DE69430935T2 - Thixotrope Leiterpaste - Google Patents

Thixotrope Leiterpaste

Info

Publication number
DE69430935T2
DE69430935T2 DE69430935T DE69430935T DE69430935T2 DE 69430935 T2 DE69430935 T2 DE 69430935T2 DE 69430935 T DE69430935 T DE 69430935T DE 69430935 T DE69430935 T DE 69430935T DE 69430935 T2 DE69430935 T2 DE 69430935T2
Authority
DE
Germany
Prior art keywords
thixotropic
conductor paste
paste
conductor
thixotropic conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69430935T
Other languages
English (en)
Other versions
DE69430935D1 (de
Inventor
Minehiro Itagaki
Yoshihiro Bessho
Satoru Yuhaku
Yasuhiko Hakotani
Kazuhiro Miura
Kazuyuki Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69430935D1 publication Critical patent/DE69430935D1/de
Publication of DE69430935T2 publication Critical patent/DE69430935T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69430935T 1993-05-10 1994-05-10 Thixotrope Leiterpaste Expired - Fee Related DE69430935T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5108492A JP3015621B2 (ja) 1993-05-10 1993-05-10 導体ペ−スト組成物

Publications (2)

Publication Number Publication Date
DE69430935D1 DE69430935D1 (de) 2002-08-14
DE69430935T2 true DE69430935T2 (de) 2003-01-30

Family

ID=14486152

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69430935T Expired - Fee Related DE69430935T2 (de) 1993-05-10 1994-05-10 Thixotrope Leiterpaste

Country Status (5)

Country Link
US (2) US5503777A (de)
EP (1) EP0624902B1 (de)
JP (1) JP3015621B2 (de)
KR (1) KR0157238B1 (de)
DE (1) DE69430935T2 (de)

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KR100268699B1 (ko) * 1996-06-25 2000-11-01 이.아이,듀우판드네모아앤드캄파니 칩저항기터미날전극용전도성페이스트조성물
US5783113A (en) * 1997-03-27 1998-07-21 International Business Machines Corporation Conductive paste for large greensheet screening including high thixotropic agent content
US6488869B2 (en) * 1997-04-08 2002-12-03 Matsushita Electric Industrial Co., Ltd. Conductive paste, its manufacturing method, and printed wiring board using the same
US6071437A (en) * 1998-02-26 2000-06-06 Murata Manufacturing Co., Ltd. Electrically conductive composition for a solar cell
JP3539195B2 (ja) * 1998-03-25 2004-07-07 株式会社村田製作所 導電ペーストおよびそれを用いたセラミック基板の製造方法
US6329059B1 (en) * 1999-11-12 2001-12-11 Amsil Ltd. Polymeric composition having self-extinguishing properties
JP2001189234A (ja) * 1999-12-28 2001-07-10 Tdk Corp 積層コンデンサ
KR100348498B1 (ko) * 2000-07-13 2002-08-09 명지대학교 전자파차폐용 코팅재의 제조방법
JP2002042551A (ja) * 2000-07-21 2002-02-08 Murata Mfg Co Ltd スクリーン印刷用ペースト、スクリーン印刷方法及び厚膜焼成体
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
CA2451636A1 (en) * 2001-06-28 2003-01-09 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
US6661566B2 (en) 2001-09-20 2003-12-09 The United States Of America As Represented By The Secretary Of The Navy Method and optical switch for altering an electromagnetic energy wave in response to acceleration forces
US6459055B1 (en) 2001-09-25 2002-10-01 The United States Of America As Represented By The Secretary Of The Navy Acceleration responsive switch
TWI251018B (en) * 2002-04-10 2006-03-11 Fujikura Ltd Electroconductive composition, electroconductive coating and method of producing the electroconductive coating
US7387827B2 (en) * 2002-12-17 2008-06-17 Intel Corporation Interconnection designs and materials having improved strength and fatigue life
US7521115B2 (en) * 2002-12-17 2009-04-21 Intel Corporation Low temperature bumping process
EP1443532A1 (de) * 2003-01-24 2004-08-04 E.I.Du pont de nemours and company Elektrodenanschlusszusammensetzungen für keramische Mehrschichtkondensatoren
US7147804B2 (en) * 2003-01-24 2006-12-12 E. I. Du Pont De Nemours And Company Terminal electrode compositions for multilayer ceramic capacitors
US7083744B2 (en) * 2003-01-24 2006-08-01 E. I. Du Pont De Nemours And Company Terminal electrode compositions for multilayer ceramic capacitors
US7074349B2 (en) * 2003-01-24 2006-07-11 E. I. Du Pont De Nemours And Company Terminal electrode compositions for multilayer ceramic capacitors
US7279217B2 (en) * 2004-05-24 2007-10-09 Tdk Corporation Multilayer ceramic device, method for manufacturing the same, and ceramic device
JP4518885B2 (ja) * 2004-09-09 2010-08-04 京セラ株式会社 セラミック電子部品及びその製造方法
GB0515088D0 (en) * 2005-07-22 2005-08-31 Imerys Minerals Ltd Particulate glass compositions and methods of production
US20080233416A1 (en) * 2007-01-26 2008-09-25 Kyocera Corporation Paste composition, green ceramic body, and methods for manufacturing ceramic structure
TWI493605B (zh) * 2008-06-11 2015-07-21 Ind Tech Res Inst 背面電極層的製造方法
JP5753534B2 (ja) * 2009-06-01 2015-07-22 住友化学株式会社 電子デバイス用の改良電極のための組成物
CN103443928B (zh) * 2010-10-28 2016-09-21 赫劳斯贵金属北美康舍霍肯有限责任公司 含有金属添加剂的太阳能电池金属化
WO2014150302A1 (en) * 2013-03-14 2014-09-25 Dow Corning Corporation Conductive silicone materials and uses
US9447308B2 (en) * 2013-03-14 2016-09-20 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056684A (en) * 1959-06-04 1962-10-02 Carboline Co Protective coatings
US3776741A (en) * 1970-12-28 1973-12-04 Corning Glass Works Flame-proof protective coating for electrical film resistors
US3819439A (en) * 1971-05-17 1974-06-25 Hexcel Corp Method of making honeycomb of sinterable material employing stepwise coating of a resin-containing composition
GB1412341A (en) * 1973-01-29 1975-11-05 Atomic Energy Authority Uk Metallising pastes
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
US4122143A (en) * 1976-05-24 1978-10-24 Mitsui Toatsu Chemicals, Inc. Process for producing cured products
US4417007A (en) * 1981-06-30 1983-11-22 Elkem Metals Company Zinc rich paint formulations employing manganomanganic oxide fume pigment
JPS6286602A (ja) * 1985-10-09 1987-04-21 昭栄化学工業株式会社 厚膜ペ−スト
CA1273853A (en) * 1986-12-17 1990-09-11 Hitoshi Suzuki Method for production of ceramic circuit board
DE68912932T2 (de) * 1989-05-12 1994-08-11 Ibm Deutschland Glas-Keramik-Gegenstand und Verfahren zu dessen Herstellung.
US5135829A (en) * 1989-10-23 1992-08-04 Ricoh Company, Ltd. Electrophotographic photoconductor having intermediate layer comprising modified indium oxide
JP2795712B2 (ja) * 1990-02-02 1998-09-10 イビデン株式会社 スルーホールを有するセラミックス基板の製造方法
US5137560A (en) * 1990-03-09 1992-08-11 Asahi Glass Company, Inc. Process for manufacturing glass with functional coating
JP2839326B2 (ja) * 1990-03-28 1998-12-16 京セラ株式会社 磁器電子部品
US5186743A (en) * 1990-12-13 1993-02-16 Akzo N.V. Low volatile organic content hybrid silica binder
US5216207A (en) * 1991-02-27 1993-06-01 David Sarnoff Research Center, Inc. Low temperature co-fired multilayer ceramic circuit boards with silver conductors
JPH0520920A (ja) * 1991-06-20 1993-01-29 Matsushita Electric Ind Co Ltd 導電性ペーストおよびこれを用いた実装基板
US5156674A (en) * 1991-06-21 1992-10-20 Mooney Chemicals, Inc. Drier promoter compositions
US5167701A (en) * 1992-05-22 1992-12-01 Savin Roland R Zinc-rich coating composition with inorganic binder
US5338348A (en) * 1993-09-22 1994-08-16 Savin Roland R Zinc powder-rich coating composition

Also Published As

Publication number Publication date
EP0624902A1 (de) 1994-11-17
EP0624902B1 (de) 2002-07-10
US5503777A (en) 1996-04-02
JPH06326433A (ja) 1994-11-25
US5688441A (en) 1997-11-18
DE69430935D1 (de) 2002-08-14
JP3015621B2 (ja) 2000-03-06
KR0157238B1 (ko) 1998-11-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee