DE69515627D1 - Verfahren zur Prüfung von Drahtverbindungen - Google Patents
Verfahren zur Prüfung von DrahtverbindungenInfo
- Publication number
- DE69515627D1 DE69515627D1 DE69515627T DE69515627T DE69515627D1 DE 69515627 D1 DE69515627 D1 DE 69515627D1 DE 69515627 T DE69515627 T DE 69515627T DE 69515627 T DE69515627 T DE 69515627T DE 69515627 D1 DE69515627 D1 DE 69515627D1
- Authority
- DE
- Germany
- Prior art keywords
- procedure
- wire connections
- testing wire
- testing
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7000266A JPH08185952A (ja) | 1995-01-05 | 1995-01-05 | 電線の接続状態検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69515627D1 true DE69515627D1 (de) | 2000-04-20 |
DE69515627T2 DE69515627T2 (de) | 2000-11-23 |
Family
ID=11469116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69515627T Expired - Fee Related DE69515627T2 (de) | 1995-01-05 | 1995-12-13 | Verfahren zur Prüfung von Drahtverbindungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US5757955A (de) |
EP (1) | EP0721102B1 (de) |
JP (1) | JPH08185952A (de) |
DE (1) | DE69515627T2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3639516B2 (ja) * | 2000-09-28 | 2005-04-20 | 矢崎総業株式会社 | 端子金具の検査装置 |
JP5800590B2 (ja) * | 2011-06-17 | 2015-10-28 | 矢崎総業株式会社 | 電線接続端子および当該電線接続端子を備えたワイヤハーネス |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1603880A (en) * | 1978-05-09 | 1981-12-02 | Raychem Pontoise Sa | Electrical connections |
US4271330A (en) * | 1978-05-23 | 1981-06-02 | Raychem Pontoise S.A. | Heat-recoverable articles |
US4547897A (en) * | 1983-02-01 | 1985-10-15 | Honeywell Inc. | Image processing for part inspection |
JPS6052728A (ja) * | 1983-08-31 | 1985-03-26 | Matsushita Electric Works Ltd | はんだ付不良検出方法 |
US4832248A (en) * | 1986-11-20 | 1989-05-23 | Raychem Corporation | Adhesive and solder connection device |
JPH07104947B2 (ja) * | 1988-11-30 | 1995-11-13 | 東芝機械株式会社 | 二次元配列物体の検査装置 |
WO1990007202A1 (en) * | 1988-12-21 | 1990-06-28 | Raychem Corporation | Heat-recoverable soldering device |
US5157463A (en) * | 1991-02-15 | 1992-10-20 | Texas Instruments Incorporated | Method for determining solder quality |
US5318173A (en) * | 1992-05-29 | 1994-06-07 | Simco/Ramic Corporation | Hole sorting system and method |
US5335293A (en) * | 1992-06-16 | 1994-08-02 | Key Technology, Inc. | Product inspection method and apparatus |
DE69331433T2 (de) * | 1992-10-22 | 2002-10-02 | Advanced Interconnection Tech | Einrichtung zur automatischen optischen Prüfung von Leiterplatten mit darin verlegten Drähten |
JP3119743B2 (ja) * | 1992-11-19 | 2000-12-25 | 松下電器産業株式会社 | 実装検査装置 |
US5439160A (en) * | 1993-03-31 | 1995-08-08 | Siemens Corporate Research, Inc. | Method and apparatus for obtaining reflow oven settings for soldering a PCB |
-
1995
- 1995-01-05 JP JP7000266A patent/JPH08185952A/ja active Pending
- 1995-12-13 EP EP95119633A patent/EP0721102B1/de not_active Expired - Lifetime
- 1995-12-13 DE DE69515627T patent/DE69515627T2/de not_active Expired - Fee Related
- 1995-12-22 US US08/576,960 patent/US5757955A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0721102A3 (de) | 1998-01-14 |
EP0721102B1 (de) | 2000-03-15 |
JPH08185952A (ja) | 1996-07-16 |
DE69515627T2 (de) | 2000-11-23 |
US5757955A (en) | 1998-05-26 |
EP0721102A2 (de) | 1996-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |