DE69515627D1 - Verfahren zur Prüfung von Drahtverbindungen - Google Patents

Verfahren zur Prüfung von Drahtverbindungen

Info

Publication number
DE69515627D1
DE69515627D1 DE69515627T DE69515627T DE69515627D1 DE 69515627 D1 DE69515627 D1 DE 69515627D1 DE 69515627 T DE69515627 T DE 69515627T DE 69515627 T DE69515627 T DE 69515627T DE 69515627 D1 DE69515627 D1 DE 69515627D1
Authority
DE
Germany
Prior art keywords
procedure
wire connections
testing wire
testing
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69515627T
Other languages
English (en)
Other versions
DE69515627T2 (de
Inventor
Atsushi Fujisawa
Akihiro Komori
Shigeki Furukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of DE69515627D1 publication Critical patent/DE69515627D1/de
Application granted granted Critical
Publication of DE69515627T2 publication Critical patent/DE69515627T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE69515627T 1995-01-05 1995-12-13 Verfahren zur Prüfung von Drahtverbindungen Expired - Fee Related DE69515627T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7000266A JPH08185952A (ja) 1995-01-05 1995-01-05 電線の接続状態検査方法

Publications (2)

Publication Number Publication Date
DE69515627D1 true DE69515627D1 (de) 2000-04-20
DE69515627T2 DE69515627T2 (de) 2000-11-23

Family

ID=11469116

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69515627T Expired - Fee Related DE69515627T2 (de) 1995-01-05 1995-12-13 Verfahren zur Prüfung von Drahtverbindungen

Country Status (4)

Country Link
US (1) US5757955A (de)
EP (1) EP0721102B1 (de)
JP (1) JPH08185952A (de)
DE (1) DE69515627T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3639516B2 (ja) * 2000-09-28 2005-04-20 矢崎総業株式会社 端子金具の検査装置
JP5800590B2 (ja) * 2011-06-17 2015-10-28 矢崎総業株式会社 電線接続端子および当該電線接続端子を備えたワイヤハーネス

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1603880A (en) * 1978-05-09 1981-12-02 Raychem Pontoise Sa Electrical connections
US4271330A (en) * 1978-05-23 1981-06-02 Raychem Pontoise S.A. Heat-recoverable articles
US4547897A (en) * 1983-02-01 1985-10-15 Honeywell Inc. Image processing for part inspection
JPS6052728A (ja) * 1983-08-31 1985-03-26 Matsushita Electric Works Ltd はんだ付不良検出方法
US4832248A (en) * 1986-11-20 1989-05-23 Raychem Corporation Adhesive and solder connection device
JPH07104947B2 (ja) * 1988-11-30 1995-11-13 東芝機械株式会社 二次元配列物体の検査装置
WO1990007202A1 (en) * 1988-12-21 1990-06-28 Raychem Corporation Heat-recoverable soldering device
US5157463A (en) * 1991-02-15 1992-10-20 Texas Instruments Incorporated Method for determining solder quality
US5318173A (en) * 1992-05-29 1994-06-07 Simco/Ramic Corporation Hole sorting system and method
US5335293A (en) * 1992-06-16 1994-08-02 Key Technology, Inc. Product inspection method and apparatus
DE69331433T2 (de) * 1992-10-22 2002-10-02 Advanced Interconnection Tech Einrichtung zur automatischen optischen Prüfung von Leiterplatten mit darin verlegten Drähten
JP3119743B2 (ja) * 1992-11-19 2000-12-25 松下電器産業株式会社 実装検査装置
US5439160A (en) * 1993-03-31 1995-08-08 Siemens Corporate Research, Inc. Method and apparatus for obtaining reflow oven settings for soldering a PCB

Also Published As

Publication number Publication date
EP0721102A3 (de) 1998-01-14
EP0721102B1 (de) 2000-03-15
JPH08185952A (ja) 1996-07-16
DE69515627T2 (de) 2000-11-23
US5757955A (en) 1998-05-26
EP0721102A2 (de) 1996-07-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee