DE69941322D1 - Verbindungstestverfahren - Google Patents

Verbindungstestverfahren

Info

Publication number
DE69941322D1
DE69941322D1 DE69941322T DE69941322T DE69941322D1 DE 69941322 D1 DE69941322 D1 DE 69941322D1 DE 69941322 T DE69941322 T DE 69941322T DE 69941322 T DE69941322 T DE 69941322T DE 69941322 D1 DE69941322 D1 DE 69941322D1
Authority
DE
Germany
Prior art keywords
test procedure
related test
procedure
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69941322T
Other languages
English (en)
Inventor
Jong Franciscus G De
Mathias N Muris
Rodger F Schuttert
Wilde Johannes De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
NXP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV filed Critical NXP BV
Application granted granted Critical
Publication of DE69941322D1 publication Critical patent/DE69941322D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
DE69941322T 1998-02-05 1999-01-25 Verbindungstestverfahren Expired - Lifetime DE69941322D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP98200338 1998-02-05
PCT/IB1999/000102 WO1999040448A1 (en) 1998-02-05 1999-01-25 Connection test method

Publications (1)

Publication Number Publication Date
DE69941322D1 true DE69941322D1 (de) 2009-10-08

Family

ID=8233361

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69941322T Expired - Lifetime DE69941322D1 (de) 1998-02-05 1999-01-25 Verbindungstestverfahren

Country Status (5)

Country Link
US (1) US6297643B2 (de)
EP (1) EP0972207B1 (de)
JP (1) JP4080550B2 (de)
DE (1) DE69941322D1 (de)
WO (1) WO1999040448A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744256B2 (en) * 2001-10-29 2004-06-01 Agilent Technologies, Inc. Boundary-scan testing of opto-electronic devices
US6717415B2 (en) * 2002-02-05 2004-04-06 Logicvision, Inc. Circuit and method for determining the location of defect in a circuit
JP2004062532A (ja) * 2002-07-29 2004-02-26 Renesas Technology Corp 接続検証装置
JP2004108872A (ja) * 2002-09-17 2004-04-08 Sanyo Electric Co Ltd 半導体パッケージ内部の結線テスト方法
US20050163895A1 (en) * 2004-01-28 2005-07-28 Graham Williams Baked product with increased shelf life and process for increasing the shelf life of baked products
US7786475B2 (en) * 2006-05-17 2010-08-31 Texas Instruments Incorporated In-line test circuit and method for determining interconnect electrical properties and integrated circuit incorporating the same
GB2466785B (en) 2008-12-30 2011-06-08 Wolfson Microelectronics Plc Apparatus and method for testing a capacitive transducer and/or associated electronic circuitry
US7821281B2 (en) * 2009-02-23 2010-10-26 Faraday Technology Corp. Method and apparatus of testing die to die interconnection for system in package
FR2943435B1 (fr) 2009-03-17 2012-01-27 Thales Sa Procedes de test integre d'une ligne.
CN102798787B (zh) * 2011-05-24 2014-12-10 宸鸿光电科技股份有限公司 电子设备及其断路检测系统与断路检测方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2707267A (en) * 1949-05-06 1955-04-26 Tobe Deutschmann Corp Fault locater
US4166974A (en) * 1978-01-23 1979-09-04 The United States Of America As Represented By The Secretary Of The Navy Apparatus and method for measuring capacitive energy
DE3406958A1 (de) 1984-02-25 1985-09-12 Telefunken electronic GmbH, 7100 Heilbronn Integrierte schaltungsanordnung
EP0489989B1 (de) * 1990-12-07 1996-01-24 Hewlett-Packard Company LAN-messgerät
US5610826A (en) * 1991-04-30 1997-03-11 Texas Instruments Incorporated Analog signal monitor circuit and method
US5696451A (en) * 1992-03-10 1997-12-09 Hewlett-Packard Co. Identification of pin-open faults by capacitive coupling
JP3563750B2 (ja) * 1992-10-16 2004-09-08 テキサス インスツルメンツ インコーポレイテツド アナログ回路のための走査に基づく試験
US5596587A (en) * 1993-03-29 1997-01-21 Teradyne, Inc. Method and apparatus for preparing in-circuit test vectors
DE4400194C1 (de) * 1994-01-05 1995-06-01 Siemens Ag Schaltungsanordnung zum Aufbereiten analoger Signale für ein Boundary-Scan-Prüfverfahren
US5539338A (en) * 1994-12-01 1996-07-23 Analog Devices, Inc. Input or output selectable circuit pin
KR100440366B1 (ko) 1995-10-20 2004-11-16 코닌클리케 필립스 일렉트로닉스 엔.브이. 테스트가능회로및테스트방법

Also Published As

Publication number Publication date
US20010013781A1 (en) 2001-08-16
JP2001523347A (ja) 2001-11-20
WO1999040448A1 (en) 1999-08-12
US6297643B2 (en) 2001-10-02
EP0972207A1 (de) 2000-01-19
JP4080550B2 (ja) 2008-04-23
EP0972207B1 (de) 2009-08-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition