DE69400105D1 - Befestigungsteil mit geneigter Spiralfeder für Wärmesenke für ein elektronisches Bauelement - Google Patents

Befestigungsteil mit geneigter Spiralfeder für Wärmesenke für ein elektronisches Bauelement

Info

Publication number
DE69400105D1
DE69400105D1 DE69400105T DE69400105T DE69400105D1 DE 69400105 D1 DE69400105 D1 DE 69400105D1 DE 69400105 T DE69400105 T DE 69400105T DE 69400105 T DE69400105 T DE 69400105T DE 69400105 D1 DE69400105 D1 DE 69400105D1
Authority
DE
Germany
Prior art keywords
electronic component
heat sink
fastening part
spiral spring
inclined spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69400105T
Other languages
English (en)
Other versions
DE69400105T2 (de
Inventor
Paul G Casperson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cummins Inc
Original Assignee
Cummins Engine Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cummins Engine Co Inc filed Critical Cummins Engine Co Inc
Publication of DE69400105D1 publication Critical patent/DE69400105D1/de
Application granted granted Critical
Publication of DE69400105T2 publication Critical patent/DE69400105T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69400105T 1993-05-21 1994-04-16 Befestigungsteil mit geneigter Spiralfeder für Wärmesenke für ein elektronisches Bauelement Expired - Fee Related DE69400105T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/064,643 US5402313A (en) 1993-05-21 1993-05-21 Electronic component heat sink attachment using a canted coil spring

Publications (2)

Publication Number Publication Date
DE69400105D1 true DE69400105D1 (de) 1996-04-25
DE69400105T2 DE69400105T2 (de) 1996-07-25

Family

ID=22057336

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69400105T Expired - Fee Related DE69400105T2 (de) 1993-05-21 1994-04-16 Befestigungsteil mit geneigter Spiralfeder für Wärmesenke für ein elektronisches Bauelement

Country Status (4)

Country Link
US (1) US5402313A (de)
EP (1) EP0625871B1 (de)
JP (1) JPH07118513B2 (de)
DE (1) DE69400105T2 (de)

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US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
US5930116A (en) * 1998-06-12 1999-07-27 Harman International Industries, Incorporated Integrated clamping mechanism
US6055158A (en) * 1999-03-16 2000-04-25 Framatome Connectors Interlock, Inc. Electronic component heat sink assembly
US6154367A (en) * 1999-03-16 2000-11-28 Framatome Connectors Interlock, Inc. Heat sink for printed circuit board
DE19949914B4 (de) * 1999-04-19 2005-09-15 Dietz-Motoren Gmbh & Co. Kg Elektromotoranordnung mit integriertem Steuergerät
DE29915465U1 (de) * 1999-09-03 2001-01-18 Schneider Clauss Gmbh & Co Kg Kühlelement
US7630198B2 (en) * 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US6215663B1 (en) * 2000-03-16 2001-04-10 Philips Electronics North America Corporation Printed circuit board assembly with improved thermal performance
EP1266548B2 (de) * 2000-03-21 2015-07-29 Liebert Corporation Verfahren und gerät zur kühlung von elektronischen geräten
DE10034572A1 (de) * 2000-07-14 2002-01-24 Webasto Thermosysteme Gmbh Heizgerät mit Kühlmittel für Leistungstransistor
US6416330B1 (en) 2000-07-17 2002-07-09 Cray Inc. Canted coil spring conductor electrical circuit connector
DE10213648B4 (de) * 2002-03-27 2011-12-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
EP1453366A1 (de) * 2003-02-28 2004-09-01 Siemens Aktiengesellschaft Elektronisches Gerät mit sicherer Wärmeableitung
DE10326458B4 (de) * 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Kühlanordnung für elektronische Bauelemente
JP2005151617A (ja) * 2003-11-11 2005-06-09 Sumitomo Wiring Syst Ltd 回路構成体及び回路構成体の製造方法
EP2314956A1 (de) 2003-12-05 2011-04-27 Liebert Corporation Kühlsystem für Wärmelasten mit hoher Dichte
US20050207116A1 (en) * 2004-03-22 2005-09-22 Yatskov Alexander I Systems and methods for inter-cooling computer cabinets
US7330350B2 (en) * 2004-06-04 2008-02-12 Cray Inc. Systems and methods for cooling computer modules in computer cabinets
US7304842B2 (en) * 2004-06-14 2007-12-04 Cray Inc. Apparatuses and methods for cooling electronic devices in computer systems
US7120027B2 (en) * 2004-07-08 2006-10-10 Cray Inc. Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
US7177156B2 (en) * 2004-07-08 2007-02-13 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7362571B2 (en) * 2004-09-16 2008-04-22 Cray Inc. Inlet flow conditioners for computer cabinet air conditioning systems
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
EP1810558B1 (de) * 2004-11-14 2013-04-24 Liebert Corporation Integrierte(r) wärmetauscher in einem gestell für computersysteme mit vertikalen platten
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
DE102005015749A1 (de) * 2005-04-06 2006-10-12 Conti Temic Microelectronic Gmbh Kühlvorrichtung für Leiterplatten und Verfahren zur Herstellung derselben
CN2800705Y (zh) * 2005-05-29 2006-07-26 富准精密工业(深圳)有限公司 保护盖及具有该保护盖的散热装置
DE102005035378B3 (de) * 2005-06-25 2006-11-23 Lear Corporation Gmbh & Co. Kg Anordung zum Kühlen von auf einer Leiterplatte angeordneten Bauelementen
US7788940B2 (en) * 2005-08-04 2010-09-07 Liebert Corporation Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation
DE102005039374A1 (de) * 2005-08-19 2007-02-22 BSH Bosch und Siemens Hausgeräte GmbH Gehäuse für Elektronikbaugruppen
US7336491B2 (en) * 2005-09-06 2008-02-26 Lear Corporation Heat sink
GB2430310A (en) * 2005-09-15 2007-03-21 Tyco Electronics A heat dissipation device
US7440282B2 (en) * 2006-05-16 2008-10-21 Delphi Technologies, Inc. Heat sink electronic package having compliant pedestal
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
DE102006039506B3 (de) * 2006-08-23 2008-01-03 Siemens Ag Österreich Kühlanordnung
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) * 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) * 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
JP2010073159A (ja) * 2008-09-22 2010-04-02 Fujitsu Ltd 電子機器
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7903403B2 (en) * 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US7778033B2 (en) * 2008-10-30 2010-08-17 Astec International Limited Thermally conductive covers for electric circuit assemblies
DE202008013766U1 (de) 2008-11-10 2009-01-08 Lear Corporation Gmbh Gehäuse zur Aufnahme mindestens einer mit Bauelementen bestückten Leiterplatte
JP5402200B2 (ja) * 2009-04-20 2014-01-29 株式会社リコー 熱移動機構及び情報機器
CN102065667B (zh) * 2009-11-12 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 电子装置及其散热装置
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US8358506B2 (en) * 2010-08-27 2013-01-22 Direct Grid Technologies, LLC Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations
JP6075880B2 (ja) * 2011-03-17 2017-02-08 日本発條株式会社 押圧ユニット
US8854814B2 (en) * 2011-06-27 2014-10-07 Futurewei Technologies, Inc. Hybrid cooling design for modular systems
CN103369909A (zh) * 2012-03-28 2013-10-23 富准精密工业(深圳)有限公司 电子装置及其散热装置
US9142481B2 (en) * 2012-06-05 2015-09-22 Stats Chippac Ltd. Integrated circuit packaging system with heatsink cap and method of manufacture thereof
US10120423B1 (en) * 2015-09-09 2018-11-06 Amazon Technologies, Inc. Unibody thermal enclosure
JP6274196B2 (ja) * 2015-12-16 2018-02-07 株式会社オートネットワーク技術研究所 電気接続箱
US10462274B2 (en) 2015-12-26 2019-10-29 Intel Corporation Adjustable air gap for mobile devices
CN206472427U (zh) * 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备
JP7024704B2 (ja) * 2018-12-28 2022-02-24 住友電装株式会社 電子モジュール
KR20220092263A (ko) * 2020-12-24 2022-07-01 현대모비스 주식회사 전력부품의 방열 조립 구조

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GB2146423A (en) * 1984-09-07 1985-04-17 Redpoint Limited Heat transfer devices
EP0354022A3 (de) * 1988-08-05 1990-11-22 Minnesota Mining And Manufacturing Company Widerstand reduzierende Ware
US4993482A (en) * 1990-01-09 1991-02-19 Microelectronics And Computer Technology Corporation Coiled spring heat transfer element

Also Published As

Publication number Publication date
EP0625871A1 (de) 1994-11-23
EP0625871B1 (de) 1996-03-20
US5402313A (en) 1995-03-28
JPH07118513B2 (ja) 1995-12-18
JPH0750373A (ja) 1995-02-21
DE69400105T2 (de) 1996-07-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: CUMMINS INC., COLUMBUS, IND., US

8339 Ceased/non-payment of the annual fee