DE69702138T2 - Mit einer schaltungsanordnung ausgerüstetes fahrzeugteil und verfahren zu seiner herstellung - Google Patents

Mit einer schaltungsanordnung ausgerüstetes fahrzeugteil und verfahren zu seiner herstellung

Info

Publication number
DE69702138T2
DE69702138T2 DE69702138T DE69702138T DE69702138T2 DE 69702138 T2 DE69702138 T2 DE 69702138T2 DE 69702138 T DE69702138 T DE 69702138T DE 69702138 T DE69702138 T DE 69702138T DE 69702138 T2 DE69702138 T2 DE 69702138T2
Authority
DE
Germany
Prior art keywords
production
circuit arrangement
vehicle part
part equipped
vehicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69702138T
Other languages
English (en)
Other versions
DE69702138D1 (de
Inventor
Alice Zitzmann
Z Glovatsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Werke GmbH
Ford Motor Co Ltd
Original Assignee
Ford Werke GmbH
Ford Motor Co Ltd
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Werke GmbH, Ford Motor Co Ltd, Ford Motor Co filed Critical Ford Werke GmbH
Publication of DE69702138D1 publication Critical patent/DE69702138D1/de
Application granted granted Critical
Publication of DE69702138T2 publication Critical patent/DE69702138T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14344—Moulding in or through a hole in the article, e.g. outsert moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14754—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles being in movable or releasable engagement with the coating, e.g. bearing assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE69702138T 1996-05-28 1997-05-27 Mit einer schaltungsanordnung ausgerüstetes fahrzeugteil und verfahren zu seiner herstellung Expired - Fee Related DE69702138T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/654,489 US5754398A (en) 1996-05-28 1996-05-28 Circuit-carrying automotive component and method of manufacturing the same
PCT/GB1997/001431 WO1997045242A1 (en) 1996-05-28 1997-05-27 Circuit-carrying automotive component and method of manufacturing the same

Publications (2)

Publication Number Publication Date
DE69702138D1 DE69702138D1 (de) 2000-06-29
DE69702138T2 true DE69702138T2 (de) 2000-09-28

Family

ID=24625076

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69702138T Expired - Fee Related DE69702138T2 (de) 1996-05-28 1997-05-27 Mit einer schaltungsanordnung ausgerüstetes fahrzeugteil und verfahren zu seiner herstellung

Country Status (5)

Country Link
US (1) US5754398A (de)
EP (1) EP0918610B1 (de)
BR (1) BR9708442A (de)
DE (1) DE69702138T2 (de)
WO (1) WO1997045242A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7020652B2 (en) 2001-12-21 2006-03-28 Bellsouth Intellectual Property Corp. System and method for customizing content-access lists
US6272745B1 (en) * 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings
DE19912256C1 (de) * 1999-03-18 2000-11-16 Siemens Ag Herstellungsverfahren für ein elektronisches Gerät und elektronisches Gerät mit Kunststoffgehäuse
JP3489665B2 (ja) * 1999-04-13 2004-01-26 矢崎総業株式会社 インパネ用ワイヤハーネス装置
FR2795670B1 (fr) * 1999-06-30 2001-10-05 Plastic Omnium Valeo Interiors Procede de fabrication d'un sous-ensemble de tableau de bord notamment console de tableau de bord de vehicule
US6409930B1 (en) 1999-11-01 2002-06-25 Bmc Industries, Inc. Lamination of circuit sub-elements while assuring registration
US6365057B1 (en) 1999-11-01 2002-04-02 Bmc Industries, Inc. Circuit manufacturing using etched tri-metal media
US6468439B1 (en) 1999-11-01 2002-10-22 Bmc Industries, Inc. Etching of metallic composite articles
DE10021064A1 (de) * 2000-04-28 2001-11-15 Bosch Gmbh Robert Abdeckvorrichtung
US6669273B1 (en) * 2002-09-16 2003-12-30 Visteon Global Technologies, Inc. Vehicle instrument panel structure to support electronics packaging
US6799786B2 (en) 2002-11-08 2004-10-05 Lear Corporation Instrument panel for a vehicle
JP2006154462A (ja) * 2004-11-30 2006-06-15 Kyocera Mita Corp 画像形成装置における冷却装置
US7341038B1 (en) 2006-12-15 2008-03-11 Federal - Mogul World Wide, Inc. Engine cover with embedded leads
US8453476B2 (en) * 2009-05-21 2013-06-04 Whirlpool Corporation Refrigerator module mounting system
US9791203B2 (en) * 2006-12-28 2017-10-17 Whirlpool Corporation Secondary fluid infrastructure within a refrigerator and method thereof
US20080215416A1 (en) * 2007-01-31 2008-09-04 Collarity, Inc. Searchable interactive internet advertisements
JP6870533B2 (ja) * 2017-08-23 2021-05-12 株式会社オートネットワーク技術研究所 電気部品付ワイヤーハーネスおよび電気部品付ワイヤーハーネスの組付構造
CN113195192A (zh) 2018-12-10 2021-07-30 ams传感器新加坡私人有限公司 用于光电模块的真空注射成型
JP7128791B2 (ja) * 2019-10-18 2022-08-31 Ｎｉｓｓｈａ株式会社 成形品、電気製品及び成形品の製造方法
JP7198856B2 (ja) * 2021-03-30 2023-01-04 Ｎｉｓｓｈａ株式会社 電子部品付き樹脂筐体およびその製造方法
CN114698267B (zh) * 2021-08-09 2024-06-04 上海航天电子通讯设备研究所 Lcp多层柔性电路板曲面成型方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1236295A (en) * 1968-12-17 1971-06-23 Nippon Denso Co Housings for mounting on the instrument panels of automobiles
GB2027636B (en) * 1978-03-29 1982-03-17 Shortland Bowen Instr Method of forming raised figures on dial plate
JPS57146117A (en) * 1981-03-05 1982-09-09 Aisin Seiki Co Ltd Attaching method for float stopper in liquid level detecting device
JPS607798A (ja) * 1983-06-28 1985-01-16 北川工業株式会社 固定具
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
JPH0635816Y2 (ja) * 1988-03-25 1994-09-21 矢崎総業株式会社 インストルメントパネル用ワイヤーハーネス装置
US4882657A (en) * 1988-04-06 1989-11-21 Ici Array Technology, Inc. Pin grid array assembly
GB2220107B (en) * 1988-04-30 1992-06-24 Pressac Ltd Circuit board assembly
JPH053390A (ja) * 1991-06-24 1993-01-08 Mitsubishi Electric Corp 電子機器およびその製造方法
US5442518A (en) * 1992-12-14 1995-08-15 Chrysler Corporation Wiring system for vehicle instrument panel wire encapsulated in reconfigured ventilation system
US5397746A (en) * 1993-11-03 1995-03-14 Intel Corporation Quad flat package heat slug composition
US5538586A (en) * 1994-10-04 1996-07-23 Hewlett-Packard Company Adhesiveless encapsulation of tab circuit traces for ink-jet pen

Also Published As

Publication number Publication date
EP0918610A1 (de) 1999-06-02
US5754398A (en) 1998-05-19
DE69702138D1 (de) 2000-06-29
EP0918610B1 (de) 2000-05-24
BR9708442A (pt) 1999-08-03
WO1997045242A1 (en) 1997-12-04

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: FORD-WERKE GMBH, 50735 KOELN, DE

Owner name: FORD MOTOR CO. LTD., BRENTWOOD, ESSEX, GB

8339 Ceased/non-payment of the annual fee