
US5037724A (en) * 1988-02-25 1991-08-06 Hoya Corporation Peeling solution for photo- or electron beam-sensitive resin
JP2906590B2 (ja) 1990-06-14 1999-06-21 三菱瓦斯化学株式会社 アルミニウム配線半導体基板の表面処理剤
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5453401A (en) * 1991-05-01 1995-09-26 Motorola, Inc. Method for reducing corrosion of a metal surface containing at least aluminum and copper
JPH05156907A (ja) * 1991-11-30 1993-06-22 Suzuki Motor Corp エンジンのロッカーアームの構造
CA2096452A1 (en) * 1992-06-19 1993-12-20 William E. Elias Inorganic oxidant compositions for removing contaminants
EP0578507B1 (de) 1992-07-09 2005-09-28 Ekc Technology, Inc. Reinigungsmittelzusammensetzung, das einem Redox Aminverbindung enthält
JPH06184595A (ja) 1992-12-18 1994-07-05 Nitto Chem Ind Co Ltd レジスト剥離工程用洗浄剤
JPH06222573A (ja) 1993-01-26 1994-08-12 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト用剥離液
JP3264405B2 (ja) * 1994-01-07 2002-03-11 三菱瓦斯化学株式会社 半導体装置洗浄剤および半導体装置の製造方法
JP3074634B2 (ja) * 1994-03-28 2000-08-07 三菱瓦斯化学株式会社 フォトレジスト用剥離液及び配線パターンの形成方法

Also Published As

Publication number Publication date
KR100446590B1 (ko) 2004-11-16
EP0788143A2 (de) 1997-08-06
EP0788143B1 (de) 2000-09-13
SG60039A1 (en) 1999-02-22
DE69703052T2 (de) 2001-02-15
TW324832B (en) 1998-01-11
US5911836A (en) 1999-06-15
EP0788143A3 (de) 1997-10-08
KR970063546A (ko) 1997-09-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee