DE69604333T2 - Optisches Wellenleitermodul und Verfahren zu seiner Herstellung - Google Patents
Optisches Wellenleitermodul und Verfahren zu seiner HerstellungInfo
- Publication number
- DE69604333T2 DE69604333T2 DE69604333T DE69604333T DE69604333T2 DE 69604333 T2 DE69604333 T2 DE 69604333T2 DE 69604333 T DE69604333 T DE 69604333T DE 69604333 T DE69604333 T DE 69604333T DE 69604333 T2 DE69604333 T2 DE 69604333T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- optical waveguide
- waveguide module
- module
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4227—Active alignment methods, e.g. procedures and algorithms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/456,207 US5539848A (en) | 1995-05-31 | 1995-05-31 | Optical waveguide module and method of making |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69604333D1 DE69604333D1 (de) | 1999-10-28 |
DE69604333T2 true DE69604333T2 (de) | 2000-04-13 |
Family
ID=23811892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69604333T Expired - Fee Related DE69604333T2 (de) | 1995-05-31 | 1996-05-28 | Optisches Wellenleitermodul und Verfahren zu seiner Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5539848A (de) |
EP (1) | EP0745873B1 (de) |
JP (1) | JPH08327843A (de) |
KR (1) | KR960042107A (de) |
DE (1) | DE69604333T2 (de) |
GR (1) | GR3032135T3 (de) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2161915A1 (en) * | 1994-11-02 | 1996-05-03 | Sosaku Sawada | Optical module circuit board having flexible structure |
NL9500328A (nl) * | 1995-02-21 | 1996-10-01 | Framatome Connectors Belgium | Werkwijze voor het vervaardigen van een connector voor optische geleiders op een printkaart, alsmede beschermingskap en positioneringsstuk voor toepassing bij deze werkwijze. |
US6805493B2 (en) | 1996-03-12 | 2004-10-19 | 3M Innovative Properties Company | Optical connector assembly using partial large diameter alignment features |
US5940562A (en) * | 1996-03-12 | 1999-08-17 | Minnesota Mining And Manufacturing Company | Stubless optoelectronic device receptacle |
US5790733A (en) * | 1996-06-07 | 1998-08-04 | Minnesota Mining And Manufactouring Company | Optoelectronic device receptacle and method of making same |
US5774614A (en) * | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
US5636298A (en) * | 1996-08-19 | 1997-06-03 | Motorola | Coalescing optical module and method for making |
AU4602597A (en) * | 1996-09-30 | 1998-04-24 | Whitaker Corporation, The | Fiber optic array transmitter/receiver based on flexible circuit technology |
WO1998029772A1 (en) | 1996-12-31 | 1998-07-09 | Honeywell Inc. | Flexible optic connector assembly |
EP0893861A3 (de) * | 1997-07-25 | 2000-01-12 | Oki Electric Industry Co., Ltd. | Optischer Modul |
US5913002A (en) * | 1997-12-31 | 1999-06-15 | The Whitaker Corporation | Optical coupling device for passive alignment of optoelectronic devices and fibers |
US6317189B1 (en) | 1998-12-29 | 2001-11-13 | Xerox Corporation | High-efficiency reflective liquid crystal display |
US6588949B1 (en) * | 1998-12-30 | 2003-07-08 | Honeywell Inc. | Method and apparatus for hermetically sealing photonic devices |
US7004644B1 (en) | 1999-06-29 | 2006-02-28 | Finisar Corporation | Hermetic chip-scale package for photonic devices |
US6485192B1 (en) * | 1999-10-15 | 2002-11-26 | Tyco Electronics Corporation | Optical device having an integral array interface |
US6792178B1 (en) | 2000-01-12 | 2004-09-14 | Finisar Corporation | Fiber optic header with integrated power monitor |
US7169355B1 (en) * | 2000-02-02 | 2007-01-30 | Applera Corporation | Apparatus and method for ejecting sample well trays |
US6396968B2 (en) * | 2000-03-02 | 2002-05-28 | Siemens Aktiengesellschaft | Optical signal transmission device |
US6879014B2 (en) * | 2000-03-20 | 2005-04-12 | Aegis Semiconductor, Inc. | Semitransparent optical detector including a polycrystalline layer and method of making |
US6670599B2 (en) | 2000-03-27 | 2003-12-30 | Aegis Semiconductor, Inc. | Semitransparent optical detector on a flexible substrate and method of making |
WO2001073902A2 (en) * | 2000-03-31 | 2001-10-04 | Aegis Semiconductor | An optical communication device including a semitransparent optical detector |
US6547454B2 (en) | 2000-09-21 | 2003-04-15 | Corona Optical Systems, Inc. | Method to align optical components to a substrate and other optical components |
US6450704B1 (en) * | 2000-10-05 | 2002-09-17 | Corona Optical Systems, Inc. | Transparent substrate and hinged optical assembly |
US7021836B2 (en) * | 2000-12-26 | 2006-04-04 | Emcore Corporation | Attenuator and conditioner |
US6867377B2 (en) * | 2000-12-26 | 2005-03-15 | Emcore Corporation | Apparatus and method of using flexible printed circuit board in optical transceiver device |
US6799902B2 (en) | 2000-12-26 | 2004-10-05 | Emcore Corporation | Optoelectronic mounting structure |
US20020122637A1 (en) * | 2000-12-26 | 2002-09-05 | Anderson Gene R. | Optical transmitter, receiver or transceiver module |
JP2004537750A (ja) * | 2001-08-02 | 2004-12-16 | アイギス セミコンダクター インコーポレイテッド | 同調可能な光学機器 |
US7439449B1 (en) | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
US7446261B2 (en) | 2001-09-06 | 2008-11-04 | Finisar Corporation | Flexible circuit boards with tooling cutouts for optoelectronic modules |
US6617518B2 (en) * | 2001-11-02 | 2003-09-09 | Jds Uniphase Corporaton | Enhanced flex cable |
US20030085452A1 (en) * | 2001-11-05 | 2003-05-08 | International Business Machines Corporation | Packaging architecture for a multiple array transceiver using a continuous flexible circuit |
FR2836235B1 (fr) * | 2002-02-21 | 2004-07-02 | Framatome Connectors Int | Ferule de connexion de fibres optiques |
US6932518B2 (en) * | 2002-03-19 | 2005-08-23 | Finisar Corporation | Circuit board having traces with distinct transmission impedances |
US7254149B2 (en) | 2002-03-19 | 2007-08-07 | Finisar Corporation | Submount, pedestal, and bond wire assembly for a transistor outline package with reduced bond wire inductance |
US7044657B2 (en) * | 2002-03-19 | 2006-05-16 | Finisar Corporation | Transistor outline package with exteriorly mounted resistors |
US7042067B2 (en) * | 2002-03-19 | 2006-05-09 | Finisar Corporation | Transmission line with integrated connection pads for circuit elements |
US7532782B2 (en) * | 2002-04-18 | 2009-05-12 | Pivotal Decisions Llc | Flexible optical circuit apparatus and method |
US7526207B2 (en) * | 2002-10-18 | 2009-04-28 | Finisar Corporation | Flexible circuit design for improved laser bias connections to optical subassemblies |
US6807346B2 (en) * | 2003-03-01 | 2004-10-19 | Optovia Corporation | Method for attaching multiple light sources to an optoelectronic module |
GB2401196B (en) * | 2003-05-02 | 2007-02-07 | Agilent Technologies Inc | Packaged planar lightwave circuit arrangements corresponding method of connection and component |
WO2004113887A2 (en) * | 2003-06-20 | 2004-12-29 | Aegis Semiconductor, Inc. | Thermo-optic filter and infrared sensor using said filter. |
US20050018994A1 (en) * | 2003-07-24 | 2005-01-27 | Oepic, Inc. | Active and passive to-can extension boards |
US7128472B2 (en) * | 2003-07-31 | 2006-10-31 | International Business Machines Corporation | Method and apparatus for providing optoelectronic communication with an electronic device |
EP1665778A2 (de) * | 2003-08-26 | 2006-06-07 | Redshift Systems Corporation | Infrarotkamera |
US7221827B2 (en) * | 2003-09-08 | 2007-05-22 | Aegis Semiconductor, Inc. | Tunable dispersion compensator |
WO2005036240A1 (en) * | 2003-10-07 | 2005-04-21 | Aegis Semiconductor, Inc. | Tunable optical filter with heater on a cte-matched transparent substrate |
US7425135B2 (en) * | 2004-04-30 | 2008-09-16 | Finisar Corporation | Flex circuit assembly |
US7275937B2 (en) | 2004-04-30 | 2007-10-02 | Finisar Corporation | Optoelectronic module with components mounted on a flexible circuit |
US7311240B2 (en) | 2004-04-30 | 2007-12-25 | Finisar Corporation | Electrical circuits with button plated contacts and assembly methods |
US7629537B2 (en) * | 2004-07-09 | 2009-12-08 | Finisar Corporation | Single layer flex circuit |
JP2006030294A (ja) * | 2004-07-12 | 2006-02-02 | Nitto Denko Corp | フレキシブル光導波路の製法 |
US7338218B2 (en) * | 2005-02-01 | 2008-03-04 | Ibiden Co., Ltd. | Optical module, method of manufacturing the optical module, and data communication system including the optical module |
JP4704125B2 (ja) * | 2005-06-22 | 2011-06-15 | 浜松ホトニクス株式会社 | 光デバイス |
GB2434971B (en) * | 2006-02-14 | 2011-03-02 | Ronald Alexander Young | Squeegee device |
JP4850148B2 (ja) * | 2007-08-23 | 2012-01-11 | 独立行政法人産業技術総合研究所 | 光モジュール |
JP2012013916A (ja) * | 2010-06-30 | 2012-01-19 | Hitachi Cable Ltd | 光学部品および光モジュール |
JP5920128B2 (ja) * | 2012-09-07 | 2016-05-18 | 住友電気工業株式会社 | 光導波路型受光素子の製造方法および光導波路型受光素子 |
US9101083B2 (en) | 2012-09-10 | 2015-08-04 | Apple Inc. | T-flex bonder |
US11071199B2 (en) | 2018-10-09 | 2021-07-20 | City University Of Hong Kong | Optical printed circuit board and its fabrication method |
EP3671297A1 (de) * | 2018-12-21 | 2020-06-24 | ADVA Optical Networking SE | Elektrooptische anordnung |
JP7138056B2 (ja) * | 2019-01-24 | 2022-09-15 | 京セラ株式会社 | 光コネクタモジュール及び光導波路基板の製造方法 |
US11899255B2 (en) * | 2022-06-17 | 2024-02-13 | City University Of Hong Kong | Optical printed circuit board and its fabricating method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5720601A (en) * | 1980-07-14 | 1982-02-03 | Hitachi Ltd | Control rod driving mechanism for nuclear reactor |
JPS6126002A (ja) * | 1984-07-17 | 1986-02-05 | Hoya Corp | 集光性屈折率分布型ロツドレンズアレ−の製造法 |
EP0420173A3 (en) * | 1989-09-26 | 1992-09-09 | Omron Corporation | Rib optical waveguide and method of manufacturing the same |
US5265184A (en) * | 1992-05-28 | 1993-11-23 | Motorola, Inc. | Molded waveguide and method for making same |
US5271083A (en) * | 1992-07-27 | 1993-12-14 | Motorola, Inc. | Molded optical waveguide with contacts utilizing leadframes and method of making same |
US5249245A (en) * | 1992-08-31 | 1993-09-28 | Motorola, Inc. | Optoelectroinc mount including flexible substrate and method for making same |
US5325451A (en) * | 1993-01-05 | 1994-06-28 | Motorola, Inc. | Modular optical waveguide and method for making |
DE69418752T2 (de) * | 1993-03-18 | 2000-01-27 | Nippon Telegraph & Telephone | Herstellungsverfahren von optischen Wellenleitern aus Polyimid |
US5367593A (en) * | 1993-09-03 | 1994-11-22 | Motorola, Inc. | Optical/electrical connector and method of fabrication |
-
1995
- 1995-05-31 US US08/456,207 patent/US5539848A/en not_active Expired - Fee Related
-
1996
- 1996-05-17 JP JP8146485A patent/JPH08327843A/ja active Pending
- 1996-05-23 KR KR1019960018110A patent/KR960042107A/ko not_active Application Discontinuation
- 1996-05-28 DE DE69604333T patent/DE69604333T2/de not_active Expired - Fee Related
- 1996-05-28 EP EP96108454A patent/EP0745873B1/de not_active Expired - Lifetime
-
1999
- 1999-12-15 GR GR990403220T patent/GR3032135T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
EP0745873B1 (de) | 1999-09-22 |
GR3032135T3 (en) | 2000-04-27 |
JPH08327843A (ja) | 1996-12-13 |
KR960042107A (ko) | 1996-12-21 |
EP0745873A2 (de) | 1996-12-04 |
DE69604333D1 (de) | 1999-10-28 |
US5539848A (en) | 1996-07-23 |
EP0745873A3 (de) | 1997-02-05 |
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