DE69629885D1 - Magnetfeldgenerator für Magnetronplasma - Google Patents
Magnetfeldgenerator für MagnetronplasmaInfo
- Publication number
- DE69629885D1 DE69629885D1 DE69629885T DE69629885T DE69629885D1 DE 69629885 D1 DE69629885 D1 DE 69629885D1 DE 69629885 T DE69629885 T DE 69629885T DE 69629885 T DE69629885 T DE 69629885T DE 69629885 D1 DE69629885 D1 DE 69629885D1
- Authority
- DE
- Germany
- Prior art keywords
- magnetic field
- field generator
- magnetron plasma
- magnetron
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7175898A JPH0927278A (ja) | 1995-07-12 | 1995-07-12 | マグネトロンプラズマ用磁場発生装置 |
JP17588995 | 1995-07-12 | ||
JP17588995A JP3272202B2 (ja) | 1995-07-12 | 1995-07-12 | マグネトロンプラズマ用磁場発生装置 |
JP17589895 | 1995-07-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69629885D1 true DE69629885D1 (de) | 2003-10-16 |
DE69629885T2 DE69629885T2 (de) | 2005-03-10 |
Family
ID=26497001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69629885T Expired - Lifetime DE69629885T2 (de) | 1995-07-12 | 1996-07-01 | Magnetfeldgenerator für Magnetronplasma |
Country Status (3)
Country | Link |
---|---|
US (1) | US5659276A (de) |
EP (1) | EP0762471B1 (de) |
DE (1) | DE69629885T2 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0152242B1 (ko) * | 1995-01-16 | 1998-12-01 | 박주탁 | 다중 음극 전자빔 플라즈마 식각장치 |
US6224724B1 (en) | 1995-02-23 | 2001-05-01 | Tokyo Electron Limited | Physical vapor processing of a surface with non-uniformity compensation |
US6014943A (en) * | 1996-09-12 | 2000-01-18 | Tokyo Electron Limited | Plasma process device |
TW418461B (en) * | 1997-03-07 | 2001-01-11 | Tokyo Electron Ltd | Plasma etching device |
JP3375302B2 (ja) | 1998-07-29 | 2003-02-10 | 東京エレクトロン株式会社 | マグネトロンプラズマ処理装置および処理方法 |
US6371045B1 (en) * | 1999-07-26 | 2002-04-16 | United Microelectronics Corp. | Physical vapor deposition device for forming a metallic layer on a semiconductor wafer |
JP3892996B2 (ja) * | 1999-09-02 | 2007-03-14 | 東京エレクトロン株式会社 | マグネトロンプラズマ処理装置 |
US8114245B2 (en) * | 1999-11-26 | 2012-02-14 | Tadahiro Ohmi | Plasma etching device |
WO2001063643A1 (de) | 2000-02-23 | 2001-08-30 | Unaxis Balzers Aktiengesellschaft | Verfahren zur steuerung der plasmadichte oder deren verteilung |
US8048806B2 (en) | 2000-03-17 | 2011-11-01 | Applied Materials, Inc. | Methods to avoid unstable plasma states during a process transition |
US8617351B2 (en) | 2002-07-09 | 2013-12-31 | Applied Materials, Inc. | Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction |
CN100568461C (zh) | 2000-09-01 | 2009-12-09 | 信越化学工业株式会社 | 产生磁等离子体的磁场发生装置 |
KR100403616B1 (ko) * | 2001-01-03 | 2003-10-30 | 삼성전자주식회사 | 플라즈마 장치에 의한 플라즈마 처리 공정의 시뮬레이션방법 |
US7374636B2 (en) * | 2001-07-06 | 2008-05-20 | Applied Materials, Inc. | Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor |
JP4009087B2 (ja) * | 2001-07-06 | 2007-11-14 | アプライド マテリアルズ インコーポレイテッド | 半導体製造装置における磁気発生装置、半導体製造装置および磁場強度制御方法 |
JP2003234331A (ja) * | 2001-12-05 | 2003-08-22 | Tokyo Electron Ltd | プラズマエッチング方法およびプラズマエッチング装置 |
TWI283899B (en) | 2002-07-09 | 2007-07-11 | Applied Materials Inc | Capacitively coupled plasma reactor with magnetic plasma control |
US7458335B1 (en) | 2002-10-10 | 2008-12-02 | Applied Materials, Inc. | Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils |
EP1552544B1 (de) * | 2002-10-15 | 2011-12-21 | Oerlikon Trading AG, Trübbach | Verfahren zur Herstellung magnetron-sputterbeschichteter Substrate und Anlage hierfür |
US7422654B2 (en) * | 2003-02-14 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
FR2895208B1 (fr) * | 2005-12-16 | 2008-06-27 | Metal Process Sarl | Procede de production de plasma par decharge capacitive associe a un plasma annexe a decharge distribuee, et systeme de mise en oeuvre associe |
US20120312233A1 (en) * | 2011-06-10 | 2012-12-13 | Ge Yi | Magnetically Enhanced Thin Film Coating Method and Apparatus |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3619194A1 (de) * | 1986-06-06 | 1987-12-10 | Leybold Heraeus Gmbh & Co Kg | Magnetron-zerstaeubungskatode fuer vakuum-beschichtungsanlagen |
DE4102102C2 (de) * | 1991-01-25 | 1995-09-07 | Leybold Ag | Magnetanordnung mit wenigstens zwei Permanentmagneten sowie ihre Verwendung |
DE4125110C2 (de) * | 1991-07-30 | 1999-09-09 | Leybold Ag | Magnetron-Zerstäubungskathode für Vakuumbeschichtungsanlagen |
US5248402A (en) * | 1992-07-29 | 1993-09-28 | Cvc Products, Inc. | Apple-shaped magnetron for sputtering system |
JP2899190B2 (ja) * | 1993-01-08 | 1999-06-02 | 信越化学工業株式会社 | マグネトロンプラズマ用永久磁石磁気回路 |
JP2952147B2 (ja) * | 1993-12-14 | 1999-09-20 | 信越化学工業株式会社 | マグネトロンプラズマ用磁場発生装置 |
DE69403768T2 (de) * | 1993-12-28 | 1997-11-13 | Shinetsu Chemical Co | Dipolringmagnet für Magnetronzerstäubung oder Magnetronätzung |
-
1996
- 1996-06-25 US US08/670,096 patent/US5659276A/en not_active Expired - Lifetime
- 1996-07-01 DE DE69629885T patent/DE69629885T2/de not_active Expired - Lifetime
- 1996-07-01 EP EP96110607A patent/EP0762471B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69629885T2 (de) | 2005-03-10 |
EP0762471A1 (de) | 1997-03-12 |
EP0762471B1 (de) | 2003-09-10 |
US5659276A (en) | 1997-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de | ||
8370 | Indication of lapse of patent is to be deleted | ||
8364 | No opposition during term of opposition |