DE69700126D1 - Deckelkonstruktion zum Abschirmen von elektronischen Bauteile gegen elektromagnetische Störungen - Google Patents

Deckelkonstruktion zum Abschirmen von elektronischen Bauteile gegen elektromagnetische Störungen

Info

Publication number
DE69700126D1
DE69700126D1 DE69700126T DE69700126T DE69700126D1 DE 69700126 D1 DE69700126 D1 DE 69700126D1 DE 69700126 T DE69700126 T DE 69700126T DE 69700126 T DE69700126 T DE 69700126T DE 69700126 D1 DE69700126 D1 DE 69700126D1
Authority
DE
Germany
Prior art keywords
electronic components
electromagnetic interference
against electromagnetic
components against
lid construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69700126T
Other languages
English (en)
Other versions
DE69700126T2 (de
Inventor
David Robert King
Joseph C Rowan
Bradley E Reis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/643,292 external-priority patent/US5761053A/en
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Publication of DE69700126D1 publication Critical patent/DE69700126D1/de
Application granted granted Critical
Publication of DE69700126T2 publication Critical patent/DE69700126T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE1997600126 1996-05-08 1997-04-30 Deckelkonstruktion zum Abschirmen von elektronischen Bauteile gegen elektromagnetische Störungen Expired - Lifetime DE69700126T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/643,292 US5761053A (en) 1996-05-08 1996-05-08 Faraday cage
US08/735,838 US5763824A (en) 1996-05-08 1996-10-23 Lid assembly for shielding electronic components from EMI/RFI interferences

Publications (2)

Publication Number Publication Date
DE69700126D1 true DE69700126D1 (de) 1999-04-15
DE69700126T2 DE69700126T2 (de) 1999-08-19

Family

ID=27094227

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997600126 Expired - Lifetime DE69700126T2 (de) 1996-05-08 1997-04-30 Deckelkonstruktion zum Abschirmen von elektronischen Bauteile gegen elektromagnetische Störungen

Country Status (3)

Country Link
EP (1) EP0806891B1 (de)
JP (1) JPH1056285A (de)
DE (1) DE69700126T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
US6090728A (en) * 1998-05-01 2000-07-18 3M Innovative Properties Company EMI shielding enclosures
US6157546A (en) * 1999-03-26 2000-12-05 Ericsson Inc. Shielding apparatus for electronic devices
DE19932418B4 (de) * 1999-05-20 2013-12-19 Hans Schmied Gmbh Rahmen für eine HF-Abdeckung, sowie Verfahren zu seiner Herstellung
JP2001185888A (ja) * 1999-12-27 2001-07-06 Mitsubishi Electric Corp シールドケース
NL1016549C2 (nl) * 2000-10-06 2002-04-10 Stork Screens Bv Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
US6740959B2 (en) * 2001-08-01 2004-05-25 International Business Machines Corporation EMI shielding for semiconductor chip carriers
SG118244A1 (en) * 2004-04-23 2006-01-27 Mi Holdings Pte Ltd Radio-frequency and electro-magnetic isolation forcover and isolated cover
JP2011018873A (ja) 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
JP5678488B2 (ja) 2010-06-28 2015-03-04 富士ゼロックス株式会社 機器
CN103943610B (zh) * 2014-04-16 2016-12-07 华为技术有限公司 一种电子元件封装结构及电子设备
WO2016000184A1 (zh) 2014-06-30 2016-01-07 华为技术有限公司 一种交换机模式切换方法、设备及系统
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
CN109152230A (zh) * 2018-08-28 2019-01-04 上海幂方电子科技有限公司 柔性电路及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575578A (en) * 1983-01-05 1986-03-11 Keene Corporation Radiation shielding and thermally conductive gasket with internal bonding agent
JPH06505597A (ja) * 1991-03-04 1994-06-23 モトローラ・インコーポレーテッド 非導電性電子回路パッケージ用シールド装置
DE9214394U1 (de) * 1992-10-23 1992-12-17 Siemens AG, 8000 München Befestigung einer Abschirmung mit einer Leiterplatte
WO1996006520A1 (en) * 1994-08-19 1996-02-29 W. L. Gore & Associates, Inc. A see-through radiation shielded assembly

Also Published As

Publication number Publication date
EP0806891A1 (de) 1997-11-12
DE69700126T2 (de) 1999-08-19
EP0806891B1 (de) 1999-03-10
JPH1056285A (ja) 1998-02-24

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