CN113195192A - 用于光电模块的真空注射成型 - Google Patents

用于光电模块的真空注射成型 Download PDF

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CN113195192A
CN113195192A CN201980081786.5A CN201980081786A CN113195192A CN 113195192 A CN113195192 A CN 113195192A CN 201980081786 A CN201980081786 A CN 201980081786A CN 113195192 A CN113195192 A CN 113195192A
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vacuum injection
tool
epoxy
injection tool
circuit board
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王吉
梁金华
余启川
西蒙.古瑟
张勇庆
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Ams Osram AG
Ams Sensors Singapore Pte Ltd
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Abstract

制造光电模块包括将印刷电路板基板(27)支撑在第一真空注射工具(24)上。印刷电路板基板(27)具有安装在其上的至少一个光电组件，并且在背离第一真空注射工具(24)的表面(46)上具有阻焊层(40)。该方法包括使第一真空注射工具(24)和第二真空注射工具(22)彼此靠近，以使第二真空注射工具(22)的表面(46)与阻焊层(40)接触。随后，使用真空注射技术在上部工具(22)与阻焊层(40)之间的空间(104)中提供第一环氧树脂(100,20)。

Description

用于光电模块的真空注射成型
技术领域
本公开涉及用于光电模块的真空注射成型技术。
背景技术
各种消费电子产品及其他主机装置包含具有集成的光感测或发光装置的紧凑光电模块。在一些情况下，可以以晶圆级工艺制造模块，该工艺允许同时并行制造多个(例如，数十个、数百个或甚至数千个)模块。在这些过程中有时会使用复制技术，以促进光学元件(如透镜)的形成。同样，可以采用真空注射技术来促进模块的外壳或壁的形成。复制及真空注射成型(vacuum injection molding，VIM)技术可以使用例如聚二甲基硅氧烷(polydimethylsiloxane，PDMS)或在制造过程中提供支撑和/或限定要复制的光学元件的形状的其他工具来执行。通常，该过程包含下部工具和上部工具。
可以在上部工具及下部工具之间设置密封板，以便在将工具放在一起进行复制和/或VIM过程时在工具之间建立预定义的距离。然而，使用密封板可能会导致模块尺寸的制造公差出现更大的变化。举例而言，使用密封板可能会增加VIM材料在z高度(即厚度)中的公差。
发明内容
本公开描述用于制造光电模块的过程，其涉及真空注射成型，并且在一些情况下，可以消除对密封板的需求，并且可以减少一个或多个公差的变化。
举例而言，在一方面，本公开描述了一种方法，该方法包括将印刷电路板基板支撑在第一真空注射工具上。印刷电路板基板具有安装在其上的至少一个光电组件，并且在背离第一真空注射工具的表面上具有阻焊层(solder mask)。该方法包括使第一真空注射工具和第二真空注射工具彼此靠近，以使第二真空注射工具的表面与阻焊层接触。随后，使用真空注射技术在上部工具与阻焊层之间的空间中提供第一环氧树脂。
一些实施方式包括以下一个或多个特征。例如该方法可以包括将第二真空注射工具的特征复制到第二环氧树脂中，以在至少一个光电组件中的每一个之上形成相应的光学元件。举例而言，由于使第一真空注射工具与第二真空注射工具朝向彼此，使得第二真空注射工具的表面与阻焊层接触，因而发生该复制。在一些情况下，第二环氧树脂对至少一个光电组件可操作以感测或发射的光的波长是透明的。然而，第一环氧树脂对光的该波长可以是不透明的。
在一些情况下，使第一真空注射工具和第二真空注射工具朝向彼此包括使第二真空注射工具的面向第一真空注射工具的平坦表面与阻焊层接触。
在一些实施方式中，印刷电路板基板覆盖的面积是支撑印刷电路板基板在其上的第一真空注射工具的面积的至少0.4倍。印刷电路板基板可包括入口孔，在真空注射技术期间第一环氧树脂流过该入口孔。印刷电路板基板还可以包括出口孔，在真空注射技术期间第一环氧树脂中的一些流过该出口孔。在执行真空注射技术期间，入口孔和出口孔可分别对齐第一真空工具中对应的入口孔和出口孔。并且，在执行真空注射技术期间，印刷电路板基板可通过双面胶带附接到第一真空注射工具。双面胶带可具有入口孔和出口孔，使得在执行该真空注射技术期间，双面胶带的入口孔和出口孔分别对齐第一真空工具中的入口孔和出口孔以及印刷电路板基板中的入口孔和出口孔。
在一些情况下，由于在上部工具与阻焊层之间的空间中提供第一环氧树脂，第一环氧树脂的部分限定横向地围绕相应的口的档板，以使入射到至少一个光电组件中的每一个或来自至少一个光电组件中的每一个的光通过。
在一些实施方式中，第二真空注射工具具有限定第一环氧树脂的朝外的斜切侧边缘的表面。在一些情况下，第一真空注射工具可具有带有倒角的大致上为正方形的表面。
在一些情况下，在执行真空注射技术期间，印刷电路板基板被间隔物横向围绕。间隔物可具有倒角。
根据以下具体实施方式、附图及权利要求，其他方面、特征和优点将显而易见。
附图说明
图1说明用于制造光电模块的晶圆级工艺中的阶段。
图2说明图1的一部分的放大版本。
图3说明包含间隔物的替代实施例。
图4是示出图4的各种组件的分解图。
图5是PCB基板的俯视图。
图6是下部注射工具的俯视图。
图7是上部注射工具的俯视图。
图8、9、10及11说明模块制造过程中的各个步骤。
具体实施方式
图1和图2说明用于制造光电模块的晶圆级工艺中的中间阶段。如图1和图2所示，黑色或其他环氧树脂20被注入在上部注射工具22与下部注射工具24之间。工具22、24例如可以是PDMS工具。环氧树脂20横向围绕安装在印刷电路板(PCB)基板27上的各个半导体装置晶粒(例如，光电检测器芯片或发光芯片)26。在示出的示例中，环氧树脂20还限定档板28，档板28的一部分横向围绕设置在晶粒26上的相应光学元件30，诸如网格光学阵列。在所示的示例中，档板28的形状和光学元件30的形状由上部注射工具24的面向PCB基板27的表面限定(例如，通过复制过程)。光学元件30例如可以由透明环氧树脂(即，对于要由芯片26感测或发射的光的波长是透明的环氧树脂)组成。
PCB基板27的顶表面和底表面上可具有电接触垫。举例而言，每个晶粒26的底部上的电触点可以通过相应的表面安装技术(surface mount technology，SMT)接触垫32电性耦接到PCB基板27。同样，每个晶粒26顶部上的电触点可以通过连接到垫36的相应引线接合34电性耦接到PCB基板27。SMT或其他电接触垫38设置在PCB基板27的底表面上。在PCB基板27的顶表面和底表面上方分别设置阻焊层40、42。举例而言，阻焊层可以存在于PCG基板的顶表面的外部非活动(active)区域上。如图1和图2进一步所示，可以使用双面胶带44将PCB基板27(通过下部阻焊层42)附接到下部注射工具24。
本公开的一方面在于使PCB基板27的x及y尺寸足够大，以使得当上部注射工具22及下部注射工具23在制造过程中朝向彼此移动时，PCB基板27的上部表面(或更具体地，阻焊层40的上部表面)对上部注射工具22及下部注射工具23限定相对的停止位置。举例而言，如图1所示，PCB基板27沿x轴延伸远超过光电装置晶粒26的位置并且远超过黑色环氧树脂20的位置。具体地，如以下更详细地说明的，在注入黑色环氧树脂20之前(且做为形成光学元件30的复制过程的一部分)，上部注射工具22及下部注射工具24朝向彼此移动，直到上部注射工具22的最底表面46接触PCB基板27上的阻焊层40的相对(即，上部)表面。通过使PCB基板27的横向尺寸(即，x-y)仅略小于下部注射工具24的对应尺寸，可以消除对密封板的需求。此外，在一些情况下，前述设置可以帮助减少所得的模块的制造公差的变化。举例而言，可以减少VIM材料20的z高度(即，厚度)的变化。此外，在一些情况下，可以获得对装置26上方的口46的更好控制(见图2)，如此可导致装置26的功能得到改善。
如图3和图4所示，一些实施方式还包含横向围绕PCB基板27的外围的间隔物50。间隔物50应具有与PCB基板27大致上相同的高度(包含阻焊层40、42的厚度)。间隔物50可以由例如树脂或其他材料组成。
图5、图6和图7分别说明根据一些实施方式的PCB基板27、下部注射工具24和上部注射工具22的更多细节。举例而言，如图5所示，PCB基板27具有正方形形状，其具有侧面尺寸(‘A’)(例如，150mm)及活动区52，在所示示例中，活动区52具有100mm×100mm的尺寸。PCB基板27在对角处具有孔54。在所示的示例中，孔54彼此分开160mm的距离(‘B’)，在VIM过程期间，孔54分别用作环氧树脂20流动的入口和出口。对于一些实施方式，部分或所有前述的细节可能不同。
如图6进一步所示，下部注射工具24可具有带有倒角56的大致上为正方形的表面。下部注射工具24的尺寸以及倒角56的存在是有用的，在一些情况下，允许下部注射工具24装配到其他装备中以进行后续处理(例如，切块机)。双面胶带44和间隔物50如果存在，可以具有与下部工具24大约相同的外侧尺寸，并且也可以具有倒角(见图4)。在所示示例中，工具24的外侧尺寸(‘C’)为9英寸(即，228.6mm)，并且从一个角56到另一个角的最大对角线距离为290mm。因此，对于所示的示例，PCB基板27的外侧尺寸(‘A’)约为工具24的外侧尺寸(‘C’)的三分之二。因此，在所描绘的示例中，PCB基板27覆盖的面积略大于第一工具24的其上支撑有印刷电路板基板的面积的0.4倍。工具24还具有以距离B彼此分隔开的孔58。这些孔58在VIM过程期间还分别提供环氧树脂20的流动的入口及出口，并因此与PCB基板27中的对应孔54对齐。同样，双面胶带44包含与工具24的前述孔58和PCB基板27的孔54对齐的入口孔59和出口孔59(见图4)。对于一些实施方式，部分或所有前述的细节可能不同。
如图7进一步所示，上部注射工具22可以是具有与下部注射工具24的对应的外侧尺寸相同的外侧尺寸(‘A’)的正方形(例如，9英寸×9英寸，或228.6mm×228.6mm)。在所示示例中，档板28的内部尺寸(‘D’)为106mm。上部注射工具24具有槽60，其与PCB基板27中的入口/出口孔54的位置重叠。图7还示出在上部注射工具22下方的PCB基板27的位置。对于一些实施方式，部分或所有前述的细节可能不同。
图8、图9、图10和图11说明用于制造如上所述的光电模块的晶圆级工艺中的各个步骤。如图8所示，透明环氧树脂100被分配(例如，通过喷射装备101)到上部注射工具22的表面上。注射工具22包含特征102，特征102限定在随后的操作中形成的光学元件30的形状。注射工具22还包含空间104，其随后被注入的黑色(非透明)环氧树脂填充。
如图9所示，将光电装置26安装在PCB基板27上，然后将PCB基板27附接(例如通过可热释放的双面胶带44)到下部注射工具24上。
参照图10，使上部注射工具22与下部注射工具24朝向彼此，直到上部工具22的最底表面46接触PCB基板27上的阻焊层的相对(即，上部)表面为止。表面46可以是例如面对第一真空注射工具24的平坦表面。为了使上部及下部注射朝向彼此，工具22、24中的一个(或两个)可以相对于另一工具依据实施方式移动。由于上部工具22的表面46接触PCB基板27的相对表面上的阻焊层的相对(即，上部)表面，上部工具22的特征102被复制到透明环氧树脂100中。接着可将环氧树脂100硬化(例如，通过UV和/或热固化)以形成光学元件30。
接着，参照图11，使黑色或其他不透明的环氧树脂20流过入口106，以填充上部工具22和PCB基板27上的阻焊层40之间的空间104。提供出口108以使任何额外的环氧树脂材料20流动。环氧树脂20接着可被硬化(例如，通过UV和/或热固化)。
在执行前述操作之后，可以移除上部工具22，可以将所获得的包含PCB基板的堆叠单片化(singulate)(例如，通过切割)，并且可以从胶带44移除所获得的各个模块。
前述技术可以助于减少z高度公差的变化。举例而言，该技术可以消除或减少由于使用玻璃载体、双面胶带44及PCB基板27而可能引起的变化。这些影响可以至少部分通过使用这样的配置来实现，在此配置中，使得上部工具22与PCB基板27(或PCB基板27上的阻焊层40的表面)直接接触。
此外，对于其中设置有载体玻璃以支撑PCB基板27的实施方式，由于很少或没有环氧树脂接触到玻璃(除了例如在VIM过程期间用于环氧树脂的流动的入口孔和出口孔之外)，所以可以容易地回收该载体玻璃以重复使用。
在一些实施方式中，上部工具22的内表面可以被成形为限定用于黑色环氧树脂20的斜切的面向外的侧边缘21(见图1至3)。斜切的侧边缘21可在注入的环氧树脂固化之后促进上部工具22的移除。
尽管注入的环氧树脂20可能被称为黑色环氧树脂，但是更普遍地，环氧树脂20优选地对于由安装在PCB基板27上的光电装置26(例如，光电检测器芯片或发光芯片)感测到或发射的波长的光是不透明的。
各种修改将是显而易见的，并且可以对前述示例进行修改。结合不同实施例所描述的特征在一些情况下可以合并在同一实施方式中，并且结合前述示例描述的各种特征在一些实施方式中可以被省略。因此，其他实施方式也包含在权利要求的范围内。

Claims (17)

1.一种方法，包括：
将印刷电路板基板支撑在第一真空注射工具上，所述印刷电路板基板具有安装在其上的至少一个光电组件，并且在背离所述第一真空注射工具的表面上具有阻焊层；
使所述第一真空注射工具和第二真空注射工具彼此靠近，以使所述第二真空注射工具的表面与所述阻焊层接触；以及
随后使用真空注射技术在上部工具与所述阻焊层之间的空间中提供第一环氧树脂。
2.根据权利要求1所述的方法，包括将所述第二真空注射工具的特征复制到第二环氧树脂中，以在所述至少一个光电组件中的每一个之上形成相应的光学元件。
3.根据权利要求2所述的方法，其中，由于使所述第一真空注射工具与所述第二真空注射工具朝向彼此，使得所述第二真空注射工具的表面与所述阻焊层接触，因而发生所述复制。
4.根据权利要求2至3中任一项所述的方法，其中，所述第二环氧树脂对所述至少一个光电组件能够操作以感测或发射的光的波长是透明的。
5.根据权利要求2至4中任一项所述的方法，其中，所述第一环氧树脂对光的所述波长是不透明的。
6.根据权利要求1至5中任一项所述的方法，其中，使所述第一真空注射工具和所述第二真空注射工具朝向彼此包括使所述第二真空注射工具的面向所述第一真空注射工具的平坦表面与所述阻焊层接触。
7.根据权利要求1至6中任一项所述的方法，其中，所述印刷电路板基板覆盖的面积是支撑所述印刷电路板基板在其上的所述第一真空注射工具的面积的至少0.4倍。
8.根据权利要求1至7中任一项所述的方法，其中，所述印刷电路板基板包括入口孔，在所述真空注射技术期间所述第一环氧树脂流过所述入口孔。
9.根据权利要求8所述的方法，其中，所述印刷电路板基板包括出口孔，在所述真空注射技术期间所述第一环氧树脂中的一些流过所述出口孔。
10.根据权利要求9所述的方法，其中，在执行所述真空注射技术期间，所述入口孔和所述出口孔分别对齐所述第一真空注射工具中对应的入口孔和出口孔。
11.根据权利要求10所述的方法，其中，在执行所述真空注射技术期间，所述印刷电路板基板通过双面胶带附接到所述第一真空注射工具。
12.根据权利要求11所述的方法，其中，所述双面胶带具有入口孔和出口孔，其中，在执行所述真空注射技术期间，所述双面胶带的所述入口孔和所述出口孔分别对齐所述第一真空注射工具中的所述入口孔和所述出口孔以及所述印刷电路板基板中的所述入口孔和所述出口孔。
13.根据权利要求1-12中任一项所述的方法，其中，由于在所述上部工具与所述阻焊层之间的所述空间中提供所述第一环氧树脂，所述第一环氧树脂的部分限定横向地围绕相应的口的档板，以使入射到所述至少一个光电组件中的每一个或来自所述至少一个光电组件中的每一个的光通过。
14.根据权利要求1-13中任一项所述的方法，其中，所述第二真空注射工具具有限定所述第一环氧树脂的朝外的斜切侧边缘的表面。
15.根据权利要求1-14中任一项所述的方法，其中，所述第一真空注射工具具有带有倒角的大致上为正方形的表面。
16.根据权利要求1-15中任一项所述的方法，其中，在执行所述真空注射技术期间，所述印刷电路板基板被间隔物横向围绕。
17.根据权利要求16所述的方法，其中，所述间隔物具有倒角。
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