DE69527695D1 - Verfahren zur Herstellung einer flacheren Dünnfilm-Struktur - Google Patents

Verfahren zur Herstellung einer flacheren Dünnfilm-Struktur

Info

Publication number
DE69527695D1
DE69527695D1 DE69527695T DE69527695T DE69527695D1 DE 69527695 D1 DE69527695 D1 DE 69527695D1 DE 69527695 T DE69527695 T DE 69527695T DE 69527695 T DE69527695 T DE 69527695T DE 69527695 D1 DE69527695 D1 DE 69527695D1
Authority
DE
Germany
Prior art keywords
making
thin film
film structure
flatter
flatter thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69527695T
Other languages
English (en)
Other versions
DE69527695T2 (de
Inventor
James Watterston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Aiwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aiwa Co Ltd filed Critical Aiwa Co Ltd
Publication of DE69527695D1 publication Critical patent/DE69527695D1/de
Application granted granted Critical
Publication of DE69527695T2 publication Critical patent/DE69527695T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Magnetic Heads (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE69527695T 1994-12-05 1995-11-30 Verfahren zur Herstellung einer flacheren Dünnfilm-Struktur Expired - Fee Related DE69527695T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34971294A 1994-12-05 1994-12-05

Publications (2)

Publication Number Publication Date
DE69527695D1 true DE69527695D1 (de) 2002-09-12
DE69527695T2 DE69527695T2 (de) 2003-04-03

Family

ID=23373626

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69527695T Expired - Fee Related DE69527695T2 (de) 1994-12-05 1995-11-30 Verfahren zur Herstellung einer flacheren Dünnfilm-Struktur

Country Status (4)

Country Link
US (1) US5800967A (de)
EP (1) EP0716411B1 (de)
JP (1) JPH08235528A (de)
DE (1) DE69527695T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375063B1 (en) * 1999-07-16 2002-04-23 Quantum Corporation Multi-step stud design and method for producing closely packed interconnects in magnetic recording heads
US6309805B1 (en) * 1999-09-01 2001-10-30 Morton International, Inc. Method for securing and processing thin film materials
US7452659B2 (en) * 2004-02-26 2008-11-18 The Penn State Research Foundation Methods of patterning a surface using single and multilayer molecular films
JP4481142B2 (ja) * 2004-10-22 2010-06-16 花王株式会社 顔形状分類方法および顔形状評価方法および顔形状評価装置
SG10202003822RA (en) * 2015-10-27 2020-05-28 Agency Science Tech & Res Nanoinjection molding
KR102137774B1 (ko) * 2018-12-27 2020-07-24 부산대학교 산학협력단 고분자 평면 광소자용 단일 정렬 멀티패턴 제조 방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895839A (ja) * 1981-12-01 1983-06-07 Nec Corp 半導体装置の製造方法
FR2559294B1 (fr) * 1984-02-03 1988-08-12 Commissariat Energie Atomique Nouvelle tete magnetique d'ecriture et de lecture pour enregistrement perpendiculaire et son procede de fabrication
JPS6365629A (ja) * 1986-09-05 1988-03-24 Nec Corp 半導体装置の製造方法
JPH0810481B2 (ja) * 1987-04-24 1996-01-31 松下電器産業株式会社 薄膜磁気ヘツドの製造方法
US4899434A (en) * 1987-07-28 1990-02-13 Applied Magnetics Corporation Method of making a thin film magnetic head with a leveler layer and superstrate
FR2641110B1 (de) * 1988-12-23 1995-07-21 Thomson Csf
US4878290A (en) * 1989-02-13 1989-11-07 International Business Machines Corporation Method for making thin film magnetic head
US5048175A (en) * 1989-03-03 1991-09-17 Seagate Technology, Inc. Method for grounding pole structures in thin film magnetic heads
US4933209A (en) * 1989-06-28 1990-06-12 Hewlett-Packard Company Method of making a thin film recording head apparatus utilizing polyimide films
US5116719A (en) * 1990-02-15 1992-05-26 Seagate Technology, Inc. Top pole profile for pole tip trimming
US5200056A (en) * 1990-02-15 1993-04-06 Seagate Technology Inc. Method for aligning pole tips in a thin film head
JPH0410208A (ja) * 1990-04-27 1992-01-14 Hitachi Ltd 薄膜磁気ヘッド及びその製造方法
US5137750A (en) * 1990-11-06 1992-08-11 Seagate Technology, Inc. Method of making a thin film head with contoured pole face edges for undershoot reduction
US5256249A (en) * 1991-09-17 1993-10-26 Seagate Technology, Inc. Method of manufacturing a planarized magnetoresistive sensor
US5286607A (en) * 1991-12-09 1994-02-15 Chartered Semiconductor Manufacturing Pte Ltd. Bi-layer resist process for semiconductor processing
US5282308A (en) * 1992-12-29 1994-02-01 International Business Machines Corporation Thin film planarization process for fabricating magnetic heads employing a stitched pole structure
US5283942A (en) * 1992-12-29 1994-02-08 International Business Machines Corporation Sacrificial layer planarization process for fabricating a narrow thin film inductive head
JPH06342507A (ja) * 1993-05-31 1994-12-13 Mitsumi Electric Co Ltd 薄膜磁気ヘッド基板の製造方法
JPH07130568A (ja) * 1993-11-05 1995-05-19 Fuji Electric Co Ltd 薄膜コイルの製造方法

Also Published As

Publication number Publication date
US5800967A (en) 1998-09-01
JPH08235528A (ja) 1996-09-13
EP0716411B1 (de) 2002-08-07
EP0716411A1 (de) 1996-06-12
DE69527695T2 (de) 2003-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SONY CORP., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee