DE69328049T2 - Optische Einrichtung zur parallelen Übertragung - Google Patents

Optische Einrichtung zur parallelen Übertragung

Info

Publication number
DE69328049T2
DE69328049T2 DE69328049T DE69328049T DE69328049T2 DE 69328049 T2 DE69328049 T2 DE 69328049T2 DE 69328049 T DE69328049 T DE 69328049T DE 69328049 T DE69328049 T DE 69328049T DE 69328049 T2 DE69328049 T2 DE 69328049T2
Authority
DE
Germany
Prior art keywords
optical device
parallel transmission
transmission
parallel
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69328049T
Other languages
English (en)
Other versions
DE69328049D1 (de
Inventor
Atsushi Takai
Hajime Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Opnext Japan Inc
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69328049D1 publication Critical patent/DE69328049D1/de
Publication of DE69328049T2 publication Critical patent/DE69328049T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/501—Structural aspects
    • H04B10/502—LED transmitters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission
    • H04B10/2589—Bidirectional transmission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
DE69328049T 1992-04-23 1993-04-20 Optische Einrichtung zur parallelen Übertragung Expired - Lifetime DE69328049T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10427892A JPH05300188A (ja) 1992-04-23 1992-04-23 光並列伝送装置

Publications (2)

Publication Number Publication Date
DE69328049D1 DE69328049D1 (de) 2000-04-20
DE69328049T2 true DE69328049T2 (de) 2000-12-21

Family

ID=14376463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69328049T Expired - Lifetime DE69328049T2 (de) 1992-04-23 1993-04-20 Optische Einrichtung zur parallelen Übertragung

Country Status (4)

Country Link
US (3) US5448661A (de)
EP (1) EP0567081B1 (de)
JP (1) JPH05300188A (de)
DE (1) DE69328049T2 (de)

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JPH05300188A (ja) * 1992-04-23 1993-11-12 Hitachi Ltd 光並列伝送装置
WO1994010595A1 (en) * 1992-10-23 1994-05-11 Monash University Confocal microscope and endoscope
US6012855A (en) * 1993-11-09 2000-01-11 Hewlett-Packard Co. Method and apparatus for parallel optical data link
US5644714A (en) 1994-01-14 1997-07-01 Elonex Plc, Ltd. Video collection and distribution system with interested item notification and download on demand
FR2722044B1 (fr) * 1994-07-01 1996-08-02 Thomson Csf Systeme d'interconnexion optique
JP2880927B2 (ja) * 1995-03-17 1999-04-12 日本電気株式会社 光ファイバネットワークシステム
US5592321A (en) * 1995-04-13 1997-01-07 Elbex Video, Ltd. Apparatus for selective routing of information signals
US5768460A (en) * 1995-10-03 1998-06-16 Siecor Corporation Low skew optical fiber ribbons
EP0773591A3 (de) * 1995-11-13 1998-09-16 Sumitomo Electric Industries, Ltd. Lichtemittierende und lichtdetektierende Vorrichtung
US5933564A (en) * 1995-11-22 1999-08-03 Litton Systems, Inc. Optical interconnection apparatus
JPH10271065A (ja) * 1997-03-21 1998-10-09 Sony Corp 光送受信装置
US5943455A (en) * 1997-04-18 1999-08-24 Lucent Technologies Inc. Method and apparatus for interfacing optical fibers from optical fiber ribbons and cables with an optical integrated circuit
US6288813B1 (en) 1998-03-25 2001-09-11 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Apparatus and method for effecting data transfer between data systems
JP3279259B2 (ja) 1998-08-07 2002-04-30 日本電気株式会社 並列伝送方法及びシステム
US6058229A (en) * 1998-10-05 2000-05-02 Lucent Technologies Inc. Long wavelength InGaAs photogenerator
KR100322579B1 (ko) * 1998-10-08 2002-03-08 윤종용 광 커넥터 모듈
US6725404B1 (en) * 2000-05-26 2004-04-20 International Business Machines Corporation Evaluation of interconnect reliability using propagation delay through interconnect
US6621949B2 (en) * 2001-03-14 2003-09-16 Adc Telecommunications, Inc. Fiber optic switch package and a method of assembling a fiber optic switch package having an inverted ring structure
US6975659B2 (en) * 2001-09-10 2005-12-13 Fuji Photo Film Co., Ltd. Laser diode array, laser device, wave-coupling laser source, and exposure device
US6798946B2 (en) * 2001-12-14 2004-09-28 Molex Incorporated Method to deskew parallel optical links
US7106973B2 (en) * 2002-08-13 2006-09-12 Lightpointe Communications, Inc. Apparatus and method for use in free-space optical communication comprising optically aligned components integrated on circuit boards
JP2004191392A (ja) * 2002-12-06 2004-07-08 Seiko Epson Corp 波長多重チップ内光インターコネクション回路、電気光学装置および電子機器
JP2005203553A (ja) * 2004-01-15 2005-07-28 Matsushita Electric Ind Co Ltd 光送受信モジュールおよび光送受信装置
US20080226298A1 (en) * 2004-02-17 2008-09-18 Nippon Telegraph And Telephone Corporation Optical Transmission System
US7548675B2 (en) * 2004-09-29 2009-06-16 Finisar Corporation Optical cables for consumer electronics
US7706692B2 (en) * 2004-09-29 2010-04-27 Finisar Corporation Consumer electronics with optical communication interface
US7575380B2 (en) * 2004-10-15 2009-08-18 Emcore Corporation Integrated optical fiber and electro-optical converter
US8412052B2 (en) * 2004-10-22 2013-04-02 Intel Corporation Surface mount (SMT) connector for VCSEL and photodiode arrays
KR100701123B1 (ko) * 2004-12-08 2007-03-28 한국전자통신연구원 자가 발진 통신 모듈
US20060228076A1 (en) * 2005-03-30 2006-10-12 Xerox Corporation Parallel optical interface
US7729618B2 (en) * 2005-08-30 2010-06-01 Finisar Corporation Optical networks for consumer electronics
US7860398B2 (en) 2005-09-15 2010-12-28 Finisar Corporation Laser drivers for closed path optical cables
US7712976B2 (en) * 2006-04-10 2010-05-11 Finisar Corporation Active optical cable with integrated retiming
US7778510B2 (en) * 2006-04-10 2010-08-17 Finisar Corporation Active optical cable electrical connector
US7876989B2 (en) * 2006-04-10 2011-01-25 Finisar Corporation Active optical cable with integrated power
US8083417B2 (en) * 2006-04-10 2011-12-27 Finisar Corporation Active optical cable electrical adaptor
US8769171B2 (en) 2007-04-06 2014-07-01 Finisar Corporation Electrical device with electrical interface that is compatible with integrated optical cable receptacle
US8244124B2 (en) 2007-04-30 2012-08-14 Finisar Corporation Eye safety mechanism for use in optical cable with electrical interfaces
DE112008003853T5 (de) * 2008-05-07 2011-04-07 Hewlett-Packard Development Co., L.P., Houston Optische Maschine für Punkt-zu-Punkt-Kommunikation
US8041229B2 (en) * 2008-12-12 2011-10-18 Fujitsu Limited System and method for optoelectrical communication
US8041230B2 (en) * 2008-12-12 2011-10-18 Fujitsu Limited System and method for optoelectrical communication
TWI371237B (en) * 2008-12-26 2012-08-21 Askey Computer Corp A framework of wireless network access device
US8582941B2 (en) * 2009-02-16 2013-11-12 Corning Cable Systems Llc Micromodule cables and breakout cables therefor
EP2365654B1 (de) * 2010-03-10 2019-05-29 Ofs Fitel Llc, A Delaware Limited Liability Company Mehrkerniges Faserübertragungssystem und -verfahren
EP2548056B1 (de) * 2010-03-16 2021-05-05 OFS Fitel, LLC Mehrkernübertragungs- und -verstärkerfasern sowie schemen zum einbringen von pumplicht in verstärkerkerne
US8903211B2 (en) * 2011-03-16 2014-12-02 Ofs Fitel, Llc Pump-combining systems and techniques for multicore fiber transmissions
US8882366B2 (en) 2011-12-07 2014-11-11 Finisar Corporation Chip identification pads for identification of integrated circuits in an assembly
US9146367B2 (en) * 2011-12-07 2015-09-29 Finisar Corporation Modular device for an optical communication module
TW201437706A (zh) * 2013-03-18 2014-10-01 Hon Hai Prec Ind Co Ltd 光纖元件
US10541754B2 (en) 2014-05-09 2020-01-21 Sumitomo Electric Lightwave Corp. Reduced fiber count networks, devices, and related methods
CN105319658A (zh) * 2015-11-13 2016-02-10 宁波环球广电科技有限公司 一种多通道并行的光收发器件
US9958620B2 (en) 2015-12-03 2018-05-01 Sei Optifrontier Co., Ltd. Optical fiber with connector
US10551309B2 (en) * 2016-07-22 2020-02-04 Comodo Security Solutions, Inc. Method and system to improve scheme of optical network cable and audio cable

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JPS6448011A (en) * 1987-08-18 1989-02-22 Sumitomo Electric Industries Optical cable
DE3818392A1 (de) * 1988-05-30 1989-12-14 Siemens Ag Verfahren zur versorgung von baugruppen mit synchronen signalen und einrichtung zum durchfuehren des verfahrens
GB8902745D0 (en) * 1989-02-08 1989-03-30 British Telecomm Optical interconnection network
US5221984A (en) * 1989-09-18 1993-06-22 Kabushiki Kaisha Toshiba Optical data transmission device with parallel channel paths for arrayed optical elements
GB9014639D0 (en) * 1990-07-02 1990-08-22 British Telecomm Optical component packaging
US5131061A (en) * 1991-02-13 1992-07-14 International Business Machines Corp. Modular active fiber optic coupler system
JPH05300188A (ja) * 1992-04-23 1993-11-12 Hitachi Ltd 光並列伝送装置

Also Published As

Publication number Publication date
EP0567081A2 (de) 1993-10-27
EP0567081B1 (de) 2000-03-15
EP0567081A3 (de) 1995-03-22
JPH05300188A (ja) 1993-11-12
US5715339A (en) 1998-02-03
US5568576A (en) 1996-10-22
DE69328049D1 (de) 2000-04-20
US5448661A (en) 1995-09-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: OPNEXT JAPAN,INC., YOKOHAMA, KANAGAWA, JP