DE69621387T2 - Flächiges Teil für Halbleitergehäuse - Google Patents
Flächiges Teil für HalbleitergehäuseInfo
- Publication number
- DE69621387T2 DE69621387T2 DE69621387T DE69621387T DE69621387T2 DE 69621387 T2 DE69621387 T2 DE 69621387T2 DE 69621387 T DE69621387 T DE 69621387T DE 69621387 T DE69621387 T DE 69621387T DE 69621387 T2 DE69621387 T2 DE 69621387T2
- Authority
- DE
- Germany
- Prior art keywords
- earth metal
- alkaline earth
- plate type
- type member
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 abstract 4
- 150000001342 alkaline earth metals Chemical class 0.000 abstract 4
- 229910001182 Mo alloy Inorganic materials 0.000 abstract 2
- 229910001080 W alloy Inorganic materials 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 230000001629 suppression Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4922—Bases or plates or solder therefor having a heterogeneous or anisotropic structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7198302A JPH0945815A (ja) | 1995-08-03 | 1995-08-03 | 半導体用パッケージ、該パッケージ用板状部材及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69621387D1 DE69621387D1 (de) | 2002-07-04 |
DE69621387T2 true DE69621387T2 (de) | 2002-10-17 |
Family
ID=16388879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69621387T Expired - Lifetime DE69621387T2 (de) | 1995-08-03 | 1996-07-02 | Flächiges Teil für Halbleitergehäuse |
Country Status (5)
Country | Link |
---|---|
US (1) | US5990548A (de) |
EP (1) | EP0757383B1 (de) |
JP (1) | JPH0945815A (de) |
AT (1) | ATE218245T1 (de) |
DE (1) | DE69621387T2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003100968A (ja) * | 2001-09-21 | 2003-04-04 | Toyota Industries Corp | 放熱材及びその製造方法 |
DE102016125348B4 (de) * | 2016-12-22 | 2020-06-25 | Rogers Germany Gmbh | Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5921032A (ja) * | 1982-07-26 | 1984-02-02 | Sumitomo Electric Ind Ltd | 半導体装置用基板 |
JPS5946050A (ja) * | 1982-09-09 | 1984-03-15 | Narumi China Corp | 半導体用セラミツクパツケ−ジ |
DE3883873T2 (de) * | 1987-06-30 | 1994-01-05 | Sumitomo Electric Industries | Trägerelement für Halbleiterapparat. |
JP2517024B2 (ja) * | 1987-12-08 | 1996-07-24 | 新光電気工業株式会社 | セラミックパッケ―ジとその製造方法 |
JPH01272733A (ja) * | 1988-04-25 | 1989-10-31 | Mitsubishi Shindoh Co Ltd | 半導体装置用Cu合金製リードフレーム材 |
US5015803A (en) * | 1989-05-31 | 1991-05-14 | Olin Corporation | Thermal performance package for integrated circuit chip |
KR940010455B1 (ko) * | 1992-09-24 | 1994-10-22 | 김영길 | 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법 |
-
1995
- 1995-08-03 JP JP7198302A patent/JPH0945815A/ja active Pending
-
1996
- 1996-06-27 US US08/671,058 patent/US5990548A/en not_active Expired - Lifetime
- 1996-07-02 DE DE69621387T patent/DE69621387T2/de not_active Expired - Lifetime
- 1996-07-02 EP EP96110773A patent/EP0757383B1/de not_active Expired - Lifetime
- 1996-07-02 AT AT96110773T patent/ATE218245T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE218245T1 (de) | 2002-06-15 |
JPH0945815A (ja) | 1997-02-14 |
EP0757383A2 (de) | 1997-02-05 |
EP0757383B1 (de) | 2002-05-29 |
EP0757383A3 (de) | 1998-09-30 |
DE69621387D1 (de) | 2002-07-04 |
US5990548A (en) | 1999-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8328 | Change in the person/name/address of the agent |
Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN |
|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: BOCKHORNI & KOLLEGEN, 80687 MUENCHEN |