GB2430310A - A heat dissipation device - Google Patents
A heat dissipation device Download PDFInfo
- Publication number
- GB2430310A GB2430310A GB0518791A GB0518791A GB2430310A GB 2430310 A GB2430310 A GB 2430310A GB 0518791 A GB0518791 A GB 0518791A GB 0518791 A GB0518791 A GB 0518791A GB 2430310 A GB2430310 A GB 2430310A
- Authority
- GB
- United Kingdom
- Prior art keywords
- housing
- cover
- heat dissipating
- clamping member
- dissipating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000017525 heat dissipation Effects 0.000 title description 6
- 230000001737 promoting effect Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipating device 10 comprises a hollow housing 12 having an openable side. At least one heat-generating electronic device 14 lies within the housing 12 and at least one moveable clamping member 16 lies substantially within the interior of the housing 12. The device 10 also comprises a cover 18 that is moveable between open and closed positions in which it respectively opens and closes the openable side. Movement of the cover from the open to the closed position causes engagement between the cover 18 and the clamping member 16 so to clamp the electronic device 14 between the clamping member 16 and the housing 12, thereby promoting transfer of heat between the electronic device 14 and the housing 12.
Description
A HEAT DiSSIPATION DEVICE The invention relates to a heal dissipation
device and in particular, but not exclusively, to a device for the dissipation of heat generated by electronic devices.
Some electronic devices generate substantial amounts of heat which would harm neighbouring components or such devices themselves. A heat sink may be attached directly to such a heat-generating electronic device in order to dissipate heat.
US-A-5,930,116 describes a heat sink for an electronic device having a bottom cover hingedly coupled to a hollow housing containing the device. The cover has protrusions which, when the cover is closed, protrude into the interior of the hollow housing to force the heat-generating electronic device against a heat sink surface.
However, the arrangement described in US-A-5,930,l 16 requires considerable space to accommodate movement of the protrusions as the cover pivots between open and closed positions. This is an undesirable waste of space in view of the general desirability of making electronic products as compact as possible.
Therefore, it is a general aim of the invention to provide a compact heat dissipation device. This and other advantages will become apparent from the
following description of the invention.
According to the invention, there is provided a heat dissipating device comprising a hollow housing having an openable side; at least one heatgenerating electronic device lying within the housing: at least one moveable clamping member lying substantially within the interior of the housing, and a cover that is moveable between open and closed positions in which it respectively opens and closes the openable side, movement of the cover from the open to the closed position causing engagement between the cover and the clamping member so as to clamp the electronic device between the clamping member and the housing, thereby promoting transfer o heat between the electronic device and the housing.
The inclusion of a cover that is distinct from and engageable with at least one clamping member affords a more compact heat dissipation device than has hitherto been possible. This is because very little space is required to accommodate movement of the clamping member within the interior of the housing.
Preferably, movement of the cover towards its closed position following the said engagement causes relative movement between the cover and the clamping member.
Conveniently the clamping member is rotatably mounted relative to the housing; and even more preferably, the relative movement between the cover and the clamping member includes causing rotation of the cover so that a part thereof engages a part of the clamping member thereby to cause the clamping member to press against the electronic device.
Optionally the housing is resiliently deformable and includes respective, mutually spaced walls that are moveahie away from one another against the resilience of the housing to permit insertion of the cover therebetween on assembly of the heat dissipating device, and engagement with the cover when the resilience of the housing acts on the cover, it is also preferable that each of the mutually spaced walls includes formed therein a retainer formation for receiving a part of the cover member and thereby constraining the movement of the cover relative to the housing when the resilience of the housing acts thereon.
The fbregoing features advantageously provide a reliable means, of assembling the parts of the device together, that is quick to put into effect without requiring significant expenditure of energy. Thus the preferred embodiments of the invention are particularly well suited to manufacture by industrial processes.
in a preferred embodiment of the invention, the clamping member is substantially L-shaped and includes a pivot member at or near the corner of the L-shape.
Conveniently the pivot member is receivable in a socket defined in the hollow interior of the housing to define a hingeable mounting fbr the clamping member.
