DE69535291D1 - Integrierter optoelektronischer Verbund und Stecker - Google Patents

Integrierter optoelektronischer Verbund und Stecker

Info

Publication number
DE69535291D1
DE69535291D1 DE69535291T DE69535291T DE69535291D1 DE 69535291 D1 DE69535291 D1 DE 69535291D1 DE 69535291 T DE69535291 T DE 69535291T DE 69535291 T DE69535291 T DE 69535291T DE 69535291 D1 DE69535291 D1 DE 69535291D1
Authority
DE
Germany
Prior art keywords
plug
optoelectronic composite
integrated optoelectronic
integrated
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69535291T
Other languages
English (en)
Other versions
DE69535291T2 (de
Inventor
Takuhiro Tani
Toshikazu Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE69535291D1 publication Critical patent/DE69535291D1/de
Publication of DE69535291T2 publication Critical patent/DE69535291T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
DE69535291T 1994-09-28 1995-09-27 Integrierter optoelektronischer Verbund und Stecker Expired - Fee Related DE69535291T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US313765 1994-09-28
US08/313,765 US5535296A (en) 1994-09-28 1994-09-28 Integrated optoelectronic coupling and connector

Publications (2)

Publication Number Publication Date
DE69535291D1 true DE69535291D1 (de) 2006-12-21
DE69535291T2 DE69535291T2 (de) 2007-05-31

Family

ID=23217055

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69535291T Expired - Fee Related DE69535291T2 (de) 1994-09-28 1995-09-27 Integrierter optoelektronischer Verbund und Stecker
DE69525701T Expired - Fee Related DE69525701T2 (de) 1994-09-28 1995-09-27 Integrierter optoelektronischer Verbund und Stecker

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69525701T Expired - Fee Related DE69525701T2 (de) 1994-09-28 1995-09-27 Integrierter optoelektronischer Verbund und Stecker

Country Status (4)

Country Link
US (2) US5535296A (de)
EP (2) EP0704732B1 (de)
JP (2) JP3143051B2 (de)
DE (2) DE69535291T2 (de)

Families Citing this family (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5555333A (en) * 1993-07-12 1996-09-10 Ricoh Company, Ltd. Optical module and a fabrication process thereof
JP3345518B2 (ja) * 1994-09-28 2002-11-18 株式会社東芝 光半導体モジュールの製造方法
US5717533A (en) 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
US5546281A (en) 1995-01-13 1996-08-13 Methode Electronics, Inc. Removable optoelectronic transceiver module with potting box
JPH09318849A (ja) * 1996-05-24 1997-12-12 Fujitsu Ltd 光伝送モジュールおよびその製造方法
JP3274972B2 (ja) * 1996-07-31 2002-04-15 京セラ株式会社 光学素子保持部材の製造方法
JP3417767B2 (ja) * 1996-08-29 2003-06-16 株式会社東芝 単結晶部品の製造方法
US6840936B2 (en) * 1996-10-22 2005-01-11 Epicor Medical, Inc. Methods and devices for ablation
DE19709842C1 (de) 1997-02-28 1998-10-15 Siemens Ag Elektrooptische Koppelbaugruppe
DE19711283A1 (de) * 1997-03-18 1998-10-29 Siemens Ag Hermetisch dichtes optisches Sendemodul
CN1220736A (zh) 1997-03-27 1999-06-23 日本碍子株式会社 密封型纤维阵列及密封型纤维阵列的制造方法
US5930428A (en) * 1997-08-12 1999-07-27 Rockwell Science Center, Inc. Blind-mate fiber optic connector with integral optoelectronic receiver circuits
US6085007A (en) * 1998-02-27 2000-07-04 Jiang; Ching-Long Passive alignment member for vertical surface emitting/detecting device
US6713788B2 (en) 1998-03-30 2004-03-30 Micron Technology, Inc. Opto-electric mounting apparatus
US6380563B2 (en) 1998-03-30 2002-04-30 Micron Technology, Inc. Opto-electric mounting apparatus
US6095697A (en) * 1998-03-31 2000-08-01 Honeywell International Inc. Chip-to-interface alignment
US6473553B1 (en) 1998-04-17 2002-10-29 Seagate Technology Llc Apparatus for holding and engaging micro-machined objects and method for making same
US6049650A (en) * 1998-04-17 2000-04-11 Seagate Technology, Inc. Structure for micro-machine optical tooling and method for making and using
US6203333B1 (en) 1998-04-22 2001-03-20 Stratos Lightwave, Inc. High speed interface converter module
US6179627B1 (en) 1998-04-22 2001-01-30 Stratos Lightwave, Inc. High speed interface converter module
US6172997B1 (en) 1998-06-16 2001-01-09 Aculight Corporation Integrated semiconductor diode laser pumped solid state laser
DE19843164C2 (de) * 1998-09-21 2000-11-23 Harting Elektrooptische Bauteile Gmbh & Co Kg Steckerteil für eine optische Steckverbindung
US6521989B2 (en) * 1998-10-08 2003-02-18 Honeywell Inc. Methods and apparatus for hermetically sealing electronic packages
US6292615B1 (en) 1999-03-09 2001-09-18 Uniphase Telecommunications Products, Inc. Optical fiber feedthrough
US6445837B1 (en) 1999-03-31 2002-09-03 Nu-Wave Photonics, Inc. Hybrid opto-electronic circuits and method of making
US6498880B1 (en) * 1999-03-31 2002-12-24 Picolight Incorporated Fiber optic ferrule
US6213651B1 (en) 1999-05-26 2001-04-10 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US7013088B1 (en) 1999-05-26 2006-03-14 Jds Uniphase Corporation Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers
US6873800B1 (en) 1999-05-26 2005-03-29 Jds Uniphase Corporation Hot pluggable optical transceiver in a small form pluggable package
US6952532B2 (en) * 1999-05-27 2005-10-04 Jds Uniphase Corporation Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US7116912B2 (en) * 1999-05-27 2006-10-03 Jds Uniphase Corporation Method and apparatus for pluggable fiber optic modules
US20040069997A1 (en) * 1999-05-27 2004-04-15 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20010048793A1 (en) * 1999-05-27 2001-12-06 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20020030872A1 (en) * 1999-05-27 2002-03-14 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20020033979A1 (en) * 1999-05-27 2002-03-21 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US6632030B2 (en) 1999-05-27 2003-10-14 E20 Communications, Inc. Light bending optical block for fiber optic modules
US6220873B1 (en) 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
US6373644B1 (en) * 1999-11-15 2002-04-16 Axsun Technologies, Inc. Micro optical bench component clip structures
US6583902B1 (en) 1999-12-09 2003-06-24 Alvesta, Inc. Modular fiber-optic transceiver
ATE340761T1 (de) * 1999-12-15 2006-10-15 Asulab Sa Hermetische in-situ-gehäusungsmethode von mikrosystemen
EP1111420A3 (de) * 1999-12-20 2001-09-19 Talltec Sensors S.A. Optische Verbindungsvorrichtung
US6704515B1 (en) 1999-12-30 2004-03-09 The Boeing Company Fiber optic interface module and associated fabrication method
JP2001272570A (ja) * 2000-03-27 2001-10-05 Ngk Insulators Ltd 光ファイバアレイ
JP2001281506A (ja) 2000-03-31 2001-10-10 Ngk Insulators Ltd 光ヘッド
US6848839B2 (en) * 2000-04-07 2005-02-01 Shipley Company, L.L.C. Methods and devices for coupling optoelectronic packages
US6866426B1 (en) 2000-04-07 2005-03-15 Shipley Company, L.L.C. Open face optical fiber array for coupling to integrated optic waveguides and optoelectronic submounts
US6916121B2 (en) 2001-08-03 2005-07-12 National Semiconductor Corporation Optical sub-assembly for optoelectronic modules
US6741778B1 (en) * 2000-05-23 2004-05-25 International Business Machines Corporation Optical device with chip level precision alignment
SE519713C2 (sv) * 2000-05-23 2003-04-01 Ericsson Telefon Ab L M Förfarande och anordning för passiv upplinjering
US6788853B2 (en) * 2000-06-28 2004-09-07 Shipley Company, L.L.C. Method for cleaving integrated optic waveguides to provide a smooth waveguide endface
US6474879B1 (en) * 2000-08-08 2002-11-05 Stratos Lightwave, Inc. Post assembly metallization of a device to form hermetic seal
US6464407B1 (en) 2000-10-13 2002-10-15 Berg Technology, Inc. Optical connector having a ferrule with alignment and sealing features
US20020122637A1 (en) * 2000-12-26 2002-09-05 Anderson Gene R. Optical transmitter, receiver or transceiver module
US7021836B2 (en) * 2000-12-26 2006-04-04 Emcore Corporation Attenuator and conditioner
US6799902B2 (en) * 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6546172B2 (en) 2001-02-20 2003-04-08 Avanti Optics Corporation Optical device
US6956999B2 (en) 2001-02-20 2005-10-18 Cyberoptics Corporation Optical device
US6546173B2 (en) * 2001-02-20 2003-04-08 Avanti Optics Corporation Optical module
US20040212802A1 (en) * 2001-02-20 2004-10-28 Case Steven K. Optical device with alignment compensation
US6443631B1 (en) 2001-02-20 2002-09-03 Avanti Optics Corporation Optical module with solder bond
US6635866B2 (en) 2001-04-19 2003-10-21 Internation Business Machines Corporation Multi-functional fiber optic coupler
US7023705B2 (en) * 2001-08-03 2006-04-04 National Semiconductor Corporation Ceramic optical sub-assembly for optoelectronic modules
US7269027B2 (en) * 2001-08-03 2007-09-11 National Semiconductor Corporation Ceramic optical sub-assembly for optoelectronic modules
US6631228B2 (en) 2001-09-14 2003-10-07 Photon-X, Inc. Adhesive-free bonding method of fiber attachment for polymer optical waveguide on polymer substrate
EP1464084A1 (de) * 2002-01-09 2004-10-06 Infineon Technologies AG Photodiodenanordnung und verfahren zur herstellung einer verbindung zwischen einem ersten halbleiterbauelement und einem zweiten halbleiterbauelement
US7123798B2 (en) * 2002-03-29 2006-10-17 Ngk Insulators, Ltd. Optical device and method of producing the same
DE10233203B4 (de) * 2002-07-22 2006-08-03 Mergeoptics Gmbh Modul mit einem Lichtleitelement und Verfahren zum Herstellen
GB2408111A (en) * 2002-08-20 2005-05-18 Cyberoptics Corp Optical alignment mount with height adjustment
US7195402B2 (en) * 2002-12-20 2007-03-27 Ngk Insulators, Ltd. Optical device
US7321703B2 (en) * 2002-12-20 2008-01-22 Ngk Insulators, Ltd. Optical device
US7308174B2 (en) * 2002-12-20 2007-12-11 Ngk Insulators, Ltd. Optical device including a filter member for dividing a portion of signal light
WO2004109354A1 (ja) * 2003-06-02 2004-12-16 Ngk Insulators, Ltd. 光デバイス
US6883978B2 (en) * 2003-06-26 2005-04-26 Matsushita Electric Industrial Co., Ltd. Low cost package design for fiber coupled optical component
US7284913B2 (en) 2003-07-14 2007-10-23 Matsushita Electric Industrial Co., Ltd. Integrated fiber attach pad for optical package
US7156562B2 (en) * 2003-07-15 2007-01-02 National Semiconductor Corporation Opto-electronic module form factor having adjustable optical plane height
WO2005010570A2 (en) * 2003-07-25 2005-02-03 Xponent Photonics Inc. Packaging for a fiber-coupled optical device
US7410088B2 (en) * 2003-09-05 2008-08-12 Matsushita Electric Industrial, Co., Ltd. Solder preform for low heat stress laser solder attachment
US7021838B2 (en) 2003-12-16 2006-04-04 Matsushita Electric Industrial Co., Ltd. Optimizing alignment of an optical fiber to an optical output port
JP2008505362A (ja) * 2004-06-30 2008-02-21 イクスポーネント フォトニクス，インコーポレイティド ファイバ結合光学機器のパッケージ化
US7338218B2 (en) * 2005-02-01 2008-03-04 Ibiden Co., Ltd. Optical module, method of manufacturing the optical module, and data communication system including the optical module
JP4468210B2 (ja) * 2005-02-28 2010-05-26 株式会社東芝 Ｌｓｉパッケージ用インターフェイスモジュール及びｌｓｉ実装体
US7263260B2 (en) * 2005-03-14 2007-08-28 Matsushita Electric Industrial Co., Ltd. Low cost, high precision multi-point optical component attachment
US7438484B2 (en) * 2005-04-06 2008-10-21 Ibiden Co., Ltd. Electrical connector for a multi form-factor pluggable transceiver, and data communication system including the electrical connector
JP4742729B2 (ja) * 2005-08-02 2011-08-10 ソニー株式会社 光結合器及び光コネクタ
US7559703B2 (en) * 2005-09-14 2009-07-14 Ibiden Co., Ltd. Optical module and data communication system including the optical module
US7543993B2 (en) 2006-03-03 2009-06-09 Hoya Corporation Usa Fiber-coupled optical device mounted on a circuit board
TWI307416B (en) 2006-05-05 2009-03-11 Everlight Electronics Co Ltd Method of manufacturing photo coupler
US7489440B2 (en) * 2006-10-19 2009-02-10 International Business Machines Corporation Optical spectral filtering and dispersion compensation using semiconductor optical amplifiers
US7539366B1 (en) 2008-01-04 2009-05-26 International Business Machines Corporation Optical transceiver module
JPWO2010140604A1 (ja) 2009-06-05 2012-11-22 先端フォトニクス株式会社 サブマウント、これを備えた光モジュール、及びサブマウントの製造方法
US8755655B2 (en) * 2009-09-22 2014-06-17 Oracle America, Inc. Edge-coupled optical proximity communication
KR101144665B1 (ko) * 2010-09-20 2012-05-24 옵티시스 주식회사 파장 분할 다중화 및 역다중화 장치
US8456961B1 (en) 2011-03-22 2013-06-04 Western Digital (Fremont), Llc Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording assembly
CN102736185B (zh) * 2011-04-01 2016-03-09 鸿富锦精密工业（深圳）有限公司 光纤耦合连接器
US8518748B1 (en) 2011-06-29 2013-08-27 Western Digital (Fremont), Llc Method and system for providing a laser submount for an energy assisted magnetic recording head
CN102955204B (zh) * 2011-08-25 2016-03-09 鸿富锦精密工业（深圳）有限公司 光纤耦合连接器
US8288204B1 (en) 2011-08-30 2012-10-16 Western Digital (Fremont), Llc Methods for fabricating components with precise dimension control
TW201321815A (zh) * 2011-11-18 2013-06-01 Universal Microelectronics Co Ltd 光機總成及光電封裝
TWI514699B (zh) * 2011-12-28 2015-12-21 Hon Hai Prec Ind Co Ltd 光纖連接器
US9575269B2 (en) 2012-03-29 2017-02-21 Intel Corporation Active optical cable assembly
KR101691116B1 (ko) * 2012-03-29 2016-12-29 인텔 코포레이션 액티브 광케이블 조립체
US9475151B1 (en) 2012-10-30 2016-10-25 Western Digital (Fremont), Llc Method and apparatus for attaching a laser diode and a slider in an energy assisted magnetic recording head
TWI550262B (zh) * 2012-11-08 2016-09-21 鴻海精密工業股份有限公司 用於光纖檢測的固定裝置
CN103808489B (zh) * 2012-11-09 2018-02-06 泰州市润杰五金机械制造有限公司 用于光纤检测的固定装置
CN108152896B (zh) * 2013-02-01 2019-12-13 东莞市川富电子有限公司 光纤耦合连接器的组装方法
TWI521248B (zh) * 2014-08-07 2016-02-11 光興國際股份有限公司 光學收發器
JP6977267B2 (ja) * 2017-02-02 2021-12-08 富士通オプティカルコンポーネンツ株式会社 光デバイス及び光デバイスの製造方法
JP7081356B2 (ja) * 2018-07-17 2022-06-07 日本電信電話株式会社 光ファイバガイド部品と光接続構造
US10957030B2 (en) 2018-08-14 2021-03-23 International Business Machines Corporation Image conduction apparatus for soldering inner void analysis
CN112638027B (zh) * 2020-11-30 2023-02-28 中航光电科技股份有限公司 一种光纤型光电复合板
KR102669828B1 (ko) * 2021-06-04 2024-05-28 주식회사 아모센스 레이저 다이오드 패키지

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624989A (en) * 1979-08-09 1981-03-10 Nippon Telegr & Teleph Corp <Ntt> Solid state laser device
JPH01298306A (ja) * 1988-05-27 1989-12-01 Nec Corp 光ファイバ受光装置
US4946553A (en) * 1988-09-08 1990-08-07 United Technologies Corporation Apparatus for interfacing an optical fiber to an optical source
JPH02220011A (ja) * 1989-02-21 1990-09-03 Nec Corp 並列伝送光モジュール
US5107231A (en) * 1989-05-25 1992-04-21 Epsilon Lambda Electronics Corp. Dielectric waveguide to TEM transmission line signal launcher
US5077878A (en) * 1990-07-11 1992-01-07 Gte Laboratories Incorporated Method and device for passive alignment of diode lasers and optical fibers
US5163113A (en) * 1990-07-19 1992-11-10 Gte Laboratories Incorporated Laser-to-fiber coupling apparatus
US5243671A (en) * 1990-07-19 1993-09-07 Gte Laboratories Incorporated Laser-to-fiber coupling apparatus
JPH04301810A (ja) * 1991-03-29 1992-10-26 Nec Corp 光半導体アレイモジュール
US5168537A (en) * 1991-06-28 1992-12-01 Digital Equipment Corporation Method and apparatus for coupling light between an optoelectronic device and a waveguide
JP2976642B2 (ja) * 1991-11-07 1999-11-10 日本電気株式会社 光結合回路
US5337398A (en) * 1992-11-30 1994-08-09 At&T Bell Laboratories Single in-line optical package
US5291572A (en) * 1993-01-14 1994-03-01 At&T Bell Laboratories Article comprising compression bonded parts
US5345527A (en) * 1993-09-03 1994-09-06 Motorola, Inc. Intelligent opto-bus with display

Also Published As

Publication number Publication date
DE69535291T2 (de) 2007-05-31
EP1143278B1 (de) 2006-11-08
JP3143051B2 (ja) 2001-03-07
JP3329797B2 (ja) 2002-09-30
EP0704732A1 (de) 1996-04-03
EP1143278A2 (de) 2001-10-10
EP1143278A3 (de) 2002-03-20
DE69525701D1 (de) 2002-04-11
JPH08179171A (ja) 1996-07-12
EP0704732B1 (de) 2002-03-06
US5535296A (en) 1996-07-09
JP2001141969A (ja) 2001-05-25
US5687267A (en) 1997-11-11
DE69525701T2 (de) 2002-11-21

Similar Documents

Publication Publication Date Title
DE69535291D1 (de) Integrierter optoelektronischer Verbund und Stecker
DE19580279T1 (de) Schlüsselanhänger- und Befestigung
ID23684A (id) Komposisi-polimer-organoclay dan pembuatannya
FR2726903B1 (fr) Ecartometre integre
FI954991A0 (fi) Bisyklisiä tetrahydropyrazolopyridiinejä
DE69505450D1 (de) Stecker
DE69707992D1 (de) Stecker mit lösbarer Verriegelung
DE69634957D1 (de) Stecker
NO971996D0 (no) Tre-kompositt
DE69504742D1 (de) Stecker
FI940204A0 (fi) Oeverfoeringsanordning foer realisering av lineaer oeverfoeringsroerelse
DE69616816D1 (de) Stecker
DE69514529D1 (de) Verbundwerkstoff
KR950033764U (ko) 관이음쇠
FIU940200U0 (fi) Anordning foer insaettning av produkter i foersaeljnings- och exponeringsstaell
KR960022892U (ko) 난간 장식구
KR970057451U (ko) 차량용 햇빛 가리개 고정장치 및 이를 이용한 햇빛 가리개
FI946093A0 (fi) Foerfarande foer matning av gas in i en flaska innehaollande dryck samt en kork foer foerverkligande av foerfarandet
KR970051250U (ko) 장식구
DK116793D0 (da) Veje- og portioneringsapparat
DK9793D0 (da) Veje- og portioneringsapparat
FI942118A0 (fi) Foerfarande foer framstaellning av produkter av finfoerdelat traematerial
KR950024292U (ko) 안전조명우산
KR950024305U (ko) 가방용 장식구
KR960003758U (ko) 뒤집혀지지 않는 우산

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee