DE69331676T2 - Hochstromleiterplatte - Google Patents

Hochstromleiterplatte

Info

Publication number
DE69331676T2
DE69331676T2 DE69331676T DE69331676T DE69331676T2 DE 69331676 T2 DE69331676 T2 DE 69331676T2 DE 69331676 T DE69331676 T DE 69331676T DE 69331676 T DE69331676 T DE 69331676T DE 69331676 T2 DE69331676 T2 DE 69331676T2
Authority
DE
Germany
Prior art keywords
current pcb
pcb
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69331676T
Other languages
English (en)
Other versions
DE69331676D1 (de
Inventor
Saturo Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69331676D1 publication Critical patent/DE69331676D1/de
Publication of DE69331676T2 publication Critical patent/DE69331676T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
DE69331676T 1992-09-30 1993-09-29 Hochstromleiterplatte Expired - Lifetime DE69331676T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26150192 1992-09-30
JP5060209A JP2743762B2 (ja) 1992-09-30 1993-03-19 大電流回路基板

Publications (2)

Publication Number Publication Date
DE69331676D1 DE69331676D1 (de) 2002-04-18
DE69331676T2 true DE69331676T2 (de) 2002-11-21

Family

ID=26401274

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69331676T Expired - Lifetime DE69331676T2 (de) 1992-09-30 1993-09-29 Hochstromleiterplatte

Country Status (5)

Country Link
US (1) US5442142A (de)
EP (1) EP0590643B1 (de)
JP (1) JP2743762B2 (de)
DE (1) DE69331676T2 (de)
HK (1) HK1010035A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008514A1 (de) * 2012-05-02 2013-11-07 Erni Electronics Gmbh Leiterplatte mit hochbelastbarem Strompfad
DE102014006346A1 (de) * 2014-04-30 2015-11-05 Ellenberger & Poensgen Gmbh Hochstromschalter
DE102016101305A1 (de) * 2016-01-26 2017-07-27 Eberspächer Controls Landau Gmbh & Co. Kg Verfahren zum Bestücken einer Leiterplatte und Leiterplattenbaugruppe
DE102021100717A1 (de) 2021-01-15 2022-07-21 Infineon Technologies Ag Package mit eingekapselter elektronischer Komponente zwischen einem Laminat und einem thermisch leitfähigen Träger

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9403108U1 (de) * 1994-02-24 1994-04-14 Siemens Ag Niederinduktive Hochstromverschienung für Stromrichtermodule
US6051782A (en) * 1998-01-21 2000-04-18 Yazaki Corporation Conductor layout for electrical junction box
EP1187258A1 (de) * 2000-08-30 2002-03-13 Kojin, Ltd. Sicherungs- und Relaiskasten für Kraftfahrzeuge
DE10211154A1 (de) * 2002-03-14 2003-09-25 Bosch Gmbh Robert Anschlußvorrichtung zur Kontaktierung von elektrischen Maschinen, elektrische Maschine mit Anschlußvorrichtung sowie Startervorrichtung für Brennkraftmaschinen mit einer eine Anschlußvorrichtung aufweisenden elektrischen Maschine
JP2003309338A (ja) * 2002-04-15 2003-10-31 Fujitsu Ltd 基板、接続構造及び電子装置
KR100502912B1 (ko) * 2003-04-01 2005-07-21 삼성에스디아이 주식회사 발광 표시 장치 및 그 표시 패널과 구동 방법
US20050221684A1 (en) * 2004-03-30 2005-10-06 Kuo-Chu Yeh Electrical switching device
JP4626592B2 (ja) * 2006-09-06 2011-02-09 日産自動車株式会社 積層ブスバ構造
JP2010165808A (ja) * 2009-01-15 2010-07-29 Mitsubishi Electric Corp 電子制御装置
US8221601B2 (en) * 2010-09-23 2012-07-17 Sunpower Corporation Maintainable substrate carrier for electroplating
US8221600B2 (en) * 2010-09-23 2012-07-17 Sunpower Corporation Sealed substrate carrier for electroplating
CN104185709B (zh) * 2012-03-26 2016-08-24 住友重机械工业株式会社 工业机械
CN102711377A (zh) * 2012-05-09 2012-10-03 敬鹏(常熟)电子有限公司 用于传输大电流的电路板
US9900982B2 (en) * 2013-11-12 2018-02-20 Finisar Corporation Buttoned soldering pad for use with fine-pitch hot bar soldering
JP6164423B2 (ja) * 2013-12-11 2017-07-19 住友電装株式会社 バスバーユニット
DE102014006360B4 (de) 2014-04-30 2019-03-07 Ellenberger & Poensgen Gmbh Elektrische Schaltung
JP2016115080A (ja) * 2014-12-12 2016-06-23 株式会社オートネットワーク技術研究所 情報処理装置
GB2545425B (en) * 2015-12-14 2019-03-27 Ge Aviat Systems Ltd Distributed wiring board connections
JP6443632B2 (ja) * 2015-12-16 2018-12-26 株式会社オートネットワーク技術研究所 回路構成体、及び電気接続箱
DE102016110742A1 (de) * 2016-06-10 2017-12-14 Epcos Ag Filterbauelement zur Filterung eines Störsignals
KR102528952B1 (ko) * 2016-06-28 2023-05-03 엘지디스플레이 주식회사 디스플레이 장치
CN207303429U (zh) * 2017-08-23 2018-05-01 泰科电子(上海)有限公司 连接器和连接器组件
FR3084972B1 (fr) 2018-08-13 2021-12-10 Valeo Siemens Eautomotive France Sas Ensemble electrique
CN112399708A (zh) * 2019-08-12 2021-02-23 中兴通讯股份有限公司 一种印制电路板、支架和通流装置
JP7257923B2 (ja) * 2019-09-09 2023-04-14 東芝三菱電機産業システム株式会社 柱状導体及び導体構造
CN112888144A (zh) * 2019-11-29 2021-06-01 中兴通讯股份有限公司 通流条组件以及通流装置
JP7359682B2 (ja) * 2019-12-20 2023-10-11 ファナック株式会社 バスバーを有するモータ駆動装置
PL240984B1 (pl) * 2020-07-27 2022-07-11 Stiliger Spolka Z Ograniczona Odpowiedzialnoscia Płyta drukowana do modułowego, wielokanałowego urządzenia wykonawczego, sterującego odbiornikami elektrycznymi, zwłaszcza w systemach automatyki budynkowej
JP2023022422A (ja) * 2021-08-03 2023-02-15 日本メクトロン株式会社 電子部品付きプリント基板の製造方法、及び、電子部品付きプリント基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2025619A (en) * 1932-09-26 1935-12-24 Scotncy Ronald Wiring or connection of radio or other electrical circuits
US2779998A (en) * 1952-01-30 1957-02-05 Lockheed Aircraft Corp Method of forming a mechanical and electrical connection
US3446908A (en) * 1966-11-01 1969-05-27 Sanders Associates Inc Printed circuit terminations and methods of making the same
US3832603A (en) * 1973-03-09 1974-08-27 Control Data Corp Interconnect technique for stacked circuit boards
US3858479A (en) * 1973-09-14 1975-01-07 Hi Shear Corp Blind fastener set by rotary stud having threads of opposite hand
US4015328A (en) * 1975-06-02 1977-04-05 Mcdonough Cletus G Multilayered circuit assembly including an eyelet for making weldable connections and a method of making said assembly
JPS60257191A (ja) * 1984-06-02 1985-12-18 株式会社日立製作所 プリント配線板
JPH07101034B2 (ja) * 1988-08-04 1995-11-01 ダイキン工業株式会社 ツイン形圧縮装置
JPH0760915B2 (ja) * 1989-02-03 1995-06-28 三菱電機株式会社 基板装置
US4899439A (en) * 1989-06-15 1990-02-13 Microelectronics And Computer Technology Corporation Method of fabricating a high density electrical interconnect
US5065283A (en) * 1990-06-12 1991-11-12 Mitsubishi Denki Kabushiki Kaisha Printed circuit board with busbar interconnections

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008514A1 (de) * 2012-05-02 2013-11-07 Erni Electronics Gmbh Leiterplatte mit hochbelastbarem Strompfad
DE102014006346A1 (de) * 2014-04-30 2015-11-05 Ellenberger & Poensgen Gmbh Hochstromschalter
US10070514B2 (en) 2014-04-30 2018-09-04 Ellenberger & Poensgen Gmbh High current switch
DE102016101305A1 (de) * 2016-01-26 2017-07-27 Eberspächer Controls Landau Gmbh & Co. Kg Verfahren zum Bestücken einer Leiterplatte und Leiterplattenbaugruppe
DE102016101305B4 (de) * 2016-01-26 2017-11-16 Eberspächer Controls Landau Gmbh & Co. Kg Verfahren zum Bestücken einer Leiterplatte und Leiterplattenbaugruppe
DE102021100717A1 (de) 2021-01-15 2022-07-21 Infineon Technologies Ag Package mit eingekapselter elektronischer Komponente zwischen einem Laminat und einem thermisch leitfähigen Träger
US11908760B2 (en) 2021-01-15 2024-02-20 Infineon Technologies Ag Package with encapsulated electronic component between laminate and thermally conductive carrier

Also Published As

Publication number Publication date
US5442142A (en) 1995-08-15
EP0590643B1 (de) 2002-03-13
JPH06169138A (ja) 1994-06-14
HK1010035A1 (en) 1999-06-11
EP0590643A2 (de) 1994-04-06
DE69331676D1 (de) 2002-04-18
JP2743762B2 (ja) 1998-04-22
EP0590643A3 (en) 1996-07-03

Similar Documents

Publication Publication Date Title
DE69331676T2 (de) Hochstromleiterplatte
DE69308978D1 (de) Verzögerungsschaltung
DE69302296T2 (de) Leiterplatte
DE69402227D1 (de) Leiterplattenanordnung
DE69423854D1 (de) Leiterplattenverbinder
DE69320500T2 (de) Steckverbinder
DE69317350D1 (de) Vergleichsschaltung
ATA234991A (de) Leiterplattenanordnung
DE69207507T2 (de) Leiterplatte
DE69218004T2 (de) Flussmittelloses lötverfahren
DE59304283D1 (de) Schaltungsanordnung
DE69303217T2 (de) Steckverbinder
DE69418417D1 (de) Leiterplattenbefestigung
DE69311583D1 (de) Leuchte
KR950701160A (ko) 결합회로
ITMI931813A0 (it) Lampada
DE9205545U1 (de) Steckverbinder
DE9205659U1 (de) Steckverbinder
DE69302816T2 (de) Dimmeranordnungen
DE59302341D1 (de) Leiterbahnen-Verbindung
DE69403661D1 (de) Optimierungschaltung
DE59303835D1 (de) Schaltungsanordnung
ATA100892A (de) Mehrlagen-leiterplatte
DE9209570U1 (de) Schaltungsanordnung
DK53193D0 (da) Gennemvalgskredsloeb

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)