In a preferred embodiment of the invention, the clamping member includes an engagement portion for engagement with the cover.
Preferably, the engagement portion defines a crank which protrudes outside the interior of the housing even more preferably, such protrusion is via the operable side of the housing.
The foregoing features provide a mechanism in which the electronic device is clamped between the housing and the clamping device by engagement, between the clamping device and the cover, that occurs outside the interior of the housing.
Thus the arrangement of the invention requires oniy limited movement of the clamping member in order to achieve effective, heat-transferring clamping of the electronic device. Consequently, less of the interior of the housing, than in the prior art arrangement, is needed to accommodate movement of the clamping device, resulting in a more compact device.
Preferably, the or each clamping member includes a resiliently defonnable material for engaging the electronic device.
The resiliently defonnable material prevents the clamping member from damaging the electronic device when, as is preferred, the remainder of the clamping member is made from a rigid material such as a metal.
Also the resiliently deformahie material allows the device of the invention advantageously to accommodate a range of thicknesses or sizes of electronic device, and/or to accommodate multiple electronic devices arranged in layers, while providing satisfactory supporting and gripping performance.
In a preferred embodiment of the invention, the heat dissipating, device includes a heat conducting material positioned between the heatgenerating electronic device and the housing.
The inclusion of the optional, heat conducting material enhances heat transfer between the heat-generating electronic device and the housing.
Desirably, the heal dissipating device includes one or more further components (such as hut not limited to a printed circuit board) mounted within the housing and IC) electrically coupled to the at least one heat-generating electronic device.
Preferably the cover includes a cover plate having two opposed sides protruding from each of which is an engagement tab for engaging the housing, the cover plate being connected to each said tab by a cranked portion whereby, on assembly of the device the engagement tabs each lie at a different level, relative to the housing, than the cover plate.
There now follows a description of a preferred embodiment of the invention, by way of non-limiting example, with reference being made to the accompanying drawings in which: Figure 1 shows the main components of the heat dissipation device of the invention, prior to assembly; Figure 2 shows a first stage of assembly of the device, in which a clamping member is mounted in a housing forming part of the device; Figure 3 shows a second state of assembly, including installation of a cover to close an open side of the housing; Figure 4 shows the assembled device with the cover in a closed position and an electronic device clamped between the housing and the clamping member.
A heat dissipating device according to a preferred embodiment of the invention is designated generally by the reference numeral 10.
The device 10 comprises a hollow housing 12 having an openable side. The housing is preferably made from a rigid material such as a metal. preferably extruded aluminium. Within the housing lies at least one heat generating electronic device 14. (Only one is shown in the figures. although of course within s the scope of the invention a wide range of numbers and types of device may be present). The electronic device 14 is mounted adjacent to a heat sink portion 15 of the housing 12. The heat sink portion 15 has fins for optimal transfer of heat to the atmosphere.
At least one clamping member 16 (of which only one is shown but a greater number is possible within the scope of the invention) lies substantially within the interior of the housing 12. The device 10 also includes a cover i 8 that is moveable between open and closed positions in which it opens and closes the openable side of the housing 12.
Movement of the cover 1 8 from the open to the closed position (see Figures 3 and 4) causes engagement between the cover 18 and the clamping member 1 6 and the housing 12 so as to clamp the electronic device 14 between the clamping member 16 and the housing 12, thereby promoting transfer of heat between the electronic device 14 and the housing 12.
The movement of the cover 18 from the open to the closed position following the said engagement causes relative movement between the cover 1 8 and the clamping member 16. In particular, the relative movement includes causing rotation of the cover so that part of its underside as shown engages a part of the clamping member 1 6. This causes the clamping member to press into clamping, heat-transferring engagement with the electronic component 14.
During this process the clamping member 1 6 moves from a position either spaced from or lightly engaging the electronic device 1 4, to a position comparatively tightly engaging it. Such movement of the clamping member may he imperceptible by eye.
The clamping member 1 6 is substantially L-shaped and includes a pivot member at or near the corner of the L-shape. The clamping member is preferably made from a rigid material such as hut not limited to extruded aluminium.
S The pivot member 20 is receivable in a socket 2 1 defined in the hollow interior of the housing 12 to define a hingeable mounting for the clamping member 16. The pivot member 20 has an arcuate (in practice, partcircular) exterior surface and the socket 21 has a corresponding interior arcuate surface of slightly larger diameter.
An arm of the clamping member includes a flat surface which lies adjacent to the electronic device. As a consequence of the arrangement of the clamping member 1 6 relative to the housing 12 and the electronic device 14 movement of the clamping member 16 is limited.
The arc represented by the cross-section of the interior arcuate surface of the socket extends over more than half the part-circular circumference represented by the exterior of the pivot member 20. This and the relative dimensions of the aforesaid arcuate parts means that insertion of the pivot member 20 into the socket 21 is possible by sliding of the latter longitudinally into the former. Following such sliding the pivot member 20 is retained rotatably captive in the socket 21.
The clamping member 16 includes an engagement portion 22 for engagement with the cover 18. Preferably, the engagement portion 22 defines a crank which protrudes from the interior of the housing 12. In particular, the protrusion is via the openable side of the housing 12.
The clamping member 16 includes a resiliently deformable material 24 for engaging the electronic device 14. The resiliently deformable material 26 may be a rubber material and includes a flat surface adjacent the electronic device 14.
As shown in Figure 3, on assembly of the heat dissipating device an engagement tab I 8a of the cover 18 engages with, or is inserted into, a retainer formation of the housing 12 in the form of a longitudinally extending groove 25. On insertion of the tab I Sa of the cover 1 8 into the retainer formation (groove) 25, the tab I 8a of the cover 18 engages the engagement portion 22 of the clamping member 16.
The materia] of the housing 1 2 is resiliently deforrnable such that its opposed, upstanding sidewalls 12a. 1 2h may he spread apart, in the direction of arrow A in Figure 3, preferably using hand pressure or only light tools such as a moveable jig.
Once sufficient separation of the walls 1 2a, I 2h has occurred in this fashion it is possible to rotate the cover 1 8 (again preferably using oniy manual pressure) as signified by arrow B. This action simultaneously causes tab 1 8a to press the engagement portion 22 so that the clamping member 16 is driven into clamping engagement with the electronic device 14; and also aligns a second engagement tab 18b Qirotruding from the opposite side of cover 1 8 to that of tab 1 8a) with a further retainer formation in the form of a groove 27 formed adjacent the top of wall 12b.
The tabs 1 8a, I 8b and the grooves 25, 27 are in preferred embodiments of the invention identical, so that the cover 1 8 may be assembled without concern as to its orientation. This assists the efficiency of manufacture of the device 10.
Once the tab I 8b is aligned as aforesaid with groove 27 the sidewalls 12a, 12b may be released such that their resilient deformability urges them towards one another. As a result the tabs I 8a, I 8b become retained in the grooves 25, 27, thereby causing locking of the clamping member 16 in its clamping position as shown in Figure 4. Simultaneously the previously open side of the housing 12 visible in Figures Ito 3 is closed by the cover 18.
The engagement of part of the cover 1 8 with the engagement portion 22 of the clamping member 16 moves the clamping member 1 6 a short distance so that the resiliently deformable material 24 is forced against the electronic device 14.
Consequently, the electronic device 14 is forced against the heat sink portion 15 of the housing 12.
Optionally. dependine on the nature of the electronic device 14, the device 10 includes a heat conducting material 26 positioned between the electronic device 14 and the housing 12. The heat conducting material 26 may be attached to or pressed against the interior surface of the heat sink portion 1 5 of the housing 12 as shown. Heat which is generated by the electronic device 14 may then be transferred to the heat sink portion 18 of the housing 12 and dissipated to the atmosphere.
An optional feature of the cover 18 is its construction (eg. by pressing or extruding a formable metal such as aluminium) to include a medial plate I 8e that is connected to the engagement tabs 1 8a, I 8h (which extend from opposed sides of the plate 1 8c) via inclined or in use vertical, cranked portions I 8d. The effect of this arrangement is to space the medial plate I 8c above the level of the grooves 25, 27 (which are in the preferred embodiment each at the same level relative to the remainder of housing 12) when the device 10 is assembled as shown in Figure 4. This provides a larger volume within housing 12, for the mounting of electronic devices, than would be possible if the cover 18 was a flat lamina. The use of a flat, laminar type of cover 1 8 however is not excluded from the scope of the invention.
The device 10 thus optionally may include one or more further components (such as but not limited to a printed circuit board (PCB) 28) lying within the housing 12 and electrically coupled to the electronic device 14.
As will be apparent to the skilled addressee, the heat dissipation device of the invention may be used to clamp multip]e electronic devices against the housing of the device, thus promoting the dissipation of heat produced by the electronic devices. Moreover, the components of the device are straightforward to manuflhcture and are simple and quick to assemble.
Claims (17)
1. A heat dissipating device comprising: a hollow housing having an openable side at least one heat-generating electronic device lying within the housing at least one moveable clamping member lying substantially within the interior of the housing; and a cover that is nioveahle between open and closed positions in which it respectively opens and closes the openable side, movement of the cover from the open to the closed position causing engagement between the cover and the clamping member SO to clamp the electronic device between the clamping member and the housing. thereby promoting transfer of heat between the electronic device and the housing.
2. A heat dissipating device according to Claim 1, wherein movement of the cover towards the closed position following the said engagement causes relative movement between the cover and the clamping member.
3. A heat dissipating device according to Claim I or Claim 2, wherein the clamping member is rotatably mounted relative to the housing.
4. A heat dissipating device according to any preceding claim, wherein the relative movement between the cover and the clamping member includes causing rotation of the cover SO that a part thereof engages a part of the clamping member thereby to cause the clamping member to press against the electronic device.
5. A heat dissipating device according to any of the preceding claims, wherein the housing is resiliently deformable and includes respective, mutually spaced walls that arc moveahie away from one another against the resilience of the housing to permit insertion of the cover therehetween on assembly of the heat dissipating device, and engagement with the cover when the resilience of the housing acts on the cover.
6. A heat dissipating device according to Claim 5, wherein each of the mutually spaced walls includes formed therein a retainer formation for receiving a part of thc cover member and thereby constraining the movement of the cover relative to the housing when the resilience of the housing acts thereon.
S
7. A heat dissipating device according to any of the preceding claims, wherein the clamping member is substantially L-shaped and includes a pivot member at or near the corner of the L-shapc.
8. A heat dissipating device according to Claim 7, wherein the pivot member is receivable in a socket defined in the hollow interior of the housing to define a hingeable mounting for the clamping member.
9. A heat dissipating device according to any of the preceding claims, wherein the or each clamping member includes an engagement portion for engagement with the cover.
10. A heat dissipating device according to Claim 9, wherein the engagement portion defines a crank which protrudes outside the interior of the housing.
11. A heat dissipating device according to Claim 10, wherein the crank protrudes via the openable side of the housing.
12. A heat dissipating device according to any of the preceding claims, wherein the or each clamping member includes a resiliently deformable material for engaging the electronic device.
13. A heat dissipating device according to any of the preceding claims, wherein the device includes a heat conducting material positioned between the heat-generating electronic device and the housing.
14. A heat dissipating device according to any of the preceding claims, wherein the device includes one or more further components lying within the housing and electrically coupled to the at least one heat-generating electronic device.
15. A heat dissipating device according to Claim 14, wherein the device includes a printed circuit board.
16. A heat dissipating device according to any preceding claim wherein the cover includes a cover plate having two opposed sides protruding from each of which is an engagement tab for engaging the housing, the cover plate being connected to each said tab by a cranked portion whereby, on assembly of the device the engagement tabs each lie at a different level, relative to the housing, than the cover plate.
17. A heat dissipating device generally as herein described with reference to and/or as illustrated in the accompanying drawings.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0518791A GB2430310A (en) | 2005-09-15 | 2005-09-15 | A heat dissipation device |
| PCT/GB2006/003399 WO2007031750A2 (en) | 2005-09-15 | 2006-09-14 | A heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0518791A GB2430310A (en) | 2005-09-15 | 2005-09-15 | A heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0518791D0 GB0518791D0 (en) | 2005-10-26 |
| GB2430310A true GB2430310A (en) | 2007-03-21 |
Family
ID=35248792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0518791A Withdrawn GB2430310A (en) | 2005-09-15 | 2005-09-15 | A heat dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB2430310A (en) |
| WO (1) | WO2007031750A2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010132745A1 (en) * | 2009-05-14 | 2010-11-18 | American Power Conversion Corporation | Power semiconductor heatsinking |
| WO2017215930A1 (en) * | 2016-06-13 | 2017-12-21 | Emg Automation Gmbh | Electrohydraulic actuating device with cooling modules |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM441311U (en) * | 2012-06-08 | 2012-11-11 | Leng-Hong Zhang | Casing formed with heat sink combination |
| EP2824275B1 (en) * | 2013-07-09 | 2015-09-16 | ABB Technology Ltd | Subsea unit with cooling of electronic devices |
| JP7233282B2 (en) * | 2019-03-28 | 2023-03-06 | 古河電気工業株式会社 | Heat dissipation structure of heat-generating member |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9213671U1 (en) * | 1991-11-11 | 1992-12-03 | Tridonic-Bauelemente GmbH, Dornbirn | Housing for an electronic circuit arrangement |
| US5309979A (en) * | 1993-06-08 | 1994-05-10 | Delco Electronics Corp. | Self clamping heat sink assembly |
| EP0625871A1 (en) * | 1993-05-21 | 1994-11-23 | Cummins Engine Company, Inc. | Electronic component heat sink attachment using a canted coil spring |
| US6225559B1 (en) * | 1997-05-30 | 2001-05-01 | Lenze Gmbh & Co. | Heat-insulated housing to accommodate electrical or electronic components |
| US6864573B2 (en) * | 2003-05-06 | 2005-03-08 | Daimlerchrysler Corporation | Two piece heat sink and device package |
-
2005
- 2005-09-15 GB GB0518791A patent/GB2430310A/en not_active Withdrawn
-
2006
- 2006-09-14 WO PCT/GB2006/003399 patent/WO2007031750A2/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9213671U1 (en) * | 1991-11-11 | 1992-12-03 | Tridonic-Bauelemente GmbH, Dornbirn | Housing for an electronic circuit arrangement |
| EP0625871A1 (en) * | 1993-05-21 | 1994-11-23 | Cummins Engine Company, Inc. | Electronic component heat sink attachment using a canted coil spring |
| US5309979A (en) * | 1993-06-08 | 1994-05-10 | Delco Electronics Corp. | Self clamping heat sink assembly |
| US6225559B1 (en) * | 1997-05-30 | 2001-05-01 | Lenze Gmbh & Co. | Heat-insulated housing to accommodate electrical or electronic components |
| US6864573B2 (en) * | 2003-05-06 | 2005-03-08 | Daimlerchrysler Corporation | Two piece heat sink and device package |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010132745A1 (en) * | 2009-05-14 | 2010-11-18 | American Power Conversion Corporation | Power semiconductor heatsinking |
| US8072761B2 (en) | 2009-05-14 | 2011-12-06 | American Power Conversion Corporation | Power semiconductor heatsinking |
| CN102460688A (en) * | 2009-05-14 | 2012-05-16 | 美国能量变换公司 | Power semiconductor heatsinking |
| CN102460688B (en) * | 2009-05-14 | 2013-12-11 | 美国能量变换公司 | Power semiconductor radiator |
| WO2017215930A1 (en) * | 2016-06-13 | 2017-12-21 | Emg Automation Gmbh | Electrohydraulic actuating device with cooling modules |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007031750A3 (en) | 2007-08-16 |
| GB0518791D0 (en) | 2005-10-26 |
| WO2007031750A2 (en) | 2007-03-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |