DE69428617T2 - Elektromagnetische Justiervorrichtung - Google Patents

Elektromagnetische Justiervorrichtung

Info

Publication number
DE69428617T2
DE69428617T2 DE69428617T DE69428617T DE69428617T2 DE 69428617 T2 DE69428617 T2 DE 69428617T2 DE 69428617 T DE69428617 T DE 69428617T DE 69428617 T DE69428617 T DE 69428617T DE 69428617 T2 DE69428617 T2 DE 69428617T2
Authority
DE
Germany
Prior art keywords
adjustment device
electromagnetic adjustment
electromagnetic
adjustment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69428617T
Other languages
English (en)
Other versions
DE69428617D1 (de
Inventor
Daniel N Galburt
Geoffrey O'connor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SVG Lithography Systems Inc
Original Assignee
SVG Lithography Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SVG Lithography Systems Inc filed Critical SVG Lithography Systems Inc
Publication of DE69428617D1 publication Critical patent/DE69428617D1/de
Application granted granted Critical
Publication of DE69428617T2 publication Critical patent/DE69428617T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1615—Programme controls characterised by special kind of manipulator, e.g. planar, scara, gantry, cantilever, space, closed chain, passive/active joints and tendon driven manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Health & Medical Sciences (AREA)
  • Robotics (AREA)
  • Orthopedic Medicine & Surgery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Units (AREA)
DE69428617T 1993-02-09 1994-01-24 Elektromagnetische Justiervorrichtung Expired - Fee Related DE69428617T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/015,520 US5285142A (en) 1993-02-09 1993-02-09 Wafer stage with reference surface

Publications (2)

Publication Number Publication Date
DE69428617D1 DE69428617D1 (de) 2001-11-22
DE69428617T2 true DE69428617T2 (de) 2002-08-01

Family

ID=21771876

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69428617T Expired - Fee Related DE69428617T2 (de) 1993-02-09 1994-01-24 Elektromagnetische Justiervorrichtung

Country Status (6)

Country Link
US (1) US5285142A (de)
EP (1) EP0611062B1 (de)
JP (1) JP3325077B2 (de)
KR (1) KR100283784B1 (de)
CA (1) CA2114059A1 (de)
DE (1) DE69428617T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110000573A (zh) * 2019-05-08 2019-07-12 盐城盐东速削科技有限公司 一种基于磁悬浮技术的动梁式速削机

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142336A (ja) * 1993-06-30 1995-06-02 Canon Inc 露光装置
US6989647B1 (en) * 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US7365513B1 (en) 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US6246204B1 (en) * 1994-06-27 2001-06-12 Nikon Corporation Electromagnetic alignment and scanning apparatus
JP3800616B2 (ja) * 1994-06-27 2006-07-26 株式会社ニコン 目標物移動装置、位置決め装置及び可動ステージ装置
US5623853A (en) * 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
US6008500A (en) * 1995-04-04 1999-12-28 Nikon Corporation Exposure apparatus having dynamically isolated reaction frame
TW318255B (de) 1995-05-30 1997-10-21 Philips Electronics Nv
US5760564A (en) * 1995-06-27 1998-06-02 Nikon Precision Inc. Dual guide beam stage mechanism with yaw control
US5656942A (en) * 1995-07-21 1997-08-12 Electroglas, Inc. Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane
WO1997021977A1 (en) * 1995-12-11 1997-06-19 Adagio Associates, Inc. Integrated silicon profilometer and afm head
US5861549A (en) * 1996-12-10 1999-01-19 Xros, Inc. Integrated Silicon profilometer and AFM head
US5757160A (en) * 1996-12-23 1998-05-26 Svg Lithography Systems, Inc. Moving interferometer wafer stage
US5789830A (en) * 1997-07-08 1998-08-04 Systems, Machines, Automation Components Corporation In-line rotational drive
US6089525A (en) * 1997-10-07 2000-07-18 Ultratech Stepper, Inc. Six axis active vibration isolation and payload reaction force compensation system
JPH11287880A (ja) 1998-04-01 1999-10-19 Canon Inc ステージ装置、およびこれを用いた露光装置ならびにデバイス製造方法
US6307619B1 (en) 2000-03-23 2001-10-23 Silicon Valley Group, Inc. Scanning framing blade apparatus
US6538720B2 (en) 2001-02-28 2003-03-25 Silicon Valley Group, Inc. Lithographic tool with dual isolation system and method for configuring the same
US6717679B2 (en) * 2001-11-15 2004-04-06 Zygo Corporation Dispersive null-optics for aspheric surface and wavefront metrology
US6734979B2 (en) * 2001-11-15 2004-05-11 Zygo Corporation Rapid in situ mastering of an aspheric Fizeau with residual error compensation
US6784978B2 (en) * 2002-03-12 2004-08-31 Asml Holding N.V. Method, system, and apparatus for management of reaction loads in a lithography system
US6757110B2 (en) * 2002-05-29 2004-06-29 Asml Holding N.V. Catadioptric lithography system and method with reticle stage orthogonal to wafer stage
KR100437263B1 (ko) * 2002-08-02 2004-06-23 한국과학기술원 이중 ｈ구조를 이용한 장행정 6축 운동 스테이지
US20070131879A1 (en) * 2004-02-02 2007-06-14 Nikon Corporation Force provider with adjustable force characteristics for a stage assembly
US20050169784A1 (en) * 2004-02-02 2005-08-04 Poon Alex K.T. Force provider for a mover assembly of a stage assembly
KR100568207B1 (ko) 2004-02-13 2006-04-05 삼성전자주식회사 이송장치
US20050236915A1 (en) * 2004-04-23 2005-10-27 Nikon Corporation Electromagnetic force actuator
US7678458B2 (en) * 2007-01-24 2010-03-16 Asml Holding N.V. Bonding silicon silicon carbide to glass ceramics
CN102809346B (zh) * 2011-05-31 2014-12-17 上海微电子装备有限公司 运动平台的位置测量装置及其测量方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4223257A (en) * 1978-11-15 1980-09-16 Miller Donald K Adaptive servo control system
US4654571A (en) * 1985-09-16 1987-03-31 Hinds Walter E Single plane orthogonally movable drive system
US4742286A (en) * 1985-10-29 1988-05-03 Micro-Stage, Inc. Gas bearing X-Y-θ stage assembly
US4676649A (en) * 1985-11-27 1987-06-30 Compact Spindle Bearing Corp. Multi-axis gas bearing stage assembly
US5040431A (en) * 1988-01-22 1991-08-20 Canon Kabushiki Kaisha Movement guiding mechanism
US4952858A (en) * 1988-05-18 1990-08-28 Galburt Daniel N Microlithographic apparatus
US5168512A (en) * 1990-03-13 1992-12-01 Canon Kabushiki Kaisha Method of manufacture of semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110000573A (zh) * 2019-05-08 2019-07-12 盐城盐东速削科技有限公司 一种基于磁悬浮技术的动梁式速削机

Also Published As

Publication number Publication date
DE69428617D1 (de) 2001-11-22
JP3325077B2 (ja) 2002-09-17
JPH06252034A (ja) 1994-09-09
EP0611062A1 (de) 1994-08-17
US5285142A (en) 1994-02-08
KR940020524A (ko) 1994-09-16
EP0611062B1 (de) 2001-10-17
CA2114059A1 (en) 1994-08-10
KR100283784B1 (ko) 2001-04-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee