FR2895208B1 - Procede de production de plasma par decharge capacitive associe a un plasma annexe a decharge distribuee, et systeme de mise en oeuvre associe - Google Patents
Procede de production de plasma par decharge capacitive associe a un plasma annexe a decharge distribuee, et systeme de mise en oeuvre associeInfo
- Publication number
- FR2895208B1 FR2895208B1 FR0512802A FR0512802A FR2895208B1 FR 2895208 B1 FR2895208 B1 FR 2895208B1 FR 0512802 A FR0512802 A FR 0512802A FR 0512802 A FR0512802 A FR 0512802A FR 2895208 B1 FR2895208 B1 FR 2895208B1
- Authority
- FR
- France
- Prior art keywords
- plasma
- discharge
- implementing system
- distributed apparatus
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32678—Electron cyclotron resonance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0512802A FR2895208B1 (fr) | 2005-12-16 | 2005-12-16 | Procede de production de plasma par decharge capacitive associe a un plasma annexe a decharge distribuee, et systeme de mise en oeuvre associe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0512802A FR2895208B1 (fr) | 2005-12-16 | 2005-12-16 | Procede de production de plasma par decharge capacitive associe a un plasma annexe a decharge distribuee, et systeme de mise en oeuvre associe |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2895208A1 FR2895208A1 (fr) | 2007-06-22 |
FR2895208B1 true FR2895208B1 (fr) | 2008-06-27 |
Family
ID=36794410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0512802A Active FR2895208B1 (fr) | 2005-12-16 | 2005-12-16 | Procede de production de plasma par decharge capacitive associe a un plasma annexe a decharge distribuee, et systeme de mise en oeuvre associe |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2895208B1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2922358B1 (fr) * | 2007-10-16 | 2013-02-01 | Hydromecanique & Frottement | Procede de traitement de surface d'au moins une piece au moyen de sources elementaires de plasma par resonance cyclotronique electronique |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59144133A (ja) * | 1983-02-07 | 1984-08-18 | Hitachi Ltd | プラズマドライ処理装置 |
US5496455A (en) * | 1993-09-16 | 1996-03-05 | Applied Material | Sputtering using a plasma-shaping magnet ring |
US5659276A (en) * | 1995-07-12 | 1997-08-19 | Shin-Etsu Chemical Co., Ltd. | Magnetic field generator for magnetron plasma |
FR2797372B1 (fr) * | 1999-08-04 | 2002-10-25 | Metal Process | Procede de production de plasmas elementaires en vue de creer un plasma uniforme pour une surface d'utilisation et dispositif de production d'un tel plasma |
US7467598B2 (en) * | 2001-04-09 | 2008-12-23 | Tegal Corporation | System for, and method of, etching a surface on a wafer |
JP3729769B2 (ja) * | 2001-10-11 | 2005-12-21 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2005
- 2005-12-16 FR FR0512802A patent/FR2895208B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR2895208A1 (fr) | 2007-06-22 |
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Legal Events
Date | Code | Title | Description |
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TP | Transmission of property | ||
CD | Change of name or company name |
Owner name: BOREAL PLASMAS, FR Effective date: 20110916 |
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TP | Transmission of property |
Owner name: H.E.F., FR Effective date: 20120515 |
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PLFP | Fee payment |
Year of fee payment: 11 |
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PLFP | Fee payment |
Year of fee payment: 12 |
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PLFP | Fee payment |
Year of fee payment: 13 |
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PLFP | Fee payment |
Year of fee payment: 15 |
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PLFP | Fee payment |
Year of fee payment: 16 |
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PLFP | Fee payment |
Year of fee payment: 17 |
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PLFP | Fee payment |
Year of fee payment: 18 |
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PLFP | Fee payment |
Year of fee payment: 19 |