DE69327440T2 - Direktkontakt-Bildsensor, eine Bildsensoreinheit und Verfahren zu deren Herstellung - Google Patents

Direktkontakt-Bildsensor, eine Bildsensoreinheit und Verfahren zu deren Herstellung

Info

Publication number
DE69327440T2
DE69327440T2 DE69327440T DE69327440T DE69327440T2 DE 69327440 T2 DE69327440 T2 DE 69327440T2 DE 69327440 T DE69327440 T DE 69327440T DE 69327440 T DE69327440 T DE 69327440T DE 69327440 T2 DE69327440 T2 DE 69327440T2
Authority
DE
Germany
Prior art keywords
image sensor
production
direct contact
sensor unit
contact image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69327440T
Other languages
German (de)
English (en)
Other versions
DE69327440D1 (de
Inventor
Masahiro Nakagawa
Tetsuro Nakamura
Shinji Fujiwara
Eiichiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4285759A external-priority patent/JPH06141129A/ja
Priority claimed from JP4327753A external-priority patent/JP2998468B2/ja
Priority claimed from JP5138225A external-priority patent/JPH06350066A/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69327440D1 publication Critical patent/DE69327440D1/de
Application granted granted Critical
Publication of DE69327440T2 publication Critical patent/DE69327440T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
    • H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
    • H04N1/0315—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors using photodetectors and illumination means mounted on separate supports or substrates or mounted in different planes
    • H04N1/0316—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors using photodetectors and illumination means mounted on separate supports or substrates or mounted in different planes illuminating the scanned image elements through the plane of the photodetector, e.g. back-light illumination
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
    • H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
    • H04N1/0313—Direct contact pick-up heads, i.e. heads having no array of elements to project the scanned image elements onto the photodectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Facsimile Heads (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE69327440T 1992-10-23 1993-10-22 Direktkontakt-Bildsensor, eine Bildsensoreinheit und Verfahren zu deren Herstellung Expired - Fee Related DE69327440T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4285759A JPH06141129A (ja) 1992-10-23 1992-10-23 完全密着型イメージセンサ及びユニット
JP4327753A JP2998468B2 (ja) 1992-12-08 1992-12-08 完全密着型イメージセンサユニット及び製造方法
JP5138225A JPH06350066A (ja) 1993-06-10 1993-06-10 完全密着型イメージセンサ及びその製造方法

Publications (2)

Publication Number Publication Date
DE69327440D1 DE69327440D1 (de) 2000-02-03
DE69327440T2 true DE69327440T2 (de) 2000-08-03

Family

ID=27317624

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69327440T Expired - Fee Related DE69327440T2 (de) 1992-10-23 1993-10-22 Direktkontakt-Bildsensor, eine Bildsensoreinheit und Verfahren zu deren Herstellung

Country Status (4)

Country Link
US (2) US5477047A (ko)
EP (1) EP0594195B1 (ko)
KR (1) KR0137398B1 (ko)
DE (1) DE69327440T2 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976910A (en) * 1995-08-30 1999-11-02 Nec Corporation Electronic device assembly and a manufacturing method of the same
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
US5736738A (en) * 1996-08-22 1998-04-07 Hewlett-Packard Company Apparatus for securing CCD board at a fixed position within a range of motion
JPH10112771A (ja) * 1996-10-04 1998-04-28 Ricoh Co Ltd 画像読取装置
US7747522B1 (en) 1996-12-09 2010-06-29 Walker Digital, Llc Method and apparatus for issuing and managing gift certificates
US6193155B1 (en) 1996-12-09 2001-02-27 Walker Digital, Llc Method and apparatus for issuing and managing gift certificates
US6330544B1 (en) 1997-05-19 2001-12-11 Walker Digital, Llc System and process for issuing and managing forced redemption vouchers having alias account numbers
JP2001024949A (ja) 1999-07-08 2001-01-26 Canon Inc 固体撮像装置及びそれを用いた撮像システム
KR20040033193A (ko) * 2002-10-11 2004-04-21 (주)그래픽테크노재팬 이미지 센서용 반도체 칩 패키지 및 제조 방법
KR100526193B1 (ko) * 2003-10-15 2005-11-03 삼성전자주식회사 다이 본더 설비 및 이를 이용한 반도체 칩 부착방법
DE10361650A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zu dessen Herstellung
JP2005205836A (ja) 2004-01-26 2005-08-04 Riso Kagaku Corp 孔版印刷装置
JP2007180844A (ja) * 2005-12-27 2007-07-12 Canon Inc 画像読取装置および画像形成装置
JP2017037871A (ja) * 2015-08-06 2017-02-16 住友電気工業株式会社 受光装置、受光装置を作製する方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56136076A (en) * 1980-03-26 1981-10-23 Hitachi Ltd Photoelectric converter
JPS60191548A (ja) * 1984-03-12 1985-09-30 Hitachi Ltd イメ−ジセンサ
FR2568060B1 (fr) * 1984-07-19 1989-01-13 Canon Kk Element detecteur d'image de grande dimension, photodetecteurs utilises dans cet element detecteur et procede de fabrication des photodetecteurs
JPS6154756A (ja) * 1984-08-25 1986-03-19 Fuji Electric Corp Res & Dev Ltd 密着型イメ−ジセンサ
JPS62144459A (ja) * 1985-12-19 1987-06-27 Ricoh Co Ltd 完全密着型センサ−
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
EP0296603A3 (en) * 1987-06-26 1989-02-08 Canon Kabushiki Kaisha Photoelectric converter
JPS6415970A (en) * 1987-07-09 1989-01-19 Canon Kk Image reading equipment
US5162644A (en) * 1988-03-14 1992-11-10 Hitachi, Ltd. Contact type image sensor having photoelectric conversion elements to reduce signal variation caused by luminous intensity variation of light source
KR910007142A (ko) * 1988-09-30 1991-04-30 미다 가쓰시게 박막 광트랜지스터와 그것을 사용한 광센서어레이
EP0393206B1 (en) * 1988-10-14 1996-05-08 Matsushita Electric Industrial Co., Ltd. Image sensor and method of producing the same
US5264393A (en) * 1988-11-25 1993-11-23 Fuji Photo Film Co., Ltd. Solid state image pickup device and method of manufacturing the same
DE69009259T2 (de) * 1989-02-02 1994-10-13 Matsushita Electric Ind Co Ltd Verfahren zum Zusammensetzen von Halbleiteranordnungen.
GB2262658B (en) * 1989-02-21 1993-09-29 Canon Kk Photoelectric converter
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
US5101099A (en) * 1990-06-15 1992-03-31 Fuji Xerox Co., Ltd. Image reading device with different reflectivity coefficients in a transparent layer and a substrate
EP0591862B1 (en) * 1992-10-02 1999-05-26 Matsushita Electric Industrial Co., Ltd. A semiconductor device, an image sensor device, and methods for producing the same

Also Published As

Publication number Publication date
US5556809A (en) 1996-09-17
EP0594195B1 (en) 1999-12-29
EP0594195A1 (en) 1994-04-27
KR940010359A (ko) 1994-05-26
DE69327440D1 (de) 2000-02-03
US5477047A (en) 1995-12-19
KR0137398B1 (ko) 1998-04-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee