DE69503096T2 - Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte - Google Patents
Einrichtung zum Montieren von elektrischen Teilen auf einer LeiterplatteInfo
- Publication number
- DE69503096T2 DE69503096T2 DE69503096T DE69503096T DE69503096T2 DE 69503096 T2 DE69503096 T2 DE 69503096T2 DE 69503096 T DE69503096 T DE 69503096T DE 69503096 T DE69503096 T DE 69503096T DE 69503096 T2 DE69503096 T2 DE 69503096T2
- Authority
- DE
- Germany
- Prior art keywords
- electrical
- base plate
- alignment
- circuit board
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VOPWNXZWBYDODV-UHFFFAOYSA-N Chlorodifluoromethane Chemical compound FC(F)Cl VOPWNXZWBYDODV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000013056 hazardous product Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/245,497 US5504988A (en) | 1994-05-17 | 1994-05-17 | Apparatus for mounting surface mount devices to a circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69503096D1 DE69503096D1 (de) | 1998-07-30 |
| DE69503096T2 true DE69503096T2 (de) | 1998-12-17 |
Family
ID=22926909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69503096T Expired - Fee Related DE69503096T2 (de) | 1994-05-17 | 1995-05-15 | Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5504988A (enExample) |
| EP (1) | EP0685990B1 (enExample) |
| JP (1) | JPH0856100A (enExample) |
| CA (1) | CA2149497A1 (enExample) |
| DE (1) | DE69503096T2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5959840A (en) * | 1994-05-17 | 1999-09-28 | Tandem Computers Incorporated | Apparatus for cooling multiple printed circuit board mounted electrical components |
| US5761795A (en) * | 1994-10-05 | 1998-06-09 | Enplas Corporation | Pressing apparatus for connecting terminals of flexible circuit board |
| JP3339230B2 (ja) * | 1995-01-17 | 2002-10-28 | 松下電器産業株式会社 | プリント基板の支持装置および方法および実装装置 |
| US5802707A (en) * | 1996-03-28 | 1998-09-08 | Intel Corporation | Controlled bondline thickness attachment mechanism |
| KR100231152B1 (ko) * | 1996-11-26 | 1999-11-15 | 윤종용 | 인쇄회로기판 상에 집적회로를 실장하기 위한실장방법 |
| US6251219B1 (en) | 1998-09-17 | 2001-06-26 | Intermedics Inc. | Method and apparatus for use in assembling electronic devices |
| US6505665B1 (en) | 1998-09-17 | 2003-01-14 | Intermedics, Inc. | Method and apparatus for use in assembling electronic devices |
| DE10117797C2 (de) * | 2001-04-10 | 2003-04-17 | Bosch Gmbh Robert | Montagevorrichtung und Verfahren zum Aufbau eines elektronischen Bauteils |
| CN1209002C (zh) * | 2001-10-12 | 2005-06-29 | 矽峰光电科技股份有限公司 | 影像感测器的对位装置 |
| WO2013013192A2 (en) * | 2011-07-20 | 2013-01-24 | Visa International Service Association | Cryptographic expansion device and related protocols |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3874768A (en) * | 1974-03-11 | 1975-04-01 | John M Cutchaw | Integrated circuit connector |
| US4468074A (en) * | 1978-05-22 | 1984-08-28 | Rogers Corporation | Solderless connection technique and apparatus |
| US4528747A (en) * | 1982-12-02 | 1985-07-16 | At&T Technologies, Inc. | Method and apparatus for mounting multilead components on a circuit board |
| US4893403A (en) * | 1988-04-15 | 1990-01-16 | Hewlett-Packard Company | Chip alignment method |
| JPH0638353B2 (ja) * | 1988-07-18 | 1994-05-18 | ヒロセ電機株式会社 | 電子部品用ソケット |
| US4933808A (en) * | 1989-05-11 | 1990-06-12 | Westinghouse Electric Corp. | Solderless printed wiring board module and multi-module assembly |
| US5142444A (en) * | 1989-08-31 | 1992-08-25 | Hewlett-Packard Company | Demountable tape-automated bonding system |
| US5006962A (en) * | 1989-12-28 | 1991-04-09 | Intel Corporation | Apparatus for surface mounting an integrated circuit package |
| US5088930A (en) * | 1990-11-20 | 1992-02-18 | Advanced Interconnections Corporation | Integrated circuit socket with reed-shaped leads |
| JP3013480B2 (ja) * | 1991-03-12 | 2000-02-28 | 安藤電気株式会社 | Ｉｃソケットのｉｃコンタクト機構 |
| US5175410A (en) * | 1991-06-28 | 1992-12-29 | Digital Equipment Corporation | IC package hold-down fixture |
| US5332463A (en) * | 1992-01-15 | 1994-07-26 | Cray Research, Inc. | Self-aligned sealing fixture for use in assembly of microelectronic packages |
-
1994
- 1994-05-17 US US08/245,497 patent/US5504988A/en not_active Expired - Fee Related
-
1995
- 1995-05-15 EP EP95303243A patent/EP0685990B1/en not_active Expired - Lifetime
- 1995-05-15 DE DE69503096T patent/DE69503096T2/de not_active Expired - Fee Related
- 1995-05-16 CA CA002149497A patent/CA2149497A1/en not_active Abandoned
- 1995-05-17 JP JP7118282A patent/JPH0856100A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US5504988A (en) | 1996-04-09 |
| CA2149497A1 (en) | 1995-11-18 |
| EP0685990A3 (enExample) | 1995-12-27 |
| EP0685990A2 (en) | 1995-12-06 |
| JPH0856100A (ja) | 1996-02-27 |
| EP0685990B1 (en) | 1998-06-24 |
| DE69503096D1 (de) | 1998-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |