DE69532174D1 - Dünnfilm-Sensorelement sowie Verfahren zu seiner Herstellung - Google Patents
Dünnfilm-Sensorelement sowie Verfahren zu seiner HerstellungInfo
- Publication number
- DE69532174D1 DE69532174D1 DE69532174T DE69532174T DE69532174D1 DE 69532174 D1 DE69532174 D1 DE 69532174D1 DE 69532174 T DE69532174 T DE 69532174T DE 69532174 T DE69532174 T DE 69532174T DE 69532174 D1 DE69532174 D1 DE 69532174D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- thin film
- sensor element
- film sensor
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
- G01P15/0922—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up of the bending or flexing mode type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Micromachines (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1341394 | 1994-02-07 | ||
JP1341394 | 1994-02-07 | ||
JP13698194 | 1994-06-20 | ||
JP13698194 | 1994-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69532174D1 true DE69532174D1 (de) | 2004-01-08 |
DE69532174T2 DE69532174T2 (de) | 2004-04-15 |
Family
ID=26349208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69532174T Expired - Fee Related DE69532174T2 (de) | 1994-02-07 | 1995-01-23 | Dünnfilm-Sensorelement sowie Verfahren zu seiner Herstellung |
Country Status (5)
Country | Link |
---|---|
US (2) | US5612536A (de) |
EP (1) | EP0667532B1 (de) |
KR (1) | KR100262137B1 (de) |
CN (1) | CN1088918C (de) |
DE (1) | DE69532174T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000076295A (ko) * | 1998-01-16 | 2000-12-26 | 다니구찌 이찌로오, 기타오카 다카시 | 박막 압전 소자 |
US6351057B1 (en) * | 1999-01-25 | 2002-02-26 | Samsung Electro-Mechanics Co., Ltd | Microactuator and method for fabricating the same |
JP3438709B2 (ja) * | 2000-08-31 | 2003-08-18 | セイコーエプソン株式会社 | 圧電デバイス及びその製造方法と圧電発振器の製造方法 |
KR100398363B1 (ko) * | 2000-12-05 | 2003-09-19 | 삼성전기주식회사 | Fbar 소자 및 그 제조방법 |
JP3684233B2 (ja) * | 2002-05-14 | 2005-08-17 | キヤノン株式会社 | 指紋入力装置及びその製造方法 |
US7083270B2 (en) * | 2002-06-20 | 2006-08-01 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus |
JP3966237B2 (ja) * | 2003-06-19 | 2007-08-29 | セイコーエプソン株式会社 | 圧電デバイス、圧電デバイスを搭載した電子機器 |
KR101238360B1 (ko) * | 2006-08-16 | 2013-03-04 | 삼성전자주식회사 | 공진기 및 그 제조 방법 |
CA2588165C (fr) * | 2007-05-07 | 2011-05-31 | Serge Mai | Systeme quasi-autonome de stockage d'energie et de motorisation electrique |
US8912036B2 (en) | 2007-08-24 | 2014-12-16 | The Regents Of The University Of Michigan | Growth of ordered crystalline organic films |
KR100924533B1 (ko) | 2007-09-19 | 2009-11-02 | 한국전기연구원 | 복합 생체신호 센서 |
JP4930569B2 (ja) * | 2009-10-14 | 2012-05-16 | 株式会社村田製作所 | 磁気ヘッド駆動用圧電セラミックアクチュエータ |
CN102107845B (zh) * | 2009-12-25 | 2013-11-13 | 中国科学院金属研究所 | 一种微米传感元及其制备方法和应用 |
US8866367B2 (en) | 2011-10-17 | 2014-10-21 | The United States Of America As Represented By The Secretary Of The Army | Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making |
WO2014021701A1 (es) * | 2012-07-31 | 2014-02-06 | Universidad Nacional Autónoma de México | Dispositivo de sensado de perturbaciones pulsadas de tipo elastomecánicas |
JP6264525B2 (ja) * | 2013-03-25 | 2018-01-24 | セイコーエプソン株式会社 | 赤外線センサー、熱検知素子及びそれを用いた熱検知方法 |
DE102013209541A1 (de) * | 2013-05-23 | 2014-11-27 | Siemens Aktiengesellschaft | Sensorelementanordnung und Verfahren zum Herstellen einer Sensorelementanordnung |
US10396755B2 (en) * | 2016-02-17 | 2019-08-27 | Samsung Electro-Mechanics Co., Ltd. | Resonator having frame and method of manufacturing the same |
WO2018130436A1 (en) * | 2017-01-11 | 2018-07-19 | Koninklijke Philips N.V. | Integrated temperature sensor on lead selenide plate detector assembly |
US10697090B2 (en) * | 2017-06-23 | 2020-06-30 | Panasonic Intellectual Property Management Co., Ltd. | Thin-film structural body and method for fabricating thereof |
CN109371376B (zh) * | 2018-12-04 | 2021-04-20 | 北京科技大学 | 一种单一晶体取向的NiO薄膜的可控制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE144482C (de) * | ||||
US4066527A (en) * | 1975-07-18 | 1978-01-03 | Futaba Denshi Kogyo K. K. | Method of producing semiconductor device |
US4339764A (en) * | 1977-05-27 | 1982-07-13 | The United States Of America As Represented By The Secretary Of The Navy | PbSx Se1-x semiconductor |
US4480209A (en) * | 1981-10-09 | 1984-10-30 | Clarion Co., Ltd. | Surface acoustic wave device having a specified crystalline orientation |
US4532424A (en) * | 1983-04-25 | 1985-07-30 | Rockwell International Corporation | Pyroelectric thermal detector array |
JPS60189307A (ja) * | 1984-03-09 | 1985-09-26 | Toshiba Corp | 圧電薄膜共振器およびその製造方法 |
JPH0685450B2 (ja) * | 1986-01-13 | 1994-10-26 | 松下電器産業株式会社 | 強誘電体薄膜素子 |
JPH0672800B2 (ja) * | 1986-03-12 | 1994-09-14 | 松下電器産業株式会社 | 焦電型赤外線センサ |
FR2656689A1 (fr) * | 1989-12-29 | 1991-07-05 | Philips Electronique Lab | Element detecteur pyroelectrique et dispositifs pour la detection de phenomenes thermiques. |
US5210455A (en) * | 1990-07-26 | 1993-05-11 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive actuator having ceramic substrate having recess defining thin-walled portion |
JP2584124B2 (ja) * | 1990-11-01 | 1997-02-19 | 松下電器産業株式会社 | 焦電型赤外線検出器およびその製造方法 |
US5209119A (en) * | 1990-12-12 | 1993-05-11 | Regents Of The University Of Minnesota | Microdevice for sensing a force |
US5286975A (en) * | 1991-05-29 | 1994-02-15 | Matsushita Electric Industrial Co., Ltd. | Pyro-electric type infrared-ray sensor |
JPH05283756A (ja) * | 1992-03-31 | 1993-10-29 | Murata Mfg Co Ltd | 強誘電体薄膜素子 |
US5413667A (en) * | 1992-11-04 | 1995-05-09 | Matsushita Electric Industrial Co., Ltd. | Pyroelectric infrared detector fabricating method |
US5387459A (en) * | 1992-12-17 | 1995-02-07 | Eastman Kodak Company | Multilayer structure having an epitaxial metal electrode |
KR950001303A (ko) * | 1993-06-22 | 1995-01-03 | 이헌조 | 박막 적외선 센서구조 및 그 제조 방법 |
-
1995
- 1995-01-19 US US08/374,989 patent/US5612536A/en not_active Expired - Fee Related
- 1995-01-23 DE DE69532174T patent/DE69532174T2/de not_active Expired - Fee Related
- 1995-01-23 EP EP95100861A patent/EP0667532B1/de not_active Expired - Lifetime
- 1995-02-06 KR KR1019950002031A patent/KR100262137B1/ko not_active IP Right Cessation
- 1995-02-07 CN CN95101916A patent/CN1088918C/zh not_active Expired - Fee Related
-
1996
- 1996-02-09 US US08/600,863 patent/US6105225A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6105225A (en) | 2000-08-22 |
EP0667532A3 (de) | 1998-07-22 |
KR100262137B1 (ko) | 2000-07-15 |
EP0667532A2 (de) | 1995-08-16 |
CN1088918C (zh) | 2002-08-07 |
EP0667532B1 (de) | 2003-11-26 |
DE69532174T2 (de) | 2004-04-15 |
CN1121999A (zh) | 1996-05-08 |
KR950026041A (ko) | 1995-09-18 |
US5612536A (en) | 1997-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |