DE69329567T2 - Identifikation von offenen Anschlussfehlern durch kapazitive Kopplung - Google Patents

Identifikation von offenen Anschlussfehlern durch kapazitive Kopplung

Info

Publication number
DE69329567T2
DE69329567T2 DE69329567T DE69329567T DE69329567T2 DE 69329567 T2 DE69329567 T2 DE 69329567T2 DE 69329567 T DE69329567 T DE 69329567T DE 69329567 T DE69329567 T DE 69329567T DE 69329567 T2 DE69329567 T2 DE 69329567T2
Authority
DE
Germany
Prior art keywords
identification
capacitive coupling
open connection
connection errors
errors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69329567T
Other languages
English (en)
Other versions
DE69329567D1 (de
Inventor
Kevin W Keirn
David T Crook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69329567D1 publication Critical patent/DE69329567D1/de
Application granted granted Critical
Publication of DE69329567T2 publication Critical patent/DE69329567T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
DE69329567T 1992-03-10 1993-02-04 Identifikation von offenen Anschlussfehlern durch kapazitive Kopplung Expired - Fee Related DE69329567T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/848,909 US5696451A (en) 1992-03-10 1992-03-10 Identification of pin-open faults by capacitive coupling

Publications (2)

Publication Number Publication Date
DE69329567D1 DE69329567D1 (de) 2000-11-23
DE69329567T2 true DE69329567T2 (de) 2001-03-15

Family

ID=25304605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69329567T Expired - Fee Related DE69329567T2 (de) 1992-03-10 1993-02-04 Identifikation von offenen Anschlussfehlern durch kapazitive Kopplung

Country Status (6)

Country Link
US (1) US5696451A (de)
EP (1) EP0560484B1 (de)
JP (1) JP3228816B2 (de)
KR (1) KR100248640B1 (de)
DE (1) DE69329567T2 (de)
TW (2) TW209317B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254953A (en) * 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5625292A (en) * 1990-12-20 1997-04-29 Hewlett-Packard Company System for measuring the integrity of an electrical contact
US5420500A (en) * 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
DE4309842C1 (de) * 1993-03-26 1994-06-16 Arnold Edv Gmbh Verfahren zum Testen von Platinen und Vorrichtung zur Durchführung des Verfahrens
DE4402230C1 (de) * 1994-01-26 1995-01-19 Gfp Ges Fuer Prueftechnik Mbh Verfahren zum Testen, ob Anschlußstifte einer integrierten Schaltung in eine gedruckte Schaltung elektrisch leitend eingelötet sind und Schaltungsanordnung zur Durchführung des Verfahrens
US5391993A (en) * 1994-01-27 1995-02-21 Genrad, Inc. Capacitive open-circuit test employing threshold determination
JP2994259B2 (ja) 1996-03-28 1999-12-27 オー・エイチ・ティー株式会社 基板検査方法および基板検査装置
JP3165056B2 (ja) * 1997-02-28 2001-05-14 日本電産リード株式会社 基板検査装置および基板検査方法
FR2771182B1 (fr) * 1997-11-18 2000-01-28 Sgs Thomson Microelectronics Procede et systeme de test d'un circuit integre a fonctionnement sans contact, et d'une capacite d'entree d'un tel circuit integre
DE69941322D1 (de) * 1998-02-05 2009-10-08 Nxp Bv Verbindungstestverfahren
JP3675678B2 (ja) * 1999-08-06 2005-07-27 株式会社 東京ウエルズ プローブ接触状態検出方法およびプローブ接触状態検出装置
US6262580B1 (en) * 1999-10-14 2001-07-17 United Microelectronics Corp Method and testing system for measuring contact resistance for pin of integrated circuit
JP2001235501A (ja) * 2000-02-22 2001-08-31 Oht Inc 検査装置及びセンサ
US6825673B1 (en) * 2000-05-19 2004-11-30 Oht Inc. Method and apparatus for circuit board continuity test, tool for continuity test, and recording medium
US6333680B1 (en) * 2000-10-02 2001-12-25 International Business Machines Corporation Method and system for characterizing coupling capacitance between integrated circuit interconnects
US6683449B1 (en) * 2000-10-06 2004-01-27 Dell Products, L.P. Apparatus and method for detecting a mechanical component on a computer system substrate
US20030115502A1 (en) * 2001-12-14 2003-06-19 Smiths Industries Aerospace & Defense Systems, Inc. Method of restoring encapsulated integrated circuit devices
US6717415B2 (en) * 2002-02-05 2004-04-06 Logicvision, Inc. Circuit and method for determining the location of defect in a circuit
US6947853B2 (en) * 2002-05-23 2005-09-20 Oht, Inc. Apparatus and method for inspecting electrical continuity of circuit board, jig for use therein, and recording medium thereon
US7109728B2 (en) * 2003-02-25 2006-09-19 Agilent Technologies, Inc. Probe based information storage for probes used for opens detection in in-circuit testing
US6901336B2 (en) * 2003-03-31 2005-05-31 Agilent Technologies, Inc. Method and apparatus for supplying power, and channeling analog measurement and communication signals over single pair of wires
US7170394B2 (en) * 2003-07-31 2007-01-30 Agilent Technologies, Inc. Remote current sensing and communication over single pair of power feed wires
US6930494B2 (en) * 2003-08-29 2005-08-16 Agilent Technologies, Inc. Capacitive probe assembly with flex circuit
US6998849B2 (en) * 2003-09-27 2006-02-14 Agilent Technologies, Inc. Capacitive sensor measurement method for discrete time sampled system for in-circuit test
US7224169B2 (en) 2004-11-02 2007-05-29 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections
KR100674450B1 (ko) * 2005-03-31 2007-02-15 주식회사 청천바텍 음식물 쓰레기, 하수 슬러지, 동 식물류의 건조 탄화처리장치
US7279921B1 (en) * 2005-06-08 2007-10-09 National Semiconductor Corporation Apparatus and method for testing power and ground pins on a semiconductor integrated circuit
US7622931B2 (en) * 2005-10-03 2009-11-24 University Of Utah Research Foundation Non-contact reflectometry system and method
TWI320485B (en) * 2007-03-08 2010-02-11 Test Research Inc Open-circuit testing system and method
US7764069B2 (en) * 2007-04-25 2010-07-27 International Business Machines Corporation Process for measuring bond-line thickness
US8310256B2 (en) 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
JP5307085B2 (ja) * 2010-07-20 2013-10-02 日置電機株式会社 回路基板検査装置
US8583391B2 (en) * 2011-04-15 2013-11-12 Hamilton Sundstrand Corporation Monitoring the low cycle fatigue of ruggedized avionics electronics
KR102328803B1 (ko) * 2014-12-16 2021-11-22 삼성전자주식회사 전자 장치 및 전자 장치 접속부의 이상 여부 판단 방법
US11879935B2 (en) * 2020-09-25 2024-01-23 Nokomis, Inc. Testing of microelectronics device and method
KR102547616B1 (ko) * 2021-04-15 2023-06-26 큐알티 주식회사 반도체 칩 테스트용 보드, 이를 포함하는 반도체 칩 테스트 시스템, 및 이를 이용한 반도체 칩 테스트 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143954A (en) * 1983-07-22 1985-02-20 Sharetree Ltd A capacitive method and apparatus for checking connections of a printed circuit board
GB8423310D0 (en) * 1984-09-14 1984-10-17 Gec Avionics Electric circuit testing equipment
GB8521139D0 (en) * 1985-08-23 1985-10-02 Bicc Plc Terminating electrical connectors
US4789829A (en) * 1986-07-18 1988-12-06 Science Application International Corporation Method and apparatus for determining RE gasket shielding effectiveness
US4779041A (en) * 1987-05-20 1988-10-18 Hewlett-Packard Company Integrated circuit transfer test device system
FR2623615B1 (fr) * 1987-11-20 1991-01-25 Thomson Csf Dispositif de mesure electronique d'une surface, notamment applicable au controle de connexion
US4918376A (en) * 1989-03-07 1990-04-17 Ade Corporation A.C. capacitive gauging system
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5254953A (en) * 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5557209A (en) * 1990-12-20 1996-09-17 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5266901A (en) * 1992-05-29 1993-11-30 International Business Machines Corp. Apparatus and method for resistive detection and waveform analysis of interconenction networks

Also Published As

Publication number Publication date
EP0560484A3 (en) 1994-06-08
TW209317B (de) 1993-07-11
JP3228816B2 (ja) 2001-11-12
EP0560484B1 (de) 2000-10-18
JPH06160457A (ja) 1994-06-07
KR100248640B1 (ko) 2000-03-15
EP0560484A2 (de) 1993-09-15
DE69329567D1 (de) 2000-11-23
TW239251B (de) 1995-01-21
KR930020165A (ko) 1993-10-19
US5696451A (en) 1997-12-09

Similar Documents

Publication Publication Date Title
DE69329567D1 (de) Identifikation von offenen Anschlussfehlern durch kapazitive Kopplung
DE69311218D1 (de) Vorgespannte Flüssigkeitskupplung
DE69311432D1 (de) Schnittstelle zur Kopplung von elektronischen Schaltungen
NO176532C (no) Kopling
DE69232476D1 (de) Feststellung von Fehlern
NO178313C (no) Kopling
DE69128189D1 (de) Identifizierung von nichtverbundenen Anschlussstiften durch kapazitive Kopplung durch das Gehäuse der integrierten Schaltung
NO176491C (no) Utmattings-motstandig gjenget kopling
FI895780A0 (fi) Skiljning av data angaoende detaljer vid identifiering av fingermaerken.
DK0412677T3 (da) Rørledningskobling
DK0409348T3 (da) Dræningskoblingselement
BR9302718A (pt) Acoplamento elastico
DE69326737D1 (de) Kupplungseinrichtung-Kompressor-Aggregat
DE69320716D1 (de) Gerät zur Detektion von Verschiebungsinformation
DE69408340D1 (de) Wellenleiterkopplung
BR8902496A (pt) Acoplamento homocinetico
DK0612401T3 (da) Pumeafprøvning
DE69227169D1 (de) Flüssigkeitskupplung
NO904151D0 (no) Elektrostatisk flytende fremkaller og fremstilling derav.
BR9005960A (pt) Acoplamento plastico
ES2022628B3 (es) Fijacion y acoplamiento de paneles y revestimiento.
DE69305201T2 (de) Elastische Kupplung
DE69325769T2 (de) Erkennung von Befehlssynchronisationsfehlern
DE69331549D1 (de) Nachweiss von anti-hpa antikörpern
DE9319713U1 (de) Magnetkupplung

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD COMPANY (A DELAWARE CORPORATION),

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8339 Ceased/non-payment of the annual fee