DE69610519T2 - Flexible, wässrig entwickelbare, durch Licht abbildbare, dauerhafte Überzugsmittel für gedruckte Schaltungen - Google Patents

Flexible, wässrig entwickelbare, durch Licht abbildbare, dauerhafte Überzugsmittel für gedruckte Schaltungen

Info

Publication number
DE69610519T2
DE69610519T2 DE69610519T DE69610519T DE69610519T2 DE 69610519 T2 DE69610519 T2 DE 69610519T2 DE 69610519 T DE69610519 T DE 69610519T DE 69610519 T DE69610519 T DE 69610519T DE 69610519 T2 DE69610519 T2 DE 69610519T2
Authority
DE
Germany
Prior art keywords
developable
imaging
flexible
light
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69610519T
Other languages
English (en)
Other versions
DE69610519D1 (de
Inventor
Thomas Eugene Dueber
Iii Frank Leonard Schadt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69610519D1 publication Critical patent/DE69610519D1/de
Application granted granted Critical
Publication of DE69610519T2 publication Critical patent/DE69610519T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/107—Polyamide or polyurethane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DE69610519T 1995-04-28 1996-04-27 Flexible, wässrig entwickelbare, durch Licht abbildbare, dauerhafte Überzugsmittel für gedruckte Schaltungen Expired - Fee Related DE69610519T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43121495A 1995-04-28 1995-04-28

Publications (2)

Publication Number Publication Date
DE69610519D1 DE69610519D1 (de) 2000-11-09
DE69610519T2 true DE69610519T2 (de) 2001-05-31

Family

ID=23710966

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69610519T Expired - Fee Related DE69610519T2 (de) 1995-04-28 1996-04-27 Flexible, wässrig entwickelbare, durch Licht abbildbare, dauerhafte Überzugsmittel für gedruckte Schaltungen

Country Status (5)

Country Link
US (1) US5728505A (de)
EP (1) EP0740210B1 (de)
JP (1) JPH08319456A (de)
KR (1) KR100229831B1 (de)
DE (1) DE69610519T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW332334B (en) * 1996-05-31 1998-05-21 Toshiba Co Ltd The semiconductor substrate and its producing method and semiconductor apparatus
DE69729843T2 (de) * 1996-11-28 2005-08-25 Kaneka Corp. Verfahren zur Herstellung eines (Meth)acrylpolymers mit endständiger Hydroxylgruppe und dieses Polymer
US6017561A (en) * 1997-04-04 2000-01-25 The Clorox Company Antimicrobial cleaning composition
US6207346B1 (en) 1997-04-09 2001-03-27 Advanced Coatings International Waterborne photoresists made from urethane acrylates
US6004725A (en) * 1997-12-01 1999-12-21 Morton International, Inc. Photoimageable compositions
JP2001072960A (ja) * 1999-09-02 2001-03-21 Lintec Corp カード用封止材組成物及びそれを用いたカードの製造方法
US7105583B2 (en) 2001-12-20 2006-09-12 Ppg Industries Ohio, Inc. Radiation-curable compositions for optical fiber coating materials
KR100445728B1 (ko) * 2002-01-10 2004-08-25 주식회사 코오롱 페녹시 그룹을 갖는 감광성 올리고머와 그의 제조방법
TW200422336A (en) * 2002-11-08 2004-11-01 Mitsubishi Chem Corp Radiation curable resin composition and cured product thereof
US7064154B2 (en) 2003-02-06 2006-06-20 Ppg Industries Ohio, Inc. Radiation-curable composition for optical fiber coating materials
US7220490B2 (en) * 2003-12-30 2007-05-22 E. I. Du Pont De Nemours And Company Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto
KR100611446B1 (ko) * 2004-05-18 2006-08-10 제일모직주식회사 수성 현상가능한 감광성 코팅액 조성물의 제조방법
JP2008516644A (ja) * 2004-09-16 2008-05-22 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ コンパクトな誘導要素を持つ磁気共鳴受信コイル
US7524617B2 (en) * 2004-11-23 2009-04-28 E.I. Du Pont De Nemours And Company Low-temperature curable photosensitive compositions
US7618766B2 (en) * 2005-12-21 2009-11-17 E. I. Du Pont De Nemours And Company Flame retardant photoimagable coverlay compositions and methods relating thereto
WO2007091442A1 (ja) * 2006-02-10 2007-08-16 Konica Minolta Medical & Graphic, Inc. 平版印刷版材料
US20070236859A1 (en) * 2006-04-10 2007-10-11 Borland William J Organic encapsulant compositions for protection of electronic components
US20090191491A1 (en) * 2008-01-28 2009-07-30 John Ganjei Method of Creating an Image in a Photoresist Laminate
FR2927631B1 (fr) * 2008-02-15 2010-03-05 Arkema France Utilisation d'un promoteur d'adherence dans une solution de nettoyage de la surface d'un substrat a base de tpe et/ou de pa, pour augmenter l'adherence dudit substrat avec les joints de colle aqueux.
DE102008038875B3 (de) * 2008-08-13 2010-01-28 Abb Technology Ag Temperaturfühler für eine prozesstechnische industrielle Anlage
CN101650233A (zh) * 2008-08-13 2010-02-17 Abb技术股份公司 温度传感器
JP6707146B2 (ja) * 2016-12-08 2020-06-10 富士フイルム株式会社 転写フィルム、電極保護膜、積層体、静電容量型入力装置、及び、タッチパネルの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3547730A (en) * 1966-12-16 1970-12-15 Du Pont Machine for making resist images
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
JPS592018B2 (ja) * 1975-03-26 1984-01-17 住友化学工業株式会社 カイリヨウサレタカンコウセイジユシソセイブツカラナルゲンケイ
US4349620A (en) * 1979-06-15 1982-09-14 E. I. Du Pont De Nemours And Company Solvent developable photoresist film
JPS57204032A (en) * 1981-06-10 1982-12-14 Somar Corp Photosensitive material
DE3134123A1 (de) * 1981-08-28 1983-03-17 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial
US4621043A (en) * 1983-01-31 1986-11-04 E. I. Du Pont De Nemours And Company Storage stable photopolymerizable composition
US4937172A (en) * 1986-12-02 1990-06-26 E. I. Du Pont De Nemours And Company Photopolymerizable composition having superior adhesion, articles and processes
DE3814567A1 (de) * 1988-04-29 1989-11-09 Du Pont Deutschland Photopolymerisierbare zusammensetzungen mit carboxylgruppen enthaltenden bindemitteln
US5153101A (en) * 1989-06-16 1992-10-06 Ciba-Geigy Corporation Photoresist
JP2700933B2 (ja) * 1989-11-28 1998-01-21 日本石油株式会社 永久保護膜用樹脂組成物および永久保護膜の製造方法
JPH04274428A (ja) * 1991-03-01 1992-09-30 Nippon Paint Co Ltd オフセット印刷用感光性組成物
DE69321103T2 (de) * 1992-02-24 1999-03-11 Du Pont Flexible, wässrig entwickelbare, durch licht abblidbare dauerhafte ueberzugsmittel fuer gedruckte schaltungen
US5288589A (en) * 1992-12-03 1994-02-22 Mckeever Mark R Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
TW369557B (en) * 1994-04-07 1999-09-11 Du Pont Pliable, aqueous processable, photoimageable permanent coatings for printed circuits

Also Published As

Publication number Publication date
EP0740210B1 (de) 2000-10-04
US5728505A (en) 1998-03-17
JPH08319456A (ja) 1996-12-03
KR960038484A (ko) 1996-11-21
DE69610519D1 (de) 2000-11-09
EP0740210A1 (de) 1996-10-30
KR100229831B1 (ko) 1999-11-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee