WO2007031750A3 - A heat dissipation device - Google Patents

A heat dissipation device Download PDF

Info

Publication number
WO2007031750A3
WO2007031750A3 PCT/GB2006/003399 GB2006003399W WO2007031750A3 WO 2007031750 A3 WO2007031750 A3 WO 2007031750A3 GB 2006003399 W GB2006003399 W GB 2006003399W WO 2007031750 A3 WO2007031750 A3 WO 2007031750A3
Authority
WO
WIPO (PCT)
Prior art keywords
housing
cover
clamping member
electronic device
heat
Prior art date
Application number
PCT/GB2006/003399
Other languages
French (fr)
Other versions
WO2007031750A2 (en
Inventor
Bernhard Pfeiffer
Neil Dudley
Paul Wiggins
Original Assignee
Tyco Electronics Ltd Uk
Bernhard Pfeiffer
Neil Dudley
Paul Wiggins
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Ltd Uk, Bernhard Pfeiffer, Neil Dudley, Paul Wiggins filed Critical Tyco Electronics Ltd Uk
Publication of WO2007031750A2 publication Critical patent/WO2007031750A2/en
Publication of WO2007031750A3 publication Critical patent/WO2007031750A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating device (10) comprises a hollow housing (12) having an openable side. At least one heat-generating electronic device (14) lies within the housing (12) and at least one moveable clamping member (22) lies substantially within the interior of the housing (12). The device (10) also comprises a cover (32) that is moveable between open and closed positions in which it respectively opens and closes the openable side. Movement of the cover from the open to the closed position causes engagement between the cover (32) and the clamping member (22) so to clamp the electronic device (14) between the clamping member (22) and the housing (12), thereby promoting transfer of heat between the electronic device (14) and the housing (12).
PCT/GB2006/003399 2005-09-15 2006-09-14 A heat dissipation device WO2007031750A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0518791A GB2430310A (en) 2005-09-15 2005-09-15 A heat dissipation device
GB0518791.9 2005-09-15

Publications (2)

Publication Number Publication Date
WO2007031750A2 WO2007031750A2 (en) 2007-03-22
WO2007031750A3 true WO2007031750A3 (en) 2007-08-16

Family

ID=35248792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2006/003399 WO2007031750A2 (en) 2005-09-15 2006-09-14 A heat dissipation device

Country Status (2)

Country Link
GB (1) GB2430310A (en)
WO (1) WO2007031750A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233282B2 (en) 2019-03-28 2023-03-06 古河電気工業株式会社 Heat dissipation structure of heat-generating member

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8072761B2 (en) * 2009-05-14 2011-12-06 American Power Conversion Corporation Power semiconductor heatsinking
TWM441311U (en) * 2012-06-08 2012-11-11 Leng-Hong Zhang Casing formed with heat sink combination
EP2824275B1 (en) * 2013-07-09 2015-09-16 ABB Technology Ltd Subsea unit with cooling of electronic devices
DE102016110779A1 (en) * 2016-06-13 2017-12-14 Emg Automation Gmbh Electrohydraulic actuator with cooling modules

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9213671U1 (en) * 1991-11-11 1992-12-03 Tridonic-Bauelemente GmbH, Dornbirn Housing for an electronic circuit arrangement
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
EP0625871A1 (en) * 1993-05-21 1994-11-23 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
DE19722602A1 (en) * 1997-05-30 1998-12-03 Lenze Gmbh & Co Kg Aerzen Heat-dissipating housing for holding electrical or electronic components
US20040222517A1 (en) * 2003-05-06 2004-11-11 Robertson Michael F. Two piece heat sink and device package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9213671U1 (en) * 1991-11-11 1992-12-03 Tridonic-Bauelemente GmbH, Dornbirn Housing for an electronic circuit arrangement
EP0625871A1 (en) * 1993-05-21 1994-11-23 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
DE19722602A1 (en) * 1997-05-30 1998-12-03 Lenze Gmbh & Co Kg Aerzen Heat-dissipating housing for holding electrical or electronic components
US20040222517A1 (en) * 2003-05-06 2004-11-11 Robertson Michael F. Two piece heat sink and device package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233282B2 (en) 2019-03-28 2023-03-06 古河電気工業株式会社 Heat dissipation structure of heat-generating member

Also Published As

Publication number Publication date
GB2430310A (en) 2007-03-21
GB0518791D0 (en) 2005-10-26
WO2007031750A2 (en) 2007-03-22

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