DE69508911T2 - Gehäuse mit elektromagnetischer Abschirmung - Google Patents

Gehäuse mit elektromagnetischer Abschirmung

Info

Publication number
DE69508911T2
DE69508911T2 DE69508911T DE69508911T DE69508911T2 DE 69508911 T2 DE69508911 T2 DE 69508911T2 DE 69508911 T DE69508911 T DE 69508911T DE 69508911 T DE69508911 T DE 69508911T DE 69508911 T2 DE69508911 T2 DE 69508911T2
Authority
DE
Germany
Prior art keywords
housing
electromagnetic shielding
shielding
electromagnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69508911T
Other languages
English (en)
Other versions
DE69508911D1 (de
Inventor
Noboru Koike
Yutaka Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Mobile Communications Ltd
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29252794A external-priority patent/JP3288875B2/ja
Priority claimed from JP18760095A external-priority patent/JP3283161B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69508911D1 publication Critical patent/DE69508911D1/de
Publication of DE69508911T2 publication Critical patent/DE69508911T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H04B1/3833—Hand-held transceivers
DE69508911T 1994-11-28 1995-11-27 Gehäuse mit elektromagnetischer Abschirmung Expired - Lifetime DE69508911T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29252794A JP3288875B2 (ja) 1994-11-28 1994-11-28 シールドケースの取付構造
JP18760095A JP3283161B2 (ja) 1995-07-25 1995-07-25 シールドケース及び電子機器

Publications (2)

Publication Number Publication Date
DE69508911D1 DE69508911D1 (de) 1999-05-12
DE69508911T2 true DE69508911T2 (de) 1999-10-07

Family

ID=26504460

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69508911T Expired - Lifetime DE69508911T2 (de) 1994-11-28 1995-11-27 Gehäuse mit elektromagnetischer Abschirmung

Country Status (4)

Country Link
US (1) US6031732A (de)
EP (1) EP0727932B1 (de)
CN (1) CN1055605C (de)
DE (1) DE69508911T2 (de)

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US7375973B2 (en) * 2000-12-29 2008-05-20 Vertu Limited Casing for a communication device
US20040077391A1 (en) * 2000-12-29 2004-04-22 Frank Nuovo Casing for a mobile telephone
US7693557B2 (en) * 2000-12-29 2010-04-06 Nokia Corporation Method of producing a telephone device
US7830671B2 (en) * 2000-12-29 2010-11-09 Vertu Limited Casing
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JP4601879B2 (ja) * 2001-09-14 2010-12-22 パナソニック株式会社 携帯電子機器及びｂｇａパッケージ保護装置
US7136681B2 (en) 2001-10-31 2006-11-14 Telefonaktiebolaget Lm Ericsson (Publ) Electrically conductive carrier and patterning for controlling current distribution in a wireless communications device
JP3758044B2 (ja) * 2002-10-04 2006-03-22 ヤマハ株式会社 電子機器
JP3748253B2 (ja) * 2002-11-14 2006-02-22 三菱電機株式会社 車載電子機器の筐体構造
KR100514953B1 (ko) * 2003-03-05 2005-09-14 주식회사 피앤아이 전자기기용 플라스틱 하우징 제조방법
JP4207828B2 (ja) * 2003-05-30 2009-01-14 日本ビクター株式会社 電子部品
JP4070689B2 (ja) * 2003-08-20 2008-04-02 シャープ株式会社 無線通信ユニット
US20050073822A1 (en) * 2003-10-07 2005-04-07 Ya-Wen Hsu Electromagnetic interference shielding assembly
JP4299152B2 (ja) * 2004-01-08 2009-07-22 日本碍子株式会社 電磁波シールドケースおよびその製造方法
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
TWI266597B (en) * 2005-09-27 2006-11-11 Delta Electronics Inc Electronic apparatus capable of dissipating heat uniformly
CN1972587B (zh) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 电子装置的屏蔽构件及壳体组件
TWI277386B (en) * 2006-03-31 2007-03-21 Asustek Comp Inc Electromagnetic shielding device
JP3128387U (ja) * 2006-10-25 2007-01-11 船井電機株式会社 電気機器の電源回路部構造
CN101346029B (zh) * 2007-07-13 2011-12-21 深圳富泰宏精密工业有限公司 滑盖式便携式电子装置的接地装置
US7668024B2 (en) * 2007-10-30 2010-02-23 International Business Machines Corporation Hybrid static and dynamic sensing for memory arrays
US8059416B2 (en) * 2008-03-31 2011-11-15 Universal Scientific Industrial (Shanghai) Co., Ltd. Multi-cavity electromagnetic shielding device
US8462519B2 (en) * 2010-05-17 2013-06-11 ETL Systems Ltd. Method of shielding a circuit board, circuit board, electromagnetic shield and method of manufacturing same
TW201225752A (en) * 2010-12-10 2012-06-16 Askey Computer Corp Printed circuit board grounding structure for use with communication apparatus
US8915434B2 (en) * 2011-05-03 2014-12-23 Ncr Corporation Fraud prevention
JP6181630B2 (ja) * 2014-11-14 2017-08-16 トヨタ自動車株式会社 電磁波シールドハウジングの製造方法
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
US9665128B2 (en) * 2015-05-06 2017-05-30 Motorola Mobility Llc Portable electronic device component shielding
DE102016211018A1 (de) * 2016-06-21 2017-12-21 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Behälters
FR3062530B1 (fr) * 2017-02-02 2020-11-13 Valeo Vision Dispositif de pilotage de l'alimentation electrique pour une source lumineuse a semi-conducteur
CN112423573B (zh) * 2019-08-20 2022-12-06 上海海拉电子有限公司 一种电磁防护装置
US11641718B2 (en) * 2021-09-01 2023-05-02 Harman International Industries, Incorporated Electromagnetic compatibility contact between metal castings and printed circuit boards

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US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
JP2825670B2 (ja) * 1990-12-14 1998-11-18 富士通株式会社 高周波回路装置のシールド構造
US5206796A (en) * 1991-03-11 1993-04-27 John Fluke Mfg. Co. Inc. Electronic instrument with emi/esd shielding system
KR100260347B1 (ko) * 1992-06-05 2000-07-01 나까니시 히로유끼 입체인쇄기판, 이것을 사용한 전자회로패키지 및 인쇄기판의 제조방법
JPH0745982A (ja) * 1993-07-28 1995-02-14 Toshiba Corp シールドケースとプリント配線板との接続構造
CN2179668Y (zh) * 1993-12-23 1994-10-12 黄显立 无线电话电磁辐射防护罩
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Also Published As

Publication number Publication date
EP0727932A3 (de) 1997-05-14
CN1055605C (zh) 2000-08-16
CN1135707A (zh) 1996-11-13
EP0727932A2 (de) 1996-08-21
US6031732A (en) 2000-02-29
EP0727932B1 (de) 1999-04-07
DE69508911D1 (de) 1999-05-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KABUSHIKI KAISHA TOSHIBA, TOKIO/TOKYO, JP

8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU TOSHIBA MOBILE COMMUNICATIONS LTD., KA, JP

8328 Change in the person/name/address of the agent

Representative=s name: FRITZ & BRANDENBURG PATENTANWAELTE, 50933 KOELN