DE69616687T2 - Elektronisches bauelement, welches eine dünnschichtstruktur mit passiven elementen enthält - Google Patents

Elektronisches bauelement, welches eine dünnschichtstruktur mit passiven elementen enthält

Info

Publication number
DE69616687T2
DE69616687T2 DE69616687T DE69616687T DE69616687T2 DE 69616687 T2 DE69616687 T2 DE 69616687T2 DE 69616687 T DE69616687 T DE 69616687T DE 69616687 T DE69616687 T DE 69616687T DE 69616687 T2 DE69616687 T2 DE 69616687T2
Authority
DE
Germany
Prior art keywords
thin
electronic component
layer structure
passive elements
passive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69616687T
Other languages
English (en)
Other versions
DE69616687D1 (de
Inventor
De Walle Franciscus Van
Willem Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69616687D1 publication Critical patent/DE69616687D1/de
Application granted granted Critical
Publication of DE69616687T2 publication Critical patent/DE69616687T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)
DE69616687T 1995-02-27 1996-02-15 Elektronisches bauelement, welches eine dünnschichtstruktur mit passiven elementen enthält Expired - Lifetime DE69616687T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95200477 1995-02-27
PCT/IB1996/000116 WO1996027210A2 (en) 1995-02-27 1996-02-15 Electronic component comprising a thin-film structure with passive elements

Publications (2)

Publication Number Publication Date
DE69616687D1 DE69616687D1 (de) 2001-12-13
DE69616687T2 true DE69616687T2 (de) 2002-08-01

Family

ID=8220049

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69616687T Expired - Lifetime DE69616687T2 (de) 1995-02-27 1996-02-15 Elektronisches bauelement, welches eine dünnschichtstruktur mit passiven elementen enthält

Country Status (8)

Country Link
US (1) US5731747A (de)
EP (1) EP0757846B1 (de)
JP (1) JP4097694B2 (de)
KR (1) KR100395182B1 (de)
CN (1) CN1084050C (de)
DE (1) DE69616687T2 (de)
TW (1) TW367621B (de)
WO (1) WO1996027210A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9706154D0 (en) * 1997-03-25 1997-05-14 Philips Electronics Nv Circuit simulator
US6285542B1 (en) * 1999-04-16 2001-09-04 Avx Corporation Ultra-small resistor-capacitor thin film network for inverted mounting to a surface
KR100697405B1 (ko) * 2000-02-15 2007-03-20 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 전자 디바이스
DE10035584A1 (de) * 2000-07-21 2002-01-31 Philips Corp Intellectual Pty Mobilfunkgerät
DE10039710B4 (de) * 2000-08-14 2017-06-22 United Monolithic Semiconductors Gmbh Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat
US7535079B2 (en) * 2005-06-09 2009-05-19 Freescale Semiconductor, Inc. Semiconductor device comprising passive components
US6919244B1 (en) 2004-03-10 2005-07-19 Motorola, Inc. Method of making a semiconductor device, and semiconductor device made thereby
US7436678B2 (en) * 2004-10-18 2008-10-14 E.I. Du Pont De Nemours And Company Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof
US7382627B2 (en) * 2004-10-18 2008-06-03 E.I. Du Pont De Nemours And Company Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US7430128B2 (en) * 2004-10-18 2008-09-30 E.I. Du Pont De Nemours And Company Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US20060286696A1 (en) * 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article
KR101593631B1 (ko) * 2014-01-24 2016-02-12 광운대학교 산학협력단 발광 소자 패키지 및 그 제조 방법
DE102016122923A1 (de) * 2016-11-28 2018-05-30 Karl-Alfred Schwarz Modul zur passiven Flächenüberwachung
US20220346222A1 (en) * 2021-04-27 2022-10-27 KYOCRA AVX Components Corporation Transmission Line Capacitor and Circuit Board Including the Same Embedded Within

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3569872A (en) * 1968-11-27 1971-03-09 Vitramon Inc Electronic component
US3868587A (en) * 1971-10-19 1975-02-25 Amos Nathan Constant phase distributed impedance
US4342143A (en) * 1974-02-04 1982-08-03 Jennings Thomas A Method of making multiple electrical components in integrated microminiature form
US4410867A (en) * 1978-12-28 1983-10-18 Western Electric Company, Inc. Alpha tantalum thin film circuit device
DE2903025C2 (de) * 1979-01-26 1983-05-05 Siemens AG, 1000 Berlin und 8000 München RC-Netzwerk
US4410847A (en) * 1982-09-20 1983-10-18 Brunswick Corporation Voltage regulator
GB2136235B (en) * 1983-02-22 1986-07-09 Philips Electronic Associated Rc active filter device
JPS609220U (ja) * 1983-06-28 1985-01-22 株式会社村田製作所 Ｌｃ複合部品
JPH0583017A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp マイクロ波集積回路装置

Also Published As

Publication number Publication date
DE69616687D1 (de) 2001-12-13
CN1084050C (zh) 2002-05-01
WO1996027210A3 (en) 1996-10-31
KR970703047A (ko) 1997-06-10
WO1996027210A2 (en) 1996-09-06
EP0757846A1 (de) 1997-02-12
JPH09512669A (ja) 1997-12-16
CN1149930A (zh) 1997-05-14
KR100395182B1 (ko) 2003-12-18
TW367621B (en) 1999-08-21
US5731747A (en) 1998-03-24
EP0757846B1 (de) 2001-11-07
JP4097694B2 (ja) 2008-06-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN

8327 Change in the person/name/address of the patent owner

Owner name: NXP B.V., EINDHOVEN, NL