DE69629587D1 - Verfahren und vorrichtung zur stabilisierung von temperaturgradienten bei mikrobolometersensoren in einer bildebenenmatrixanordnung - Google Patents

Verfahren und vorrichtung zur stabilisierung von temperaturgradienten bei mikrobolometersensoren in einer bildebenenmatrixanordnung

Info

Publication number
DE69629587D1
DE69629587D1 DE69629587T DE69629587T DE69629587D1 DE 69629587 D1 DE69629587 D1 DE 69629587D1 DE 69629587 T DE69629587 T DE 69629587T DE 69629587 T DE69629587 T DE 69629587T DE 69629587 D1 DE69629587 D1 DE 69629587D1
Authority
DE
Germany
Prior art keywords
temperature gradients
matrix arrangement
image level
level matrix
stabilizing temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69629587T
Other languages
English (en)
Other versions
DE69629587T2 (de
Inventor
H Murphy
E Macdonald
D Ramsden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lockheed Martin Tactical Systems Inc
Original Assignee
Lockheed Martin IR Imaging Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lockheed Martin IR Imaging Systems Inc filed Critical Lockheed Martin IR Imaging Systems Inc
Application granted granted Critical
Publication of DE69629587D1 publication Critical patent/DE69629587D1/de
Publication of DE69629587T2 publication Critical patent/DE69629587T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/33—Transforming infrared radiation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69629587T 1995-12-19 1996-12-18 Verfahren und vorrichtung zur stabilisierung von temperaturgradienten bei mikrobolometersensoren in einer bildebenenmatrixanordnung Expired - Fee Related DE69629587T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US574815 1990-08-30
US08/574,815 US5763885A (en) 1995-12-19 1995-12-19 Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays
PCT/US1996/020352 WO1997022860A1 (en) 1995-12-19 1996-12-18 Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays

Publications (2)

Publication Number Publication Date
DE69629587D1 true DE69629587D1 (de) 2003-09-25
DE69629587T2 DE69629587T2 (de) 2004-06-24

Family

ID=24297761

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69629587T Expired - Fee Related DE69629587T2 (de) 1995-12-19 1996-12-18 Verfahren und vorrichtung zur stabilisierung von temperaturgradienten bei mikrobolometersensoren in einer bildebenenmatrixanordnung

Country Status (7)

Country Link
US (1) US5763885A (de)
EP (1) EP0870181B1 (de)
JP (1) JP3798816B2 (de)
AU (1) AU1686497A (de)
DE (1) DE69629587T2 (de)
IL (1) IL124989A (de)
WO (1) WO1997022860A1 (de)

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Also Published As

Publication number Publication date
US5763885A (en) 1998-06-09
EP0870181B1 (de) 2003-08-20
IL124989A (en) 2002-08-14
DE69629587T2 (de) 2004-06-24
JP3798816B2 (ja) 2006-07-19
EP0870181A1 (de) 1998-10-14
IL124989A0 (en) 1999-01-26
AU1686497A (en) 1997-07-14
JP2000502449A (ja) 2000-02-29
WO1997022860A1 (en) 1997-06-26

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