HK1010035A1 - Large-current circuit board - Google Patents

Large-current circuit board

Info

Publication number
HK1010035A1
HK1010035A1 HK98110725A HK98110725A HK1010035A1 HK 1010035 A1 HK1010035 A1 HK 1010035A1 HK 98110725 A HK98110725 A HK 98110725A HK 98110725 A HK98110725 A HK 98110725A HK 1010035 A1 HK1010035 A1 HK 1010035A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
current circuit
current
board
circuit
Prior art date
Application number
HK98110725A
Other languages
English (en)
Inventor
Saturo Hayashi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of HK1010035A1 publication Critical patent/HK1010035A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Multi-Conductor Connections (AREA)
HK98110725A 1992-09-30 1998-09-18 Large-current circuit board HK1010035A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26150192 1992-09-30
JP5060209A JP2743762B2 (ja) 1992-09-30 1993-03-19 大電流回路基板

Publications (1)

Publication Number Publication Date
HK1010035A1 true HK1010035A1 (en) 1999-06-11

Family

ID=26401274

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98110725A HK1010035A1 (en) 1992-09-30 1998-09-18 Large-current circuit board

Country Status (5)

Country Link
US (1) US5442142A (xx)
EP (1) EP0590643B1 (xx)
JP (1) JP2743762B2 (xx)
DE (1) DE69331676T2 (xx)
HK (1) HK1010035A1 (xx)

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DE9403108U1 (de) * 1994-02-24 1994-04-14 Siemens AG, 80333 München Niederinduktive Hochstromverschienung für Stromrichtermodule
US6051782A (en) * 1998-01-21 2000-04-18 Yazaki Corporation Conductor layout for electrical junction box
EP1187258A1 (en) * 2000-08-30 2002-03-13 Kojin, Ltd. Fuse relay junction block for use in automobiles
DE10211154A1 (de) * 2002-03-14 2003-09-25 Bosch Gmbh Robert Anschlußvorrichtung zur Kontaktierung von elektrischen Maschinen, elektrische Maschine mit Anschlußvorrichtung sowie Startervorrichtung für Brennkraftmaschinen mit einer eine Anschlußvorrichtung aufweisenden elektrischen Maschine
JP2003309338A (ja) * 2002-04-15 2003-10-31 Fujitsu Ltd 基板、接続構造及び電子装置
KR100502912B1 (ko) * 2003-04-01 2005-07-21 삼성에스디아이 주식회사 발광 표시 장치 및 그 표시 패널과 구동 방법
US20050221684A1 (en) * 2004-03-30 2005-10-06 Kuo-Chu Yeh Electrical switching device
JP4626592B2 (ja) * 2006-09-06 2011-02-09 日産自動車株式会社 積層ブスバ構造
JP2010165808A (ja) * 2009-01-15 2010-07-29 Mitsubishi Electric Corp 電子制御装置
US8221600B2 (en) * 2010-09-23 2012-07-17 Sunpower Corporation Sealed substrate carrier for electroplating
US8221601B2 (en) * 2010-09-23 2012-07-17 Sunpower Corporation Maintainable substrate carrier for electroplating
JP5872025B2 (ja) * 2012-03-26 2016-03-01 住友重機械工業株式会社 産業機械
DE102012008514A1 (de) * 2012-05-02 2013-11-07 Erni Electronics Gmbh Leiterplatte mit hochbelastbarem Strompfad
CN102711377A (zh) * 2012-05-09 2012-10-03 敬鹏(常熟)电子有限公司 用于传输大电流的电路板
US9900982B2 (en) * 2013-11-12 2018-02-20 Finisar Corporation Buttoned soldering pad for use with fine-pitch hot bar soldering
JP6164423B2 (ja) * 2013-12-11 2017-07-19 住友電装株式会社 バスバーユニット
DE102014006360B4 (de) 2014-04-30 2019-03-07 Ellenberger & Poensgen Gmbh Elektrische Schaltung
DE102014006346A1 (de) 2014-04-30 2015-11-05 Ellenberger & Poensgen Gmbh Hochstromschalter
JP2016115080A (ja) * 2014-12-12 2016-06-23 株式会社オートネットワーク技術研究所 情報処理装置
GB2545425B (en) * 2015-12-14 2019-03-27 Ge Aviat Systems Ltd Distributed wiring board connections
JP6443632B2 (ja) * 2015-12-16 2018-12-26 株式会社オートネットワーク技術研究所 回路構成体、及び電気接続箱
DE102016101305B4 (de) * 2016-01-26 2017-11-16 Eberspächer Controls Landau Gmbh & Co. Kg Verfahren zum Bestücken einer Leiterplatte und Leiterplattenbaugruppe
DE102016110742A1 (de) * 2016-06-10 2017-12-14 Epcos Ag Filterbauelement zur Filterung eines Störsignals
KR102528952B1 (ko) * 2016-06-28 2023-05-03 엘지디스플레이 주식회사 디스플레이 장치
CN207303429U (zh) * 2017-08-23 2018-05-01 泰科电子(上海)有限公司 连接器和连接器组件
FR3084972B1 (fr) 2018-08-13 2021-12-10 Valeo Siemens Eautomotive France Sas Ensemble electrique
CN112399708A (zh) * 2019-08-12 2021-02-23 中兴通讯股份有限公司 一种印制电路板、支架和通流装置
JP7257923B2 (ja) * 2019-09-09 2023-04-14 東芝三菱電機産業システム株式会社 柱状導体及び導体構造
CN112888144A (zh) * 2019-11-29 2021-06-01 中兴通讯股份有限公司 通流条组件以及通流装置
JP7359682B2 (ja) * 2019-12-20 2023-10-11 ファナック株式会社 バスバーを有するモータ駆動装置
PL240984B1 (pl) * 2020-07-27 2022-07-11 Stiliger Spolka Z Ograniczona Odpowiedzialnoscia Płyta drukowana do modułowego, wielokanałowego urządzenia wykonawczego, sterującego odbiornikami elektrycznymi, zwłaszcza w systemach automatyki budynkowej
DE102021100717A1 (de) 2021-01-15 2022-07-21 Infineon Technologies Ag Package mit eingekapselter elektronischer Komponente zwischen einem Laminat und einem thermisch leitfähigen Träger
JP2023022422A (ja) * 2021-08-03 2023-02-15 日本メクトロン株式会社 電子部品付きプリント基板の製造方法、及び、電子部品付きプリント基板

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US2025619A (en) * 1932-09-26 1935-12-24 Scotncy Ronald Wiring or connection of radio or other electrical circuits
US2779998A (en) * 1952-01-30 1957-02-05 Lockheed Aircraft Corp Method of forming a mechanical and electrical connection
US3446908A (en) * 1966-11-01 1969-05-27 Sanders Associates Inc Printed circuit terminations and methods of making the same
US3832603A (en) * 1973-03-09 1974-08-27 Control Data Corp Interconnect technique for stacked circuit boards
US3858479A (en) * 1973-09-14 1975-01-07 Hi Shear Corp Blind fastener set by rotary stud having threads of opposite hand
US4015328A (en) * 1975-06-02 1977-04-05 Mcdonough Cletus G Multilayered circuit assembly including an eyelet for making weldable connections and a method of making said assembly
JPS60257191A (ja) * 1984-06-02 1985-12-18 株式会社日立製作所 プリント配線板
JPH07101034B2 (ja) * 1988-08-04 1995-11-01 ダイキン工業株式会社 ツイン形圧縮装置
JPH0760915B2 (ja) * 1989-02-03 1995-06-28 三菱電機株式会社 基板装置
US4899439A (en) * 1989-06-15 1990-02-13 Microelectronics And Computer Technology Corporation Method of fabricating a high density electrical interconnect
US5065283A (en) * 1990-06-12 1991-11-12 Mitsubishi Denki Kabushiki Kaisha Printed circuit board with busbar interconnections

Also Published As

Publication number Publication date
EP0590643A3 (en) 1996-07-03
EP0590643A2 (en) 1994-04-06
DE69331676T2 (de) 2002-11-21
US5442142A (en) 1995-08-15
DE69331676D1 (de) 2002-04-18
JP2743762B2 (ja) 1998-04-22
EP0590643B1 (en) 2002-03-13
JPH06169138A (ja) 1994-06-14

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100929