DE69517556T2 - Oberflächenwellenanordnung - Google Patents

Oberflächenwellenanordnung

Info

Publication number
DE69517556T2
DE69517556T2 DE69517556T DE69517556T DE69517556T2 DE 69517556 T2 DE69517556 T2 DE 69517556T2 DE 69517556 T DE69517556 T DE 69517556T DE 69517556 T DE69517556 T DE 69517556T DE 69517556 T2 DE69517556 T2 DE 69517556T2
Authority
DE
Germany
Prior art keywords
surface wave
wave arrangement
arrangement
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69517556T
Other languages
English (en)
Other versions
DE69517556D1 (de
Inventor
Hideya Morishita
C O Murata Man Co Nakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE69517556D1 publication Critical patent/DE69517556D1/de
Publication of DE69517556T2 publication Critical patent/DE69517556T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1064Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02818Means for compensation or elimination of undesirable effects
    • H03H9/02834Means for compensation or elimination of undesirable effects of temperature influence
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/058Holders; Supports for surface acoustic wave devices
    • H03H9/059Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
DE69517556T 1994-05-09 1995-05-05 Oberflächenwellenanordnung Expired - Lifetime DE69517556T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6094982A JPH07303022A (ja) 1994-05-09 1994-05-09 弾性表面波装置

Publications (2)

Publication Number Publication Date
DE69517556D1 DE69517556D1 (de) 2000-07-27
DE69517556T2 true DE69517556T2 (de) 2001-03-08

Family

ID=14125112

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69517556T Expired - Lifetime DE69517556T2 (de) 1994-05-09 1995-05-05 Oberflächenwellenanordnung

Country Status (4)

Country Link
EP (1) EP0682408B1 (de)
JP (1) JPH07303022A (de)
KR (1) KR0180806B1 (de)
DE (1) DE69517556T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10150341A (ja) * 1996-09-19 1998-06-02 Murata Mfg Co Ltd 1ポート型弾性表面波装置
JP3275775B2 (ja) * 1997-05-16 2002-04-22 株式会社村田製作所 弾性表面波装置
US8617934B1 (en) 2000-11-28 2013-12-31 Knowles Electronics, Llc Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
JP2002344284A (ja) * 2001-03-14 2002-11-29 Murata Mfg Co Ltd 弾性表面波装置、および、これを搭載した通信装置
JPWO2005088834A1 (ja) * 2004-03-12 2007-08-09 株式会社村田製作所 1ポート弾性表面波共振子装置
US9374643B2 (en) 2011-11-04 2016-06-21 Knowles Electronics, Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138115A (ja) * 1982-02-12 1983-08-16 Murata Mfg Co Ltd チップ状圧電振動部品の製造方法
JPH02170611A (ja) * 1988-12-22 1990-07-02 Clarion Co Ltd 弾性表面波装置

Also Published As

Publication number Publication date
KR0180806B1 (ko) 1999-04-01
JPH07303022A (ja) 1995-11-14
EP0682408B1 (de) 2000-06-21
DE69517556D1 (de) 2000-07-27
EP0682408A1 (de) 1995-11-15
KR950035058A (ko) 1995-12-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition