DE69635527D1 - Anordnung zum abschirmen elektronischer bauteile vor elektromagnetischer strahlung - Google Patents

Anordnung zum abschirmen elektronischer bauteile vor elektromagnetischer strahlung

Info

Publication number
DE69635527D1
DE69635527D1 DE69635527T DE69635527T DE69635527D1 DE 69635527 D1 DE69635527 D1 DE 69635527D1 DE 69635527 T DE69635527 T DE 69635527T DE 69635527 T DE69635527 T DE 69635527T DE 69635527 D1 DE69635527 D1 DE 69635527D1
Authority
DE
Germany
Prior art keywords
arrangement
electronic components
electromagnetic radiation
components before
shielding electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69635527T
Other languages
English (en)
Other versions
DE69635527T2 (de
Inventor
J Mcdunn
Linda Limper-Brenner
D Press
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69635527D1 publication Critical patent/DE69635527D1/de
Application granted granted Critical
Publication of DE69635527T2 publication Critical patent/DE69635527T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
DE69635527T 1996-02-23 1996-12-13 Anordnung zum abschirmen elektronischer bauteile vor elektromagnetischer strahlung Expired - Fee Related DE69635527T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US606316 1996-02-23
US08/606,316 US5675473A (en) 1996-02-23 1996-02-23 Apparatus and method for shielding an electronic module from electromagnetic radiation
PCT/US1996/019984 WO1997031514A1 (en) 1996-02-23 1996-12-13 Apparatus shielding electronic module from electromagnetic radiation

Publications (2)

Publication Number Publication Date
DE69635527D1 true DE69635527D1 (de) 2006-01-05
DE69635527T2 DE69635527T2 (de) 2006-06-08

Family

ID=24427481

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69635527T Expired - Fee Related DE69635527T2 (de) 1996-02-23 1996-12-13 Anordnung zum abschirmen elektronischer bauteile vor elektromagnetischer strahlung

Country Status (11)

Country Link
US (1) US5675473A (de)
EP (1) EP1008281B1 (de)
JP (1) JP3033194B2 (de)
KR (1) KR100306730B1 (de)
CN (1) CN1097424C (de)
AU (1) AU695786B2 (de)
BR (1) BR9612517A (de)
DE (1) DE69635527T2 (de)
IL (1) IL124391A (de)
MX (1) MX9804128A (de)
WO (1) WO1997031514A1 (de)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5768103A (en) * 1996-08-30 1998-06-16 Motorola, Inc. Circuit board apparatus and apparatus and method for spray-cooling an electronic component
US5841634A (en) * 1997-03-12 1998-11-24 Delco Electronics Corporation Liquid-cooled baffle series/parallel heat sink
US6060966A (en) * 1997-10-31 2000-05-09 Motorola, Inc. Radio frequency filter and apparatus and method for cooling a heat source using a radio frequency filter
US9119705B2 (en) 1998-06-08 2015-09-01 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US20040022028A1 (en) * 1998-12-22 2004-02-05 Hildebrandt James J. Apparatus and system for cooling electric circuitry, integrated circuit cards, and related components
US7305843B2 (en) * 1999-06-08 2007-12-11 Thermotek, Inc. Heat pipe connection system and method
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US6104610A (en) * 1999-07-29 2000-08-15 Tilton; Charles L. EMI shielding fluid control apparatus
US6270262B1 (en) 1999-11-10 2001-08-07 Harris Corporation Optical interconnect module
US6601641B1 (en) * 2000-03-31 2003-08-05 Thomcast Communications, Inc. Oil cooled multistage depressed collector high power amplifier
US6404628B1 (en) * 2000-07-21 2002-06-11 General Motors Corporation Integrated power electronics cooling housing
US6462949B1 (en) 2000-08-07 2002-10-08 Thermotek, Inc. Electronic enclosure cooling system
US6434003B1 (en) * 2001-04-24 2002-08-13 York International Corporation Liquid-cooled power semiconductor device heatsink
US6646879B2 (en) 2001-05-16 2003-11-11 Cray Inc. Spray evaporative cooling system and method
US20030014667A1 (en) * 2001-07-16 2003-01-16 Andrei Kolichtchak Buffer overflow attack detection and suppression
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
JP2003060371A (ja) * 2001-08-16 2003-02-28 Nec Corp 通信機器筐体の放熱構造
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US7198096B2 (en) * 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6988534B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US7143615B2 (en) * 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
AU2003270882A1 (en) 2002-09-23 2004-05-04 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US7836706B2 (en) * 2002-09-27 2010-11-23 Parker Intangibles Llc Thermal management system for evaporative spray cooling
US7159414B2 (en) 2002-09-27 2007-01-09 Isothermal Systems Research Inc. Hotspot coldplate spray cooling system
US20040076408A1 (en) * 2002-10-22 2004-04-22 Cooligy Inc. Method and apparatus for removeably coupling a heat rejection device with a heat producing device
US6994151B2 (en) 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
DE10393588T5 (de) 2002-11-01 2006-02-23 Cooligy, Inc., Mountain View Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7156159B2 (en) * 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
WO2004042306A2 (en) 2002-11-01 2004-05-21 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US7000684B2 (en) 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US7090001B2 (en) * 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US6976528B1 (en) 2003-02-18 2005-12-20 Isothermal Systems Research, Inc. Spray cooling system for extreme environments
US7017654B2 (en) * 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US20040215764A1 (en) * 2003-04-23 2004-10-28 Sun Microsystems, Inc. Method, system, and program for rendering a visualization of aggregations of network devices
WO2005007060A2 (en) 2003-07-18 2005-01-27 Thermotek, Inc. Compression sequenced thermal therapy system
US8128672B2 (en) 2006-05-09 2012-03-06 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8100956B2 (en) 2006-05-09 2012-01-24 Thermotek, Inc. Method of and system for thermally augmented wound care oxygenation
US8574278B2 (en) 2006-05-09 2013-11-05 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8778005B2 (en) 2003-07-18 2014-07-15 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
US7150109B2 (en) * 2003-08-25 2006-12-19 Isothermal Systems Research, Inc. Dry-wet thermal management system
US7180741B1 (en) 2003-08-26 2007-02-20 Isothermal Systems Research, Inc. Spray cool system with a dry access chamber
US7043933B1 (en) 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
US7236363B2 (en) * 2003-09-22 2007-06-26 Hewlett-Packard Development Company, L.P. Liquid cooled system module
DK200301577A (da) * 2003-10-27 2005-04-28 Danfoss Silicon Power Gmbh Flowfordelingsenhed og köleenhed
JP3103678U (ja) * 2004-01-15 2004-08-19 陳晃涵 コンピュータの冷却装置
US7009842B2 (en) * 2004-01-30 2006-03-07 Isothermal Systems Research, Inc. Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US6952346B2 (en) 2004-02-24 2005-10-04 Isothermal Systems Research, Inc Etched open microchannel spray cooling
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
USD679023S1 (en) 2004-07-19 2013-03-26 Thermotek, Inc. Foot wrap
US10016583B2 (en) 2013-03-11 2018-07-10 Thermotek, Inc. Wound care and infusion method and system utilizing a thermally-treated therapeutic agent
US10765785B2 (en) 2004-07-19 2020-09-08 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
US7392660B2 (en) * 2004-08-05 2008-07-01 Isothermal Systems Research, Inc. Spray cooling system for narrow gap transverse evaporative spray cooling
US20060034053A1 (en) 2004-08-12 2006-02-16 Thermotek, Inc. Thermal control system for rack mounting
US7901191B1 (en) 2005-04-07 2011-03-08 Parker Hannifan Corporation Enclosure with fluid inducement chamber
EP1748512A1 (de) * 2005-07-25 2007-01-31 Harris Broadcast Systems Europe Flüssigkeitsgekühlter Hochfrequenzfilter
US7864528B2 (en) * 2005-07-25 2011-01-04 Harris Corporation Liquid cooled high-frequency filter
US7909861B2 (en) 2005-10-14 2011-03-22 Thermotek, Inc. Critical care thermal therapy method and system
EP1941588A4 (de) * 2005-10-27 2011-03-16 Charles L Manto System und verfahren zur bereitstellung eines zertifizierbaren elektromagnetischen impulses und zum rfi-schutz durch in massen hergestellte abgeschirmte behälter und räume
WO2007098077A2 (en) 2006-02-16 2007-08-30 Cooligy, Inc. Liquid cooling loops for server applications
US7522417B2 (en) * 2006-03-30 2009-04-21 Wisconsin Alumni Research Foundation Multi-mode fluid cooling system and method
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US8149579B2 (en) * 2008-03-28 2012-04-03 Johnson Controls Technology Company Cooling member
US8495890B2 (en) * 2007-01-22 2013-07-30 Johnson Controls Technology Company Cooling member
US7764041B2 (en) * 2007-01-22 2010-07-27 Johnson Controls Technology Company System and method to extend synchronous operation of an active converter in a variable speed drive
USD662214S1 (en) 2007-04-10 2012-06-19 Thermotek, Inc. Circumferential leg wrap
WO2008127644A1 (en) * 2007-04-13 2008-10-23 Xcelaero Corporation Evaporative cooling system for electronic components
CN101355867B (zh) * 2007-07-25 2012-05-30 莱尔德电子材料（上海）有限公司 屏蔽装置
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US7957166B2 (en) * 2007-10-30 2011-06-07 Johnson Controls Technology Company Variable speed drive
US8758419B1 (en) 2008-01-31 2014-06-24 Thermotek, Inc. Contact cooler for skin cooling applications
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
WO2009126226A1 (en) * 2008-04-08 2009-10-15 Cmc Daymark Corporation Thermal direct printing dissolving paper
CN102171378A (zh) 2008-08-05 2011-08-31 固利吉股份有限公司 用于光学和电子器件的热管理的键合金属和陶瓷板
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
US8081466B2 (en) * 2009-07-06 2011-12-20 Rockwell Automation Technologies, Inc. Overmolded electronics enclosure
US8488315B2 (en) * 2009-08-18 2013-07-16 GM Global Technology Operations LLC Power module assemblies with staggered coolant channels
TW201128154A (en) * 2010-02-12 2011-08-16 Micro Base Technology Corp Cooling and heat-dissipation system, and cooling device thereof
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8779301B2 (en) * 2010-09-03 2014-07-15 General Electric Company Monitoring system for use in monitoring the operation of machinery and method of retrofitting monitoring system
WO2012051704A1 (en) 2010-10-19 2012-04-26 Electronic Motion Systems Holdings Limited A power module for converting dc to ac
US10512587B2 (en) 2011-07-27 2019-12-24 Thermotek, Inc. Method and apparatus for scalp thermal treatment
GB2498006B (en) * 2011-12-22 2014-07-09 Rolls Royce Plc Gas turbine engine systems
WO2013162728A1 (en) 2012-04-24 2013-10-31 Thermotek, Inc. Method and system for therapeutic use of ultra-violet light
US10300180B1 (en) 2013-03-11 2019-05-28 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
GB201306674D0 (en) * 2013-04-12 2013-05-29 Rolls Royce Plc Rigid Raft for a Gas Turbine Engine
CN103533811B (zh) * 2013-10-22 2016-03-02 天津优瑞纳斯液压机械有限公司 促动器电子元件散热箱
US9669233B2 (en) 2013-11-11 2017-06-06 Thermotek, Inc. Method and system for wound care
JP6299551B2 (ja) * 2014-10-01 2018-03-28 富士通株式会社 発熱装置の冷却装置
US9445531B1 (en) * 2015-05-01 2016-09-13 Baidu Usa Llc Air washing for open air cooling of data centers
DE102016103920A1 (de) 2016-03-04 2017-09-07 Amazonen-Werke H. Dreyer Gmbh & Co. Kg Zentrifugalstreuer zum Ausbringen von Streugut
CN108563305B (zh) * 2018-01-29 2023-12-19 广东西江数据科技有限公司 一种喷淋式液冷服务器
US11856689B2 (en) 2022-01-28 2023-12-26 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies and methods of fabricating the same

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725566A (en) * 1972-05-01 1973-04-03 Us Navy Evaporative cooling and heat extraction system
US4270572A (en) * 1979-09-26 1981-06-02 Jarzynka Clifford J Hinging downspout assembly
US4399484A (en) * 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
GB2124036B (en) * 1982-03-09 1985-01-09 Vero Electronics Ltd An improved cooling system for a circuit board installation
US4407136A (en) * 1982-03-29 1983-10-04 Halliburton Company Downhole tool cooling system
DE3248147A1 (de) * 1982-12-27 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Metallisierte formteile aus kunststoff fuer technische gehaeuse zur abschirmung gegenueber elektromagnetischen stoerfeldern
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
FR2578553B1 (fr) * 1985-03-06 1989-01-06 Bertin & Cie Installation de refroidissement par pulverisation
FR2579060B1 (fr) * 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
US4854377A (en) * 1985-11-19 1989-08-08 Nec Corporation Liquid cooling system for integrated circuit chips
CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
US4829432A (en) * 1987-12-28 1989-05-09 Eastman Kodak Company Apparatus for shielding an electrical circuit from electromagnetic interference
US4847731A (en) * 1988-07-05 1989-07-11 The United States Of America As Represented By The Secretary Of The Navy Liquid cooled high density packaging for high speed circuits
US4912600A (en) * 1988-09-07 1990-03-27 Auburn Univ. Of The State Of Alabama Integrated circuit packaging and cooling
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nec Corp Kühlungsstruktur für elektronische Bauelemente
US5174364A (en) * 1988-09-21 1992-12-29 Nec Corporation Cooling abnormality detection system for electronic equipment
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices
US5057968A (en) * 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
US4964019A (en) * 1989-12-27 1990-10-16 Ag Communication Systems Corporation Multilayer bonding and cooling of integrated circuit devices
US5232164A (en) * 1990-05-09 1993-08-03 Resch D R Precisely adjustable atomizer
US5204497A (en) * 1990-05-30 1993-04-20 Zeos International, Inc. Computer front panel with offset airflow louvers
DE4102019C1 (de) * 1991-01-24 1992-07-09 Schroff Gmbh, 7541 Straubenhardt, De
US5131233A (en) * 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
US5190099A (en) * 1991-05-01 1993-03-02 The United States Of The America As Represented By The Secretary Of The Army Pulsatile impinging cooling system for electronic IC modules and systems using fluidic oscillators
EP0516478A2 (de) * 1991-05-30 1992-12-02 Nec Corporation Kühlungsstruktur für integrierte Schaltungen
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
US5207613A (en) * 1991-07-08 1993-05-04 Tandem Computers Incorporated Method and apparatus for mounting, cooling, interconnecting, and providing power and data to a plurality of electronic modules
US5166863A (en) * 1991-07-15 1992-11-24 Amdahl Corporation Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling
DE59206544D1 (de) * 1991-10-11 1996-07-18 Asea Brown Boveri Ein- und/oder Ausgabegerät für Prozessdaten
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
US5177666A (en) * 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
US5175395A (en) * 1991-11-27 1992-12-29 Rockwell International Corporation Electromagnetic shield
US5220804A (en) * 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
CA2088821C (en) * 1992-02-05 1999-09-07 Hironobu Ikeda Cooling structure for integrated circuit
JP2852152B2 (ja) * 1992-02-06 1999-01-27 甲府日本電気株式会社 電子装置の冷却装置
DE69321501T2 (de) * 1992-02-10 1999-03-04 Nec Corp Kühlvorrichtung für Bauteile mit elektronischen Schaltungen
JP2745948B2 (ja) * 1992-04-06 1998-04-28 日本電気株式会社 集積回路の冷却構造
JP2853481B2 (ja) * 1992-09-30 1999-02-03 日本電気株式会社 半導体素子の冷却構造
US5436793A (en) * 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
DE69400401T2 (de) * 1993-11-16 1997-03-27 Digital Equipment Corp Elektromagnetische Interferenzabschirmung für elektrische Baugruppen
US5431974A (en) * 1993-12-16 1995-07-11 Pierce; Patricia Electromagnetic radiation shielding filter assembly

Also Published As

Publication number Publication date
BR9612517A (pt) 1999-07-20
CN1207864A (zh) 1999-02-10
CN1097424C (zh) 2002-12-25
EP1008281B1 (de) 2005-11-30
EP1008281A4 (de) 2000-06-14
AU695786B2 (en) 1998-08-20
KR19990087186A (ko) 1999-12-15
US5675473A (en) 1997-10-07
MX9804128A (es) 1998-09-30
JP3033194B2 (ja) 2000-04-17
WO1997031514A1 (en) 1997-08-28
IL124391A0 (en) 1998-12-06
JPH11503274A (ja) 1999-03-23
IL124391A (en) 2001-03-19
EP1008281A1 (de) 2000-06-14
AU1334597A (en) 1997-09-10
DE69635527T2 (de) 2006-06-08
KR100306730B1 (ko) 2002-02-19

Similar Documents

Publication Publication Date Title
DE69635527D1 (de) Anordnung zum abschirmen elektronischer bauteile vor elektromagnetischer strahlung
DE69127154D1 (de) Anordnung zur Montierung elektronischer Bauteile
EE03728B1 (et) Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil
DE69018943D1 (de) Anordnung und Gehäuse zur elektromagnetischen Abschirmung.
DE69518677T2 (de) Elektronischer Übersetzungsapparat
DE69700126D1 (de) Deckelkonstruktion zum Abschirmen von elektronischen Bauteile gegen elektromagnetische Störungen
DE29612557U1 (de) Abschirmeinrichtung gegen elektromagnetische Strahlung
TW377891U (en) Shield structure for electronic apparatus
DE59801434D1 (de) Baugruppenträger mit Abschirmblechen
DE9318909U1 (de) Abschirmhaube für Schaltungsplatinen
GB9404728D0 (en) Arrangements for use with radiation shielded enclosures
DE29618628U1 (de) Abgeschirmter Baugruppenträger
DE50006997D1 (de) Anordnung zur EMV-Abschirmung
GB2322973B (en) Shielding case for electronic equipment
DE29618625U1 (de) Abgeschirmter Baugruppenträger
KR970026480U (ko) 전자파 차폐장치
KR960002948U (ko) 보드용 전자파 차폐 판넬
DE29511099U1 (de) Anordnung zur Reduzierung der elektromagnetischen Abstrahlung von Leiterkarten
DE29515429U1 (de) Anordnung zum Entwurf und Testen elektronischer Systeme
DE29718134U1 (de) Vorrichtung zur Abschirmung elektromagnetischer Strahlen
KR940019866U (ko) 인쇄회로기판용 쉴드케이스조립장치
KR970046263U (ko) 전자파 차폐 장치
KR940023788U (ko) 전자부품용 쉴드케이스
KR950028956U (ko) 모니터용 전자파 차단판
KR960024983U (ko) 전자파 차폐용 판넬

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee