DE69515108T2 - Dickfilm-Leiterzusammensetzungen mit verbesserter Haftung - Google Patents

Dickfilm-Leiterzusammensetzungen mit verbesserter Haftung

Info

Publication number
DE69515108T2
DE69515108T2 DE69515108T DE69515108T DE69515108T2 DE 69515108 T2 DE69515108 T2 DE 69515108T2 DE 69515108 T DE69515108 T DE 69515108T DE 69515108 T DE69515108 T DE 69515108T DE 69515108 T2 DE69515108 T2 DE 69515108T2
Authority
DE
Germany
Prior art keywords
composition
adhesion
oxide
anorthite
inorganic binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69515108T
Other languages
German (de)
English (en)
Other versions
DE69515108D1 (de
Inventor
Marc Henry Labranche
Bradley J. Schickling
Barry Edward Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69515108D1 publication Critical patent/DE69515108D1/de
Publication of DE69515108T2 publication Critical patent/DE69515108T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01961—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Wood Science & Technology (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69515108T 1994-12-06 1995-12-04 Dickfilm-Leiterzusammensetzungen mit verbesserter Haftung Expired - Lifetime DE69515108T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/350,361 US5518663A (en) 1994-12-06 1994-12-06 Thick film conductor compositions with improved adhesion

Publications (2)

Publication Number Publication Date
DE69515108D1 DE69515108D1 (de) 2000-03-23
DE69515108T2 true DE69515108T2 (de) 2000-09-28

Family

ID=23376385

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69515108T Expired - Lifetime DE69515108T2 (de) 1994-12-06 1995-12-04 Dickfilm-Leiterzusammensetzungen mit verbesserter Haftung

Country Status (7)

Country Link
US (1) US5518663A (https=)
EP (1) EP0716430B1 (https=)
JP (1) JPH08245239A (https=)
KR (1) KR0168636B1 (https=)
CN (1) CN1090369C (https=)
DE (1) DE69515108T2 (https=)
TW (1) TW323371B (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3120703B2 (ja) * 1995-08-07 2000-12-25 株式会社村田製作所 導電性ペースト及び積層セラミック電子部品
JP3209089B2 (ja) * 1996-05-09 2001-09-17 昭栄化学工業株式会社 導電性ペースト
US5928569A (en) * 1997-02-26 1999-07-27 Specialty Silicone Products, Inc. Substantially uniform moldable blends of silver particulate and organopolysiloxane
US7157023B2 (en) * 2001-04-09 2007-01-02 E. I. Du Pont De Nemours And Company Conductor compositions and the use thereof
GB0108886D0 (en) * 2001-04-09 2001-05-30 Du Pont Conductor composition II
US20040104262A1 (en) * 2001-04-09 2004-06-03 Mears Sarah Jane Use of conductor compositions in electronic circuits
JP4428609B2 (ja) * 2001-09-17 2010-03-10 シチズン電子株式会社 タッチパネル
EP1480233A4 (en) * 2002-02-28 2009-01-14 Kojima Chemicals Co Ltd RESISTANCE
GB0307547D0 (en) * 2003-04-01 2003-05-07 Du Pont Conductor composition V
WO2006044109A1 (en) * 2004-09-24 2006-04-27 E.I. Dupont De Nemours And Company Sealing compositions
US7294390B2 (en) * 2005-04-21 2007-11-13 Delphi Technologies, Inc. Method for improving the thermal cycled adhesion of thick-film conductors on dielectric
US7326367B2 (en) 2005-04-25 2008-02-05 E.I. Du Pont De Nemours And Company Thick film conductor paste compositions for LTCC tape in microwave applications
US7611645B2 (en) 2005-04-25 2009-11-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions and the use thereof in LTCC circuits and devices
DE112006002464T5 (de) * 2005-09-14 2008-07-24 Littelfuse, Inc., Des Plaines Gasgefüllter Überspannungsableiter, aktivierende Verbindung, Zündstreifen und Herstellungsverfahren dafür
CN101438511A (zh) 2006-03-24 2009-05-20 交互数字技术公司 用于保持上行链路同步并且降低电池功耗的方法和设备
US20120312369A1 (en) * 2011-06-13 2012-12-13 E I Du Pont De Nemours And Company Thick film paste containing bismuth-based oxide and its use in the manufacture of semiconductor devices
US9783874B2 (en) * 2011-06-30 2017-10-10 E I Du Pont De Nemours And Company Thick film paste and use thereof
WO2015142664A1 (en) 2014-03-20 2015-09-24 Interdigital Patent Holdings, Inc. Method and apparatus for non-orthogonal access in lte systems
JP2019534615A (ja) 2016-09-28 2019-11-28 アイディーエーシー ホールディングス インコーポレイテッド ビームフォーミングシステムにおけるＮｅｗ Ｒａｄｉｏランダムアクセス
US10115505B2 (en) 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
JP7338634B2 (ja) * 2018-10-31 2023-09-05 昭栄化学工業株式会社 Ｎｉペーストおよび積層セラミックコンデンサ
CN113793715B (zh) * 2021-11-16 2022-02-25 西安宏星电子浆料科技股份有限公司 一种低温度系数电阻浆料
CN114678157B (zh) * 2022-05-30 2022-08-12 西安宏星电子浆料科技股份有限公司 一种片式电阻浆料、电阻及制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583931A (en) * 1969-11-26 1971-06-08 Du Pont Oxides of cubic crystal structure containing bismuth and at least one of ruthenium and iridium
US4302362A (en) * 1979-01-23 1981-11-24 E. I. Du Pont De Nemours And Company Stable pyrochlore resistor compositions
US4420422A (en) * 1982-11-01 1983-12-13 E. I. Du Pont De Nemours & Co. Method for making high surface area bismuth-containing pyrochlores
US4598037A (en) * 1984-12-21 1986-07-01 E. I. Du Pont De Nemours And Company Photosensitive conductive metal composition
US4636332A (en) * 1985-11-01 1987-01-13 E. I. Du Pont De Nemours And Company Thick film conductor composition
US4959330A (en) * 1989-06-20 1990-09-25 E. I. Du Pont De Nemours And Company Crystallizable glass and thick film compositions thereof
US5294908A (en) * 1989-11-08 1994-03-15 Matsushita Electric Industrial Co., Ltd. Zinc oxide varistor, a method of preparing the same, and a crystallized glass composition for coating
DE4127845C1 (https=) * 1991-08-22 1992-11-19 W.C. Heraeus Gmbh, 6450 Hanau, De
JPH05128908A (ja) * 1991-11-07 1993-05-25 Sumitomo Metal Mining Co Ltd 導体ペースト
JPH05174617A (ja) * 1991-12-20 1993-07-13 Sumitomo Metal Mining Co Ltd 導体ペースト
US5344592A (en) * 1993-02-16 1994-09-06 E. I. Du Pont De Nemours And Company Organic vehicle for electronic composition

Also Published As

Publication number Publication date
CN1129340A (zh) 1996-08-21
JPH08245239A (ja) 1996-09-24
KR960025816A (ko) 1996-07-20
CN1090369C (zh) 2002-09-04
KR0168636B1 (ko) 1999-01-15
TW323371B (https=) 1997-12-21
US5518663A (en) 1996-05-21
EP0716430A1 (en) 1996-06-12
EP0716430B1 (en) 2000-02-16
DE69515108D1 (de) 2000-03-23

Similar Documents

Publication Publication Date Title
DE69515108T2 (de) Dickfilm-Leiterzusammensetzungen mit verbesserter Haftung
DE3650210T2 (de) Leitfähige Dickschichtzusammensetzung.
DE69204571T2 (de) Verfahren zur Herstellung von elektronischen Mehrschichtschaltungen.
DE69132237T2 (de) Paste zum hochtemperaturbrennen
DE69216634T2 (de) Additivzusammensetzungen für hohe thermozyklen- und alterungsbeständige adhäsion.
DE3111808C2 (de) Elektrisch leitende Paste, ihr Herstellungsverfahren und ihre Verwendung
DE2655085C2 (https=)
DE2810427C3 (de) Silbermassen für aufgedruckte Leitermuster
JPS5851503A (ja) 導体組成物
WO2014170050A1 (de) Sinterpaste mit gecoateten silberoxid auf schwer sinterbare edlen und unedlen oberflächen
DE102013009241B4 (de) Kupferpastenzusammensetzung und ihre Verwendung in einem Verfahren zum Bilden von Kupferleitern auf Substraten
DE19902125A1 (de) Isolierpastenzusammensetzung und Leiterfähigkeitspastenzusammensetzung und Leiterplatte, welche selbige verwendet
US4318830A (en) Thick film conductors having improved aged adhesion
DE2333318C3 (de) Metallisierungsmasse
EP2799164A1 (de) Verbesserte Sinterpaste mit teilweise oxidierten Metallpartikeln
DE2610303C2 (de) Siebdruckpaste für dicke, elektrisch leitende, Leiterbahnen bildende Schichten auf einem keramischen Substrat
DE69904889T2 (de) Elektrisch leitende Paste und Glassubstrat mit aufgetragenem elektrischen Schaltkreis
EP0327816B1 (de) Nicht-oxidierende Kupfer-Dickfilmleiter
DE10319106A1 (de) Elektrisch leitfähige Paste und Verfahren zum Bilden eines Elektrodenmusters
DE1011348B (de) Verglasbares Flussmittel sowie keramischer Gegenstand
DE1496644C2 (de) Silberhaltige Überzugsmasse
DE60212950T2 (de) Verwendung von leiterzusammensetzungen in elektronischen schaltungen
DE60213628T2 (de) Dickfilm-leiterzusammensetzungen zur verwendung auf alumniumnitridsubstraten
DE68910045T2 (de) Oxid-Gläser mit niedrigen Glas-Transformationstemperaturen.
DE60013868T2 (de) Leitfähige zusammensetzung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition