CN1097424C - 屏蔽电子模块免于电磁辐射的装置 - Google Patents
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- 230000005670 electromagnetic radiation Effects 0.000 title claims description 15
- 239000012530 fluid Substances 0.000 claims abstract description 95
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000009826 distribution Methods 0.000 claims description 21
- 238000012216 screening Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 29
- 239000002826 coolant Substances 0.000 description 17
- 239000007921 spray Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- 238000005507 spraying Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
本发明提供一种用于喷雾冷却被屏蔽的电子模块免于电磁辐射。该装置包括一个盖(10),此盖具有第一表面(12)和与此第一表面(12)相对的第二表面。第二表面(14)具有一个界定了周边的边缘(16)和一个凹进区域(18)。一个壁(20)与凹进区域(18)连通,此壁(20)和边缘(16)的一至少一部分界定了一个分隔室(22)。一种电磁干扰衰减材料(24)被设置在分隔室中(22),并且一个流体分配管路(26)被设置在盖(10)中。一个尺寸适于接纳一个喷嘴的喷嘴壳体(30)位于流体分配管路(26)中。此喷嘴壳体(30)具有一个接受端(32)和一个喷射端(34)。喷射端(34)具有一个孔(36)与分隔室(22)连通,接受端(32)与流体分配管路(26)连通。
Description
技术领域
本发明总体上讲是涉及电子模块的屏蔽,更具体地讲是涉及用于屏蔽电子模块使其免于电磁辐射的装置和方法。
背景技术
产生热量的电子模块在工作过程中容易发生电磁干扰(EMI),这些电子模块诸如多片组件、电子混合组件(例如功率放大器)和无源元器件(例如滤波器)。此外,工作在高频环境诸如射频通信系统中的电子模块本身可能就是不希望的电磁辐射之源。
为保持模块正常工作以及使模块符合适用的政府法规,由电子模块产生和接收的EMI常常必须被衰减。可以采用诸如屏蔽之类的防护罩,使电磁辐射转移至地。与其它电子模块一样,被屏蔽的电子模块在工作过程中通常需要冷却。
一般情况下,被屏蔽的电子模块是自然冷却的或者通过强制空气对流冷却的,由于其热容量和传热系数较低,强制空气对流冷却需要使大量的空气流过模块与其屏蔽之间的空间或者通过安装至模块的大散热器。
因此,空气冷却的模块通常是很大的。另外,空气冷却过程本身可能招致不希望的噪声并使模块受到例如灰尘的污染。再有,使空气流经模块屏蔽可能需要在屏蔽中有开口,不仅空气可能通过这些开口,而且不希望的电磁辐射也可能通过这些开口。
蒸发式喷雾冷却(spray cooling)的特点是,雾化的液体微滴直接喷射至产生热量的装置例如电子模块的表面上。当液体微滴撞击模块的表面时,一层薄的液体膜雾盖模块,并且热量主要是通过液体从模块表面的蒸发而耗散的。
虽然蒸发式喷雾冷却是许多电子应用中的一种优选的散热方法,但公知的喷雾冷却系统不是专门设计用于冷却EMI屏蔽的电子模块。
发明内容
因此,存在对小型、高效的喷雾冷却装置的需要,这种冷却装置用于喷雾冷却电磁辐射屏蔽的电子模块。
根据本发明的一个方面,上述需要是由一种屏蔽装置满足的,该屏蔽装置用于屏蔽电子模块使其免于电磁辐射,该装置包括一个盖,此盖具有第一表面和与此第一表面相对的第二表面。第二表面具有一个界定了周边的边缘和一个凹进区域。一个壁与凹进区域连通,此壁和边缘的至少一部分界定了一个分隔室(compartment)。一种电磁干扰衰减材料设置在分隔室中,并且一个流体分配管路(manifold)设置在盖中。一个喷嘴壳体(nozzle housing)位于流体分配管路中,此喷嘴壳体的尺寸适于接纳一个喷嘴。喷嘴壳体具有一个接受端(receptacle end)和一个喷射端。喷射端具有一个孔,此孔与分隔室连通,而接受端与流体分配管路连通。
根据本发明的另一方面,一种用于喷雾冷却被屏蔽的电子模块的装置包括一个壳体,此壳体中设有一个壁。此壁界定了第一分隔室和第二分隔室。一种电磁干扰(EMI)衰减材料与此壁相联。一个喷嘴设置在第一分隔室中,以接收和雾化流体并将雾化的流体排放至第一分隔室中。
根据本发明的再一方面,一种喷雾冷却被屏蔽的电子模块的方法包括以下步骤:提供一个盖,此盖具有第一表面和与此第一表面相对的第二表面,第二表面具有一个界定了周边的边缘和一个凹进区域,凹进区域中设有一个壁,此壁和边缘的至少一部分界定了一个分隔室;
将一种EMI衰减材料施加至分隔室的至少一部分上;将一种流体供给一个流体分配管路,此管路形成于盖中;通过设置在流体分配管路中的一个喷嘴接收流体,此喷嘴具有一个与分隔室连通的喷射端并具有设置在喷射端的顶端处的一个孔;通过喷嘴的喷射端将流体雾化;以及通过孔将雾化的流体排放至分隔室。
附图说明
对于本领域的普通技术人员而言,从下面的通过图示和举例说明对本发明的优选实施例进行的描述,本发明的优点将变得很清楚。正如将能理解的,本发明容许其它不同的实施方式,并且其细节容许在各个方面进行修改。因此,附图和说明书应被视为描绘性的,而不是限制性的。
图1是根据本发明的第一实施例的用于屏蔽电子模块免于电磁辐射的装置的顶侧的透视图;
图2是图1中所示的装置的底侧的局部透视图;
图3是用于喷雾冷却如图1和2中所示的被屏蔽电子模块的一个喷嘴壳体的侧视图;
图4是一个展开的透视图,用于描绘图1和2中所示的装置的闭环流体流动;
图5是根据本发明的第二实施例的用于屏蔽电子模块免于电磁辐射的装置的透视图。
具体实施方式
现在参照附图,其中相同的数字表示相同的部件,图1和2分别是根据本发明的第一实施例的屏蔽装置的顶部和底部的透视图,该屏蔽装置用于屏蔽一个电子模块(module),使其免于电磁辐射。如图1所示,一个盖10具有一个顶表面12和一个与顶表面12相对的底表面14,此盖最好是模压的塑料,诸如聚碳酸酯,但也可以是其它材料,诸如金属。正如可以从图2中看到的,底表面14具有一个边缘16,此边缘界定了底表面14的周边。底表面14还具有一个相对于边缘16凹进的区域18。
在底表面14的凹进区域18中设有一个或多个壁20,这些壁大致垂直于凹进区域18。图中示出了多个壁20。一个或多个壁20和边缘16的至少一部分界定了一个或多个分隔室22。图2中示出了多个分隔室。可以设想,分隔室22可以是任何几何形状的。例如,从凹进区域18的一侧向凹进区域18的另一侧延伸的一个直壁和边缘16的位于此直壁每一侧的部分可以形成两个矩形的分隔室。
在至少一个分隔室22中形成有电磁干扰(EMI)衰减材料,诸如金属,合适的金属是公知的并且可以方便地得到。碳、铁和类似材料也可用作EMI衰减材料。EMI衰减材料将分隔室22屏蔽,使电磁辐射降低到一定程度。采用EMI衰减材料处理的分隔室22围绕电子模块(未示出),因此,电子模块或其部分得以免于产生或接收EIM(达到实际可行的程度)。
在按常规方式模压盖10之后,可以按照多种公知方法进行分隔室22的金属化,诸如柔性(compliant)导电材料覆模(overmolding)、汽相淀积、金属镀或者涂敷导电漆。另一种方案是,盖10可以是复合结构,包括(例如)一种树脂和一种EMI衰减材料,诸如金属、碳或其它合适的材料。
分隔室22最好接地或者另外电连接至电子模块,以便将不希望的电磁辐射转移至地。例如,可以采用一个导电衬垫来提供分隔室22与电子模块之间的电连接。
再参照图1,在盖10的顶表面12中设有多个流体分配管路26。如图中所示,每一流体分配管路26包括一个与特定的分隔室22相对的凹进表面。在盖10中,可以按照不同的方式形成不同几何断面的流体分析管路26。例如,流体分配管路26可以具有圆形的、锥形的或者矩形的断面。管路26可以是在盖10的顶表面12中形成的沟槽,或者可以是位于盖10内的独立形成的管道。
由多个互连的流体路径形成的流体收集管道(conduit)28也可以设在盖10中。流体收集管道28连接盖10的顶表面12和底表面14,并且最好靠近每一分隔室22的周边的至少一部分。
在每一流体分配管路26中设有至少一个喷嘴壳体30。如图3中详细示出的,喷嘴壳体30具有一个接受端32,它设置在流体分配管路上(如图1所示)。喷嘴壳体30的喷射端34与一个分隔室22连通(如图2所示),并且包括一个孔36,此孔的直径约为0.15mm。
每一喷嘴壳体30的尺寸适合接纳一个喷嘴(未示出)。可以设想,喷嘴可以通过例如压入装配、焊接或粘结固定至喷嘴壳体30。另一种方案是,喷嘴可以一体地形成在每一流体分配管路中。
喷嘴最好是微型喷嘴,诸如单路压力旋流(pressure-swirl)喷嘴,这种喷嘴约0.3mm高,并且可以由任何合适的材料制造。合适材料的一个例子是金属材料,例如黄铜。单路压力旋流喷嘴详细描述于授予Tilton等人的美国专利5220804中,该美国专利在此被引作参考,并且其中描述的喷嘴可以从位于华盛顿Colton的等温系统研究公司(Isothermal SystemsResearch Inc.)购买到。
在总体上参照图1、2和3描述的装置的第一实施例的正常工作过程中,每一流体分配管路26从流体输入口60接收冷却剂(未示出),并将冷却剂供给装有喷嘴(未示出)的一个或多个喷嘴壳体30的接受端32。喷嘴使冷却剂雾化,并且通过孔36将雾化的流体40排放至与流体分配管路26相对的一个或多个分隔室22。流体40可以从孔36按照与凹进区域18大致垂直的角度排放,通过负压作用由流体收集口28收集(将结合图4进一步论述),并且通过流体排出口62排出。
冷却剂优选FluorinertTM,该产品可从3M公司得到,其序号为FC-72,但也可以是其它合适的绝缘冷却剂,这类液体材料是公知的并且可以方便地得到。例如,一种化学特性与FluorinertTM相似的全氟化碳液体可以从Ausimont Galden得到。
因此,由分隔室22屏蔽EMI的电子模块是根据每一模块的需要单独地喷雾冷却的。位于一个分隔室22中的具有高达300W/cm2的功率密度的电子模块能够被有效地冷却。消除直接来自于独立的电子模块的热量有助于降低模块和其相关元器件的工作温度,从而通过消除热振动和相关的热应力提高可靠性。
在气冷系统中可能通过不希望的电磁辐射的孔被消除了。与气孔不同,流体输入口和排出口60、62可以远离电子模块定位,并且具有相对于其长度而言非常小的直径。因此,可能会引起EMI的高频电磁波显著地减弱。
在气冷系统中存在的EMI屏蔽与电子模块之间的大的间隔约束,在这里描述的喷雾冷却装置中实质上不存在了。盖10可以靠近电子模块的表面设置,只要安装至模块上的元器件的高度允许的话,从而形成紧凑的模块封装结构。并且,与当热量在大的面积例如大的散热器上扩散时最有效的气冷方式不同,喷雾冷却促使热量集中,这是引起封装壳体的体积和重量减小的另一因素。
参照图4,此图描绘了用于图1和2中所示的装置的一种闭环的流体流动方式,一个板44可以安装并密封至盖10的顶表面12上。或者,理想的是可以采用气体辅助注模工艺,将板44和盖10制成一个整体部件,在模制过程中形成内空隙(void)。还可以设想,替代板44,可以将一个流体供给管路(将结合图5论述)安装并密封至顶表面12的周边。
另一个板46具有安装至其上的一个或多个电子模块45,此板46的一种选择可以是印刷电路板。板46通过任何合适的手段紧固至边缘16(如图2所示)的至少一部分上。板46上的电子模块45(或其部分)是如此定位的,即,已采用EMI衰减材料处理的或者部分地由EMI衰减材料构成的一个分隔室22(如图2所示)围绕一个或多个模块45。
如图所示,一个连接器47为电子模块45提供电连接。板46上的被屏蔽的模块45可以放置在一个框架式(rack-type)壳体中,诸如VME(Versa Module Europe)盒或EIA(电子工业协会)子框架(sub-rack)(或者其它类型的壳体),并且可以连接至其它模块。
在正常工作过程中,通过管52连接至设置在盖10上的流体输入口60的一个流体泵50将冷却剂流体供给流体分配管路26。不过,将能够理解的是,当采用一个流体供给管路(将结合图5论述)替代板44时,流体输入口60可以设置在流体供给管路上并且再通过管52连接至流体泵50。
当流体按照上述方式被雾化和排放到分隔室22之后,在盖10中形成一个连续的沟道的流体收集管道28主要通过负压差作用从分隔室22收集流体。
一个冷凝器53通过管54连接至泵50并且通过管56连接至一个流体排出口62,此冷凝器接收来自于流体收集管道28的流体。冷凝器53排出流体中的热量,从而降低了流体的温度并且使其返回至主要呈液相的状态。风扇58可以选择用于扩展冷凝器53的致冷能力。被冷却的流体从冷凝器53供给流体输入口60。由此,形成了冷却剂的闭环流动。将能理解的是,在任一给定的点处,冷却剂可能是蒸气、液体或者蒸气和液体的混合物。
应能设想,可以将任何用于提供冷却剂的流动的常规手段与本发明的所述实施例结合使用,并且,可以将一个以上的盖10连接至单个冷却剂源,或者,可以将一个或多个冷却剂源连接至单个盖10。另一种可选择的方式是,例如,在一个特定的分隔室中,在盖10中可以容装一个或多个闭环的流体流动系统。
流体泵50、冷凝器53和风扇58的尺寸应根据热量排除和流动速率要求选择。例如,对于500-1000W的热量耗散,典型的闭环流体流动速率为500-1000毫升/分钟。多种尺寸的泵和冷凝器组件可以从等温系统研究公司购得,并且可以接受的管材和装配件可以从Cole-Parmer公司得到(该公司位于Illinois的Vernon Hills)。
还可以设想,凡是可能需要密封和/或紧固之处,均可以采用多种方法和材料。例如,可以采用紧固件、柔性衬垫、超声焊接、硬焊接、软焊接或者锻造工艺。
这里描述的闭环流体流动系统具有许多优点。例如,它既不需要安排和管理许多流体供给和排放管线,也不需要为冷却不同的模块而对喷嘴进行定位和再定位。因此,尽管由于电路进一步集成化和被屏蔽的组件中的电子模块之上及其之间的实际空间减小而使热密度增加,但这里描述的喷雾冷却组件将不会增加尺寸、重量或复杂程度。
系统的简单性还增强了其使用性能。例如,维修喷雾冷却系统不需要将多根流体管线断开和重新定位,这样就降低了系统泄漏的可能性。同样,系统设计提供了在屏蔽盖取下时对单独的电子模块的无障碍接触,从而方便了模块的拆除和更换。
图5示出根据本发明的第二实施例的用于对屏蔽的电子模块进行喷雾冷却的装置。除了盖100的顶表面112不包括流体收集管道(如图1和2中所示)之外,盖100与结合第一实施例描述的盖10是相同的。
一个板146紧固至盖100的至少一部分上。板146的一种选择可以是印刷电路板,其中具有多个小孔147,并且安装有一个或多个电子模块145。电子模块145可以固定至板146的两个侧面上。
板146上的面对盖100的电子模块45是这样定位的:已采用EMI衰减材料处理的分隔室(已结合图2论述)围绕需要屏蔽的每一模块45。
界定了一个贮存器(未示出)的流体供给管路144安装并密封至盖100的顶表面112上。流体供给管路114从管52接收冷却剂,并且将冷却剂供给多个流体分配管路26。或者采用另一种方式,一个板(例如结合图4描述的板44)可以安装并密封至盖100的顶表面112,在这种情况下,冷却剂将通过直接安装在盖100上的一个流体输入口(例如结合图4描述的流体输入口60)供给流体分配管路26。
一个流体排放管路148可以安装并密封至盖100的底表面上。流体排放管路148通过板146中的小孔147收集来自于盖100的冷却剂,并且通过管56将冷却剂排出。
如果电子模块45设置在板146的背离盖100的一侧(未示出)上,流体排放管路148可以是(例如)与盖100相似的另一个盖。这个盖将与流体的排放共同为板146的背离盖100的一侧上的产生热量的电子元器件提供EMI屏蔽和/或喷雾冷却。可以设想,在这种情况下流体的排放借助了重力的作用。
应能设想,可以将与结合第一实施例所描述的相同或相似的用于提供冷却剂的闭环流动的手段与本发明的第二实施例结合使用。
图5中所示的喷雾冷却装置的实施例具有图1、2和4所示的喷雾冷却装置实现的热耗散的封装优点。因此,盖与其屏蔽的电子模块之间的间隔主要由最大元器件高度决定,而不是由冷却系统的要求决定。此外,盖100是小体积的和轻便的。因此,装配是高效的,使用和更换是简单的,并且可以获得精确的热源-喷嘴定位。
将能理解,尽管所描述的实施例展示出在正常工作过程中电子模块被冷却,但本发明不仅限于在电子模块常规工作过程中的冷却,而且可以适于例如电子模块或者模块中包含的电子电路装置的测试和评估(过程中的冷却)。
还将清楚,在不脱离所附权利要求及其等同物的精神和范围的情况下,可以导出本发明的其它和进一步的实现方式,并且将能理解,本发明在任何方面均不局限于上述的特定实施例,而是仅仅由所附的权利要求及其等同物决定。
Claims (10)
1.一种屏蔽装置,用于屏蔽电子模块使其免于电磁辐射,该装置包括:
一个盖,它具有顶表面和与此顶表面相对的底表面,底表面具有一个界定了周边的边缘和一个凹进区域;
一个壁,它与凹进区域连通,此壁和边缘的至少一部分界定了一个分隔室;
一种电磁干扰衰减材料,它被设置在分隔室中;
一个流体分配管路,它被设置在盖中;和
一个喷嘴壳体,它位于流体分配管路中,此喷嘴壳体的尺寸适于接纳一个喷嘴,并且它具有一个接受端和一个喷射端,喷射端具有一个孔,接受端与流体分配管路连通,喷射端与分隔室连通。
