DE69325853T2 - Verpackung und Zusammenbau von Infrarot-Bildaufnehmern - Google Patents
Verpackung und Zusammenbau von Infrarot-BildaufnehmernInfo
- Publication number
- DE69325853T2 DE69325853T2 DE69325853T DE69325853T DE69325853T2 DE 69325853 T2 DE69325853 T2 DE 69325853T2 DE 69325853 T DE69325853 T DE 69325853T DE 69325853 T DE69325853 T DE 69325853T DE 69325853 T2 DE69325853 T2 DE 69325853T2
- Authority
- DE
- Germany
- Prior art keywords
- packaging
- assembly
- imaging devices
- infrared imaging
- infrared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003331 infrared imaging Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/890,451 US5349234A (en) | 1992-05-29 | 1992-05-29 | Package and method for assembly of infra-red imaging devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69325853D1 DE69325853D1 (de) | 1999-09-09 |
DE69325853T2 true DE69325853T2 (de) | 2000-01-27 |
Family
ID=25396697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69325853T Expired - Fee Related DE69325853T2 (de) | 1992-05-29 | 1993-05-21 | Verpackung und Zusammenbau von Infrarot-Bildaufnehmern |
Country Status (4)
Country | Link |
---|---|
US (1) | US5349234A (de) |
EP (1) | EP0571907B1 (de) |
JP (1) | JPH0637338A (de) |
DE (1) | DE69325853T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5661336A (en) * | 1994-05-03 | 1997-08-26 | Phelps, Jr.; Douglas Wallace | Tape application platform and processes therefor |
FR2729757A1 (fr) * | 1995-01-20 | 1996-07-26 | Sofradir | Dispositif de detection d'ondes electromagnetiques, et notamment de rayonnements infra-rouges |
JPH08316354A (ja) * | 1995-05-12 | 1996-11-29 | Mitsubishi Electric Corp | 半導体式センサ |
DE69632228T2 (de) * | 1995-07-13 | 2005-04-14 | Eastman Kodak Co. | Bildsensor mit einem Trägergehäuse |
US6551845B1 (en) * | 1996-01-02 | 2003-04-22 | Micron Technology, Inc. | Method of temporarily securing a die to a burn-in carrier |
JP3309764B2 (ja) * | 1997-04-25 | 2002-07-29 | 松下電器産業株式会社 | ワイヤボンディング方法 |
US6329224B1 (en) * | 1998-04-28 | 2001-12-11 | Tessera, Inc. | Encapsulation of microelectronic assemblies |
DE10065624C2 (de) * | 2000-12-29 | 2002-11-14 | Hans Kragl | Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler |
US11048017B2 (en) * | 2016-08-26 | 2021-06-29 | Halliburton Energy Services, Inc. | Cooled optical apparatus, systems, and methods |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3104623A1 (de) * | 1981-02-10 | 1982-08-26 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zum befestigen von bauelementen mit flaechigen anschlusskontakten und bauelement hierfuer |
JPS5914652A (ja) * | 1982-07-16 | 1984-01-25 | Nec Corp | 半導体容器 |
JPS5976465A (ja) * | 1982-10-25 | 1984-05-01 | Fujitsu Ltd | 半導体素子の製造方法 |
JPS60110185A (ja) * | 1983-11-18 | 1985-06-15 | Matsushita Electric Ind Co Ltd | 光集積回路パッケ−ジ |
IL76014A0 (en) * | 1984-08-17 | 1985-12-31 | Honeywell Inc | Method for processing backside illuminated focal plane detector assembly |
JPS6170247U (de) * | 1984-10-05 | 1986-05-14 | ||
JPS627531A (ja) * | 1985-07-05 | 1987-01-14 | Asahi Chem Ind Co Ltd | 平面状印刷回路基板の圧着方法 |
US4953001A (en) * | 1985-09-27 | 1990-08-28 | Raytheon Company | Semiconductor device package and packaging method |
JPS6367792A (ja) * | 1986-09-09 | 1988-03-26 | Fujitsu Ltd | 光電子部品の実装構造 |
JPS6457661A (en) * | 1987-08-27 | 1989-03-03 | Toshiba Corp | Solid-state image sensing device and manufacture thereof |
JPH0198285A (ja) * | 1987-10-09 | 1989-04-17 | Nec Corp | モニタ付半導体発光素子 |
US4824511A (en) * | 1987-10-19 | 1989-04-25 | E. I. Du Pont De Nemours And Company | Multilayer circuit board with fluoropolymer interlayers |
US5025306A (en) * | 1988-08-09 | 1991-06-18 | Texas Instruments Incorporated | Assembly of semiconductor chips |
JP2796338B2 (ja) * | 1989-03-20 | 1998-09-10 | 株式会社日立製作所 | ラインセンサの製造方法 |
JPH02249269A (ja) * | 1989-03-23 | 1990-10-05 | Matsushita Electric Ind Co Ltd | 焦電型赤外線固体撮像装置とその製造方法 |
GB2231199A (en) * | 1989-04-12 | 1990-11-07 | Philips Electronic Associated | Forming semiconductor body structures with electrical connection on substrates |
JPH02299265A (ja) * | 1989-05-15 | 1990-12-11 | Fujitsu Ltd | 赤外線検知素子の製造方法 |
JPH02306660A (ja) * | 1989-05-22 | 1990-12-20 | Nec Corp | 固体撮像装置の製造方法 |
US5103290A (en) * | 1989-06-16 | 1992-04-07 | General Electric Company | Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip |
US4965702A (en) * | 1989-06-19 | 1990-10-23 | E. I. Du Pont De Nemours And Company | Chip carrier package and method of manufacture |
US4989067A (en) * | 1989-07-03 | 1991-01-29 | General Electric Company | Hybrid interconnection structure |
EP0421133B1 (de) * | 1989-09-06 | 1995-12-20 | Sanyo Electric Co., Ltd. | Herstellungsverfahren für eine biegsame photovoltaische Vorrichtung |
-
1992
- 1992-05-29 US US07/890,451 patent/US5349234A/en not_active Expired - Fee Related
-
1993
- 1993-05-21 EP EP93108300A patent/EP0571907B1/de not_active Expired - Lifetime
- 1993-05-21 DE DE69325853T patent/DE69325853T2/de not_active Expired - Fee Related
- 1993-05-31 JP JP5129209A patent/JPH0637338A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0571907B1 (de) | 1999-08-04 |
EP0571907A2 (de) | 1993-12-01 |
EP0571907A3 (de) | 1994-02-16 |
DE69325853D1 (de) | 1999-09-09 |
US5349234A (en) | 1994-09-20 |
JPH0637338A (ja) | 1994-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |