KR960042107A - 광학 도파관 모듈 및 그 제조방법 - Google Patents

광학 도파관 모듈 및 그 제조방법 Download PDF

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KR960042107A
KR960042107A KR1019960018110A KR19960018110A KR960042107A KR 960042107 A KR960042107 A KR 960042107A KR 1019960018110 A KR1019960018110 A KR 1019960018110A KR 19960018110 A KR19960018110 A KR 19960018110A KR 960042107 A KR960042107 A KR 960042107A
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갈로웨이 데비드
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빈센트 비. 인그라시아
모토로라 인코포레이티드
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227—Active alignment methods, e.g. procedures and algorithms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

본 발명은, 제1 및 제2표면을 가지는 제1클래딩 영역(12)이 형성된다. 제1표면(18)은, 제1표면(18)에 연장되는 제1코어 영역을 가지고 제2표(19)은, 제2표면(19)에 연장되는 제2코어 영역을 가진다. 제3표면(17)과, 제3표면(17)을 가지는 제2클래딩 영역(13)은 제1클래딩 영역(12)의 제1표면(18)상에 고정된다. 제3클래딩 영역(11)의 제4표면(21)과, 제4표면(21)을 가지는 제3클래딩 영역(11)은, 제1클래딩 영역(12)의 제2표면(19)에 고정된다.

Description

광학 도파관 모듈 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 도파관의 일부를 제거한 확대 사시도, 제2도는 가요성 기판 일예의 부분 확대 평면도, 제3도는 한 광학 도파관 모듈의 확대 단면도.

Claims (4)

  1. 광학 도파관에 있어서 : 제1클래딩 영역에 연장되는 제1코어 영역 가지는 제1표면과, 제1클래딩 영역에 연장되는 제2코어 영역을 가지는 제2표면을 구비하는 제1클래딩 영역과 ; 상기 제1코어 영역을 덮는, 제1클래딩 영역의 제1표면상에 위치된 제2클래딩 영역의 제3표면을 가지는 제2클래딩 영역과; 상기 제2코어 영역을 덮는, 제1클래딩 영역과 제3클래딩 영역 사이에, 상기 제1클래딩 영역의 제2표면 상에 위치된 제4표면을 가지는 제3클래딩 영역을 포함하는 것을 특징으로 하는 광학 도파관.
  2. 광학 도파관에 있어서 : 제1단부, 제2단부, 상기 제1단부로부터 연장되는 제1코어 영역을 가지는 제1표면 및 상기 제1단부로부터 연장되는 제2코어 영역을 가지는 제2표면을 지닌 제1클래딩 영역과; 상기 제1코어 영역을 덮고, 제3단부와, 상기 제1클래딩 영역의 제1단부와 상기 제2클래딩 영역의 제3단부가 메이팅되는 제1클래딩 영역의 제1표면 상부에 위치된 제2클래딩 영역의 제3표면을 지닌 제2클래딩 영역 및; 상기 제1코어 영역을 덮는, 제4단부와, 상기 클래딩 영역의 제1단부와 상기 제2클래딩 영역의 제4단부가 메이팅되는 제1클래딩 영역의 제2표면 상부에 위치되는 제3클래딩 영역의 제4표면을 지닌 제3클래딩 영역을 포함하는 것을 특징으로 하는 광학 도파관.
  3. 광학 도파관 모듈에 있어서 : 복수의 제1전기 트레이스와 복수의 제1본딩 패드를 가진 상호 접속 기판과; 코어 영역의 제1포션과 클래딩 영역의 제2포션이 노출된 제1단부, 코어 영역의 제3포션과 클래딩 영역의 제4포션이 노출된 제2단부, 제1표면, 제2표면, 코어 영역, 상기 코어 영역의 둘레에 감싸지고 상기 제1표면과 상기 제2표면이 형성된 클래딩 영역과; 도파관의 제2표면과 메이팅된 제1표면, 제2표면, 도파관의 제1단부에 위치된 커브 표면부를 가진 성형체와; 상기 제1단부와 상기 커브 표면을 따르고 상기 성형체의 제2표면을 따라 메이팅되고 그로부터 연장된, 도파관 코어 영역의 제1포션과 작동가능하게 결합된 광학 클리어 포션, 복수의 제2전기 트레이스, 복수의 제2전기 본딩 패드, 복수의 제3본딩 패드를 가진 가요성 테이프와; 상기 가요성 테이프의 복수의 제1본딩 패드와 도파관의 코어 영역 중 어느 한개와 작동가능하게 결합된 작동 포션과 제4표면을 가지는 광장치 및; 상기 광장치의 제4표면에 접촉된 열 분산 장치가 포함된 것을 특징으로 하는 광학 도파관 모듈.
  4. 광학 도파관을 제조하는 방법에 있어서 : 제1단부, 제2단부, 상기 제1단부로부터 연장되는 제1코어 영역을 가진 제1표면, 제1단부로부터 연장되는 제2코어 영역을 가진 제2표면을 구비한 제1클래딩 영역을 형성하는 단계와; 제1코어 영역을 덮고, 제1클래딩 영역의 제1단부를 메이팅하는 제1클래딩 영역의 제1표면에 위치된 제2클래딩 영역의 제3표면 및 제2클래딩 영역의 제3단부를 가진 제2클래딩 영역을 형성하는 단계 및; 광학 도파관을 제조하고, 제1클래딩 영역의 제1단부와 제2클래딩 영역의 제4단부가 메이팅되는 제1클래딩 영역의 제2표면의 상부에 위치된 제3클래딩 영역의 제4표면 및 제2클래딩 영역의 제4단부를 구비한 제3클래딩 영역을 형성하는 단계를 포함하는 것을 특징으로 하는 광학 도파관을 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960018110A 1995-05-31 1996-05-23 광학 도파관 모듈 및 그 제조방법 KR960042107A (ko)

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US456,207 1995-05-31
US08/456,207 US5539848A (en) 1995-05-31 1995-05-31 Optical waveguide module and method of making

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US (1) US5539848A (ko)
EP (1) EP0745873B1 (ko)
JP (1) JPH08327843A (ko)
KR (1) KR960042107A (ko)
DE (1) DE69604333T2 (ko)
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KR100798200B1 (ko) * 2004-07-12 2008-01-24 닛토덴코 가부시키가이샤 가요성 광도파로의 제조 방법

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US6805493B2 (en) 1996-03-12 2004-10-19 3M Innovative Properties Company Optical connector assembly using partial large diameter alignment features
US5940562A (en) * 1996-03-12 1999-08-17 Minnesota Mining And Manufacturing Company Stubless optoelectronic device receptacle
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US5539848A (en) 1996-07-23
DE69604333D1 (de) 1999-10-28
EP0745873B1 (en) 1999-09-22
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GR3032135T3 (en) 2000-04-27
EP0745873A3 (en) 1997-02-05

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