DE69616715T2 - Mikrowellen-Abschirmungsstrukturen - Google Patents

Mikrowellen-Abschirmungsstrukturen

Info

Publication number
DE69616715T2
DE69616715T2 DE69616715T DE69616715T DE69616715T2 DE 69616715 T2 DE69616715 T2 DE 69616715T2 DE 69616715 T DE69616715 T DE 69616715T DE 69616715 T DE69616715 T DE 69616715T DE 69616715 T2 DE69616715 T2 DE 69616715T2
Authority
DE
Germany
Prior art keywords
shielding structures
microwave shielding
microwave
structures
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69616715T
Other languages
English (en)
Other versions
DE69616715D1 (de
Inventor
Perry A Macdonald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DirecTV Group Inc
Original Assignee
Hughes Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Electronics Corp filed Critical Hughes Electronics Corp
Publication of DE69616715D1 publication Critical patent/DE69616715D1/de
Application granted granted Critical
Publication of DE69616715T2 publication Critical patent/DE69616715T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0056—Casings specially adapted for microwave applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B15/00—Suppression or limitation of noise or interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE69616715T 1995-09-21 1996-09-17 Mikrowellen-Abschirmungsstrukturen Expired - Lifetime DE69616715T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/531,803 US5581217A (en) 1995-09-21 1995-09-21 Microwave shielding structures comprising parallel-plate waveguide

Publications (2)

Publication Number Publication Date
DE69616715D1 DE69616715D1 (de) 2001-12-13
DE69616715T2 true DE69616715T2 (de) 2002-05-08

Family

ID=24119110

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69616715T Expired - Lifetime DE69616715T2 (de) 1995-09-21 1996-09-17 Mikrowellen-Abschirmungsstrukturen

Country Status (4)

Country Link
US (1) US5581217A (de)
EP (1) EP0764995B1 (de)
JP (1) JPH09172292A (de)
DE (1) DE69616715T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021117026A1 (de) 2021-04-01 2022-10-06 Hyundai Mobis Co., Ltd. Wellenleiter für ein radar

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9601955L (sv) * 1996-05-23 1997-09-08 Ericsson Telefon Ab L M Vågledaranordning och förfarande för dess framställning
SE508680C2 (sv) * 1996-06-19 1998-10-26 Ericsson Telefon Ab L M Integrerade filter
EP0940849A1 (de) * 1998-03-05 1999-09-08 Interuniversitair Micro-Elektronica Centrum Vzw Verlustarmes elektrisch-leitendes Muster auf einem Substrat und dessen Herstellungsverfahren
JP2001308660A (ja) 2000-04-20 2001-11-02 Alps Electric Co Ltd 高周波増幅器
JP3570359B2 (ja) * 2000-08-24 2004-09-29 三菱電機株式会社 高周波モジュール
US7359693B2 (en) * 2003-05-23 2008-04-15 Rfstream Corporation Enclosure and substrate structure for a tuner module
US20060002099A1 (en) * 2004-06-30 2006-01-05 Stoneham Edward B Electromagnetic shield assembly
US7813145B2 (en) * 2004-06-30 2010-10-12 Endwave Corporation Circuit structure with multifunction circuit cover
US7348666B2 (en) * 2004-06-30 2008-03-25 Endwave Corporation Chip-to-chip trench circuit structure
US7411279B2 (en) * 2004-06-30 2008-08-12 Endwave Corporation Component interconnect with substrate shielding
US7280080B2 (en) * 2005-02-11 2007-10-09 Andrew Corporation Multiple beam feed assembly
WO2006099119A2 (en) * 2005-03-11 2006-09-21 Rfstream Corporation An integrated circuit layout for a television tuner
WO2008015371A1 (en) * 2006-08-04 2008-02-07 Arm Limited A bus interconnect device and a data processing apparatus including such a bus interconnect device
FR2929069B1 (fr) * 2008-03-21 2010-03-12 Thales Sa Module de confinement electromagnetique pour composants electroniques
US9439307B2 (en) 2014-02-06 2016-09-06 Tektronix, Inc. Laminated punched sheet metal electronic enclosure/shield with integrated gaskets

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1218713A (en) * 1983-05-31 1987-03-03 Hiroshi Saka Microwave integrated circuit immune to adverse shielding effects
US4801905A (en) * 1987-04-23 1989-01-31 Hewlett-Packard Company Microstrip shielding system
FR2655195B1 (fr) * 1989-11-24 1997-07-18 Mitsubishi Electric Corp Dispositif a semiconducteurs comportant un blindage contre le rayonnement electromagnetique et procede de fabrication.
JPH04256203A (ja) * 1991-02-07 1992-09-10 Mitsubishi Electric Corp マイクロ波帯ｉｃ用パッケージ
US5450046A (en) * 1992-10-29 1995-09-12 Nec Corporation Composite microwave circuit module assembly and its connection structure
JPH06164265A (ja) * 1992-11-16 1994-06-10 Toshiba Corp マイクロ波増幅器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021117026A1 (de) 2021-04-01 2022-10-06 Hyundai Mobis Co., Ltd. Wellenleiter für ein radar

Also Published As

Publication number Publication date
EP0764995A1 (de) 1997-03-26
US5581217A (en) 1996-12-03
DE69616715D1 (de) 2001-12-13
JPH09172292A (ja) 1997-06-30
EP0764995B1 (de) 2001-11-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: WITTE, WELLER & PARTNER, 70178 STUTTGART