2.根据权利要求1的装置,还包括:
一个板,电子模块安装至此板上,电子模块的至少一部分设置于分隔室内。
3.根据权利要求2的装置,其中,电子模块选自由以下元器件组成的组:无源元器件、多片组件和电子混合组件。
4.根据权利要求2的装置,其中,所述板包括一个印刷电路板。
5.根据权利要求2的装置,其中,所述板具有多个贯穿的小孔。
6.根据权利要求5的装置,还包括:
一个流体排放管路,它与边缘的至少一部分连通,此流体排放管路收集来自于多个小孔的流体。
7.根据权利要求1的装置,还包括:
一个流体收集管道,它靠近分隔室的周边的至少一部分设置在盖中,此流体收集管道连接顶表面和底表面。
8.根据权利要求7的装置,还包括:
一个流体输入口,它设置在盖中,此流体输入口将流体供给流体分配管路;和
一个流体排出口,它设置在盖中,此流体排出口将来自于流体收集管道的流体排出。
9.根据权利要求8的装置,还包括:
一个流体泵,它与流体输入口连通;和
一个冷凝器,它与连通泵以及连通排出口连通,此冷凝器接收来自于流体排出口的流体,并且将流体供给流体输入口,从而形成闭环的流体流动。
10.根据权利要求1的装置,还包括:
一个流体供给管路,它与顶表面连通,此流体供给管路将流体供给流体分配管路。
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US08/606,316 US5675473A (en) | 1996-02-23 | 1996-02-23 | Apparatus and method for shielding an electronic module from electromagnetic radiation |
US08/606,316 | 1996-02-23 |
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- 1996-12-13 IL IL12439196A patent/IL124391A/xx not_active IP Right Cessation
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- 1996-12-13 BR BR9612517A patent/BR9612517A/pt not_active IP Right Cessation
- 1996-12-13 KR KR1019980706581A patent/KR100306730B1/ko not_active IP Right Cessation
- 1996-12-13 WO PCT/US1996/019984 patent/WO1997031514A1/en active IP Right Grant
- 1996-12-13 DE DE69635527T patent/DE69635527T2/de not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
US5675473A (en) | 1997-10-07 |
AU1334597A (en) | 1997-09-10 |
IL124391A0 (en) | 1998-12-06 |
EP1008281A1 (en) | 2000-06-14 |
AU695786B2 (en) | 1998-08-20 |
WO1997031514A1 (en) | 1997-08-28 |
DE69635527D1 (de) | 2006-01-05 |
JP3033194B2 (ja) | 2000-04-17 |
CN1207864A (zh) | 1999-02-10 |
DE69635527T2 (de) | 2006-06-08 |
EP1008281A4 (en) | 2000-06-14 |
KR19990087186A (ko) | 1999-12-15 |
BR9612517A (pt) | 1999-07-20 |
MX9804128A (es) | 1998-09-30 |
KR100306730B1 (ko) | 2002-02-19 |
IL124391A (en) | 2001-03-19 |
EP1008281B1 (en) | 2005-11-30 |
JPH11503274A (ja) | 1999-03-23 |